公开(公告)号：US07807073B2

公开(公告)日：2010-10-05

申请号：US11798797

申请日：2007-05-17

申请人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

发明人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC分类号： H01L23/58 ,  H01B1/22 ,  H05K3/02 ,  B22F1/00

CPC分类号： H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

摘要： A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 μm or less.

摘要翻译： 提供一种导体组合物，其能够在低温处理下容易地确保与Ag体积相同的电导率，使用该导体组合物的安装基板和利用导体组合物的安装结构。 在安装结构中，其中安装基板（10）的一个或多个电极（11）和一个或多个表面安装部件（20）通过导体组合物（30）连接，以及一个或多个表面布线（14） 所述安装基板（10），一个或多个内层布线（13）和一个或多个通孔导体（12）由所述导体组合物形成，所述导体组合物包含具有导电性的导电颗粒，并且所述导电颗粒由 结晶尺寸为10μm以下的低结晶性Ag填料。

公开(公告)号：US06601752B2

公开(公告)日：2003-08-05

申请号：US09801855

申请日：2001-03-09

申请人： Yukihiro Maeda ,  Yuji Ootani ,  Tetsuo Nakano ,  Takashi Nagasaka

发明人： Yukihiro Maeda ,  Yuji Ootani ,  Tetsuo Nakano ,  Takashi Nagasaka

IPC分类号： B23K2010

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/36 ,  B23K2101/42 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/78 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48611 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/8501 ,  H01L2224/85013 ,  H01L2224/85051 ,  H01L2224/85148 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85411 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/1225 ,  H05K3/4015 ,  H01L2924/01001 ,  H01L2924/01046 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： At the step of printing a wiring portion of a ceramic substrate with a conductive adhesive for mounting an IC chip or a part such as a capacitor other than the IC chip, a wire bonding pad made of gold is formed by the ball bonding method or the like at the portion of the wiring portion to be wire-bonded. After the pad was formed and before the conductive adhesive is printed, a heat treatment is performed to cause a thermal diffusion between the wiring portion and the pad to improve the jointability therebetween.

摘要翻译： 在使用用于安装IC芯片的导电粘合剂或除了IC芯片之外的诸如电容器的部件之类的印刷陶瓷基板的布线部分的步骤中，由金焊接方法或 类似于待接线的布线部分的部分。 在形成焊盘并且在导电粘合剂被印刷之前，进行热处理以在布线部分和焊盘之间引起热扩散以提高它们之间的可接合性。

公开(公告)号：US06326239B1

公开(公告)日：2001-12-04

申请号：US09287016

申请日：1999-04-06

申请人： Yasutomi Asai ,  Hirokazu Imai ,  Yuji Ootani ,  Takashi Nagasaka

发明人： Yasutomi Asai ,  Hirokazu Imai ,  Yuji Ootani ,  Takashi Nagasaka

IPC分类号： H01L2328

CPC分类号： H01L23/544 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/245 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10992 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A mounting structure includes a laminated ceramic capacitor mounted on a mounting substrate. The laminated ceramic capacitor includes a main body chip made by a ceramic dielectric, internal layer electrodes, and pair of terminal electrodes. The mounting substrate is made by alumina substrate, and has a pair of substrate electrodes made by copper plating. The laminated ceramic capacitor is mounted on the mounting substrate by using an Ag paste. Here, the substrate electrode is set to be smaller than the Ag paste. That is, the Ag paste is extruded from the terminal electrodes and the substrate electrode so as to contact to both of the main body chip and the mounting substrate. Because the Ag paste has a high adhesive strength compared to that when it is bonded with a metal, total adhesive strength can be improved. Consequently, the reliability of mounting can be improved.

摘要翻译： 安装结构包括安装在安装基板上的层叠陶瓷电容器。 层叠陶瓷电容器包括由陶瓷电介质制成的主体芯片，内层电极和一对端子电极。 安装基板由氧化铝基板制成，并具有通过镀铜制成的一对基板电极。 层叠陶瓷电容器通过使用Ag浆料安装在安装基板上。 这里，将基板电极设定为小于Ag糊料。 也就是说，Ag膏从端子电极和基板电极挤出，以便与主体芯片和安装基板接触。 由于Ag糊料与金属粘合时的粘合强度高，所以可以提高总的粘合强度。 因此，可以提高安装的可靠性。

公开(公告)号：US07276185B2

公开(公告)日：2007-10-02

申请号：US10969320

申请日：2004-10-21

申请人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

发明人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC分类号： H01B1/22 ,  B32B15/01 ,  B32B27/14

