Abstract:
A system for dispensing hot melt adhesives, comprising an adhesive dispenser including a fluid passage leading to an outlet. The system further comprises a supply conduit fluidly connected to the fluid passage and a feeding mechanism configured to feed an elongate, flexible element of solid adhesive into the supply conduit. The system further comprises a first heating element positioned along at least a portion of the supply conduit to melt a portion of the elongate, flexible element being fed into the supply conduit and thereby form a supply of liquid adhesive within the supply conduit.
Abstract:
An adhesive dispensing device includes a heater unit for melting adhesive, a fill system communicating with a receiving space for feeding the heater unit, and a reservoir for receiving melted adhesive from the heater unit. The dispensing device also includes a capacitive level sensor located along a sidewall of the receiving space such that the level of adhesive in the receiving space can be detected by sensing the difference in dielectric capacitance where the adhesive is located compared to where air acts as the dielectric. The size of the driven electrode produces a broader sensing window capable of generating multiple control signals corresponding to different fill levels of adhesive. The receiving space and reservoir are minimized in size so that adhesive is not held at elevated temperatures long enough to char or degrade.
Abstract:
Systems, feeder devices and methods for moving particulate hot melt adhesive from an adhesive supply to an adhesive melter. A feeder device includes a body having an inlet and an outlet, and an interior communicating with the inlet and the outlet. The inlet is configured to receive particulate hot melt adhesive from an outlet of the adhesive supply, and the outlet is configured to provide particulate hot melt adhesive to an inlet of the adhesive melter. The feeder device further includes a mechanical agitator positioned in the interior for urging the particulate hot melt adhesive in a flow direction toward the outlet.
Abstract:
Exemplary pressurization and coating systems, methods, and apparatuses are described herein. In certain embodiments, pressurization systems, methods, and apparatuses are used in conjunction with coating systems, methods, and apparatuses to control pressure about a substrate after a coating material is applied to a surface of the substrate. An exemplary system includes a die tool configured to apply a coating material to a substrate passing through the die tool and a pressurization apparatus attached to the die tool and forming a pressurization chamber. The pressurization apparatus is configured to receive the substrate from the die tool and control pressure about the substrate in the pressurization chamber. In certain embodiments, the die tool forms a coating chamber and is configured to apply the coating material on at least one surface of the substrate in the coating chamber.
Abstract:
An adhesive dispensing device includes a heater unit for melting adhesive material, a receiving space for feeding the heater unit, and a cyclonic separator unit for delivering adhesive pellets to the receiving space. The cyclonic separator unit includes a tangential inlet pipe proximate to a top end of a generally cylindrical pipe, which is connected to the receiving space at an open bottom end. The tangential or spiral flow of air and adhesive pellets generated through the cyclonic separator unit reduces the speed of the air and adhesive pellets to avoid splashing of molten adhesive material while maintaining enough speed to avoid adhesive build up on the generally cylindrical pipe.
Abstract:
A melt system capable of heating hot melt pellets into a liquid includes a melter including a body, a chamber, a collector, channels, and a heater. The thermally conductive body forms an interior with a surface area. The chamber is at an upper end of the body for receiving the pellets. The collector is within the body and located below the chamber for receiving the liquid from the melted pellets. The channels extend between the chamber and the collector to increase the surface area of the interior, and the walls of the channels form heat exchange surfaces. The heater is for transferring heat to the body.
Abstract:
An exemplary plural component heater assembly includes a plurality of heater modules each having a plurality of bores forming at least a first component path and a second component path, and at least one heating element receptacle configured to receive a heating element for heating the first and second component paths.
Abstract:
A heat exchange system 62 includes heat exchangers 69a and 69b that heat or cool a fluid passing therethrough; a fluid supply unit 81 that supplies the heating target fluid or the cooling target fluid into lower portions thereof; and a fluid discharge unit 82 that discharges the heated fluid or the cooled fluid from upper portions thereof. The fluid supply unit includes inlet lines 85 and 86 through which the fluid is introduced; a first manifold 87 located above the upper end portion of the heat exchangers and connected with the inlet lines; a gas exhaust line 88 that is connected to the first manifold and exhausts a gas mixed in the fluid; a supply line 89 that supplies the fluid from the first manifold. While passing through the heat exchangers from the lower portions toward the upper portions thereof, the fluid is heated or cooled.
Abstract:
A system for hot application of an adhesive composition, comprising an in-line heating device and a corresponding method for hot application of the adhesive composition. The system comprises: an application nozzle for applying the adhesive composition; a supply line for supplying the nozzle with the adhesive composition to be applied in fluid form; a in-line heating device for heating of the adhesive composition to an application temperature, the heating device comprising: a static mixture including an electrically conducting material, and an inductive cable surrounding the static mixer.
Abstract:
A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange further includes a heating element for heating the liquid adhesive material flowing through the thin slit section to the application temperature.