CPC分类号： H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

摘要： A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

摘要翻译： 提供一种导体组合物，其能够在低温处理下容易地确保与Ag体积相同的电导率，使用该导体组合物的安装基板和利用导体组合物的安装结构。 在安装结构中，其中安装基板（10）的一个或多个电极（11）和一个或多个表面安装部件（20）通过导体组合物（30）连接，以及一个或多个表面布线（14） 所述安装基板（10），一个或多个内层布线（13）和一个或多个通孔导体（12）由所述导体组合物形成，所述导体组合物包含具有导电性的导电颗粒，并且所述导电颗粒由 结晶尺寸为10nm以下的低结晶性Ag填料。

公开(公告)号：US06174462B1

公开(公告)日：2001-01-16

申请号：US09233153

申请日：1999-01-19

申请人： Kengo Oka ,  Takashi Nagasaka ,  Yuji Ootani ,  Kazumasa Naito ,  Masayuki Miyairi

发明人： Kengo Oka ,  Takashi Nagasaka ,  Yuji Ootani ,  Kazumasa Naito ,  Masayuki Miyairi

IPC分类号： H01B102

CPC分类号： H05K3/28 ,  C03C8/02 ,  C03C8/10 ,  C03C8/24 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K2201/017 ,  H05K2201/0769 ,  H01L2924/00

摘要： A circuit board comprises wiring parts containing silver on a substrate, and a conductivity suppressing agent such as a potassium compound provided between the wiring parts, for preventing the silver attached on the substrate between the wiring parts from being conductive. Therefore, the insulation deterioration between the wiring parts can be suitably suppressed, which usually occurs when a voltage is applied between the wiring parts containing silver on the substrate under a high temperature atmosphere, irrespective of the presence or absence of water or water vapor. That is, the high temperature leakage phenomenon can be suitably suppressed.

摘要翻译： 电路板包括在基板上含有银的布线部分和设置在布线部分之间的诸如钾化合物的导电性抑制剂，以防止在布线部分之间附着在基板上的银导电。 因此，无论存在或不存在水或水蒸气，都可以适当地抑制布线部分之间的绝缘劣化，这通常在高温气氛下在基板上包含银的布线部分之间施加电压时发生。 也就是说，可以适当地抑制高温泄漏现象。

公开(公告)号：US06731001B2

公开(公告)日：2004-05-04

申请号：US09918803

申请日：2001-08-01

申请人： Kan Kinouchi ,  Mitsuhiro Saitou ,  Takashi Nagasaka ,  Yuji Ootani ,  Hiroyuki Yamakawa ,  Koji Takeuchi ,  Hirokazu Imai ,  Yukihiro Maeda ,  Atsushi Kanamori

发明人： Kan Kinouchi ,  Mitsuhiro Saitou ,  Takashi Nagasaka ,  Yuji Ootani ,  Hiroyuki Yamakawa ,  Koji Takeuchi ,  Hirokazu Imai ,  Yukihiro Maeda ,  Atsushi Kanamori

IPC分类号： H01L2352

CPC分类号： H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/20753 ,  H01L2924/2076 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/284 ,  H05K3/366 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/92247 ,  H01L2924/00

摘要： Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts and the bonding wires are covered with an enclosing member on every ceramic substrate, and an inside of the enclosing member is filled with silicone gel for sealing. The ceramic substrates are bonded to a radiation fin together, and are mounted on a motherboard perpendicularly to the motherboard.

摘要翻译： 几个电子部件安装在半导体器件中的多个陶瓷基板上，并且通过接合线引线接合到相应的陶瓷基板。 电子部件和接合线在每个陶瓷基板上被封闭构件覆盖，并且封装构件的内部填充有用于密封的硅凝胶。 陶瓷基板一起结合到散热片上，并垂直于母板安装在母板上。

公开(公告)号：US20070224511A1

公开(公告)日：2007-09-27

申请号：US11798797

申请日：2007-05-17

申请人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

发明人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC分类号： H01M4/62

CPC分类号： H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

摘要： A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

公开(公告)号：US20050127536A1

公开(公告)日：2005-06-16

申请号：US10969320

申请日：2004-10-21

申请人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

发明人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC分类号： C09J9/02 ,  C09J11/04 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/58 ,  H05K1/09 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46

CPC分类号： H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

摘要： A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

摘要翻译： 提供一种导体组合物，其能够在低温处理下容易地确保与Ag体积相同的电导率，使用该导体组合物的安装基板和利用导体组合物的安装结构。 在安装结构中，其中安装基板（10）的一个或多个电极（11）和一个或多个表面安装部件（20）通过导体组合物（30）连接，以及一个或多个表面布线（14） 所述安装基板（10），一个或多个内层布线（13）和一个或多个通孔导体（12）由所述导体组合物形成，所述导体组合物包含具有导电性的导电颗粒，并且所述导电颗粒由 结晶尺寸为10nm以下的低结晶性Ag填料。