公开(公告)号：US20230380764A1

公开(公告)日：2023-11-30

申请号：US18205813

申请日：2023-06-05

申请人： ENDOTRONIX, INC.

发明人： Harry ROWLAND ,  Michael NAGY ,  Balamurugan SUNDARAM ,  Suresh SUNDARAM

IPC分类号： A61B5/00 ,  A61B5/0215 ,  A61B5/07 ,  G01L19/06 ,  G01L9/00 ,  H05K9/00 ,  B81B3/00 ,  G01L19/00 ,  B81C1/00

CPC分类号： A61B5/686 ,  A61B5/0215 ,  A61B5/076 ,  G01L19/0618 ,  G01L9/0042 ,  H05K9/0024 ,  B81B3/0035 ,  G01L19/0038 ,  B81C1/00261 ,  A61B2562/0247 ,  A61B2562/168 ,  B81C2203/0109 ,  H05K2201/10151 ,  H05K2201/10371 ,  B81B2201/0264 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/075

摘要： A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.

公开(公告)号：US20180273377A1

公开(公告)日：2018-09-27

申请号：US15920759

申请日：2018-03-14

申请人： Invensas Bonding Technologies, Inc.

发明人： Rajesh KATKAR ,  Liang WANG ,  Cyprian Emeka UZOH ,  Shaowu HUANG ,  Guilian GAO ,  Ilyas MOHAMMED

IPC分类号： B81C1/00 ,  B81B7/00

CPC分类号： B81C1/00333 ,  B81B7/0032 ,  B81B7/0074 ,  B81C1/00261 ,  B81C1/00269 ,  B81C2203/038 ,  H01L23/02 ,  H01L23/04 ,  H01L23/053 ,  H01L23/10

摘要： Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.

公开(公告)号：US10073113B2

公开(公告)日：2018-09-11

申请号：US14695421

申请日：2015-04-24

申请人： Analog Devices, Inc.

发明人： Xin Zhang ,  Michael Judy

IPC分类号： G01P15/08 ,  B81C1/00 ,  H01L21/48 ,  G01C19/5769

CPC分类号： G01P15/0802 ,  B81B3/0059 ,  B81B3/0078 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00261 ,  B81C2203/0109 ,  G01C19/5769

摘要： In one aspect, the disclosure is directed to a MEMS device. The MEMS device includes a silicon-based movable MEMS sensor element. The MEMS device also includes a plurality of wells formed into at least one surface of the movable MEMS sensor element. Each well is filled with at least one metal so as to increase the effective mass of the movable MEMS sensor element. The metal may be tungsten or tantalum, or an alloy with tungsten or tantalum.

公开(公告)号：US09617147B2

公开(公告)日：2017-04-11

申请号：US14685309

申请日：2015-04-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chia-Hua Chu ,  Chun-Wen Cheng ,  Jiou-Kang Lee ,  Kai-Chih Liang ,  Chung-Hsien Lin ,  Te-Hao Lee

IPC分类号： H01L21/00 ,  B81C1/00

CPC分类号： B81C1/00269 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2203/0307 ,  B81B2207/012 ,  B81C1/00039 ,  B81C1/00261 ,  B81C2203/035

摘要： Exemplary microelectromechanical system (MEMS) devices, and methods for fabricating such are disclosed. An exemplary method includes providing a silicon-on-insulator (SOI) substrate, wherein the SOI substrate includes a first silicon layer separated from a second silicon layer by an insulator layer; processing the first silicon layer to form a first structure layer of a MEMS device; bonding the first structure layer to a substrate; and processing the second silicon layer to form a second structure layer of the MEMS device.

公开(公告)号：US09508663B2

公开(公告)日：2016-11-29

申请号：US13950178

申请日：2013-07-24

申请人： Invensense, Inc.

发明人： Brian H. Kim ,  Haijun She ,  Mozafar Maghsoudnia

IPC分类号： H01L23/00 ,  B81C1/00 ,  B81B3/00 ,  B81B7/00

CPC分类号： B81C1/0023 ,  B81B3/001 ,  B81B7/0032 ,  B81B7/007 ,  B81B2207/012 ,  B81B2207/093 ,  B81C1/00238 ,  B81C1/00261 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/05 ,  B81C2203/0792 ,  H01L24/04 ,  H01L24/06 ,  H01L24/75

摘要： A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.

摘要翻译： 微电子机械系统（MEMS）器件包括衬底上的焊料凸块，包括CMOS管芯和MEMS管芯的CMOS-MEMS管芯，以及CMOS管芯上的突起凸块。 MEMS管芯设置在CMOS管芯和衬底之间。 柱形凸块和焊料凸块被定位成在CMOS管芯和衬底之间提供电连接。

公开(公告)号：US09227836B2

公开(公告)日：2016-01-05

申请号：US14790643

申请日：2015-07-02

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Virgil C. Ararao

IPC分类号： B81B7/00 ,  H01L23/08 ,  H01L23/043 ,  H01L23/053 ,  H01L23/10 ,  H01L23/18 ,  H01L23/495 ,  H01L23/498

CPC分类号： B81B7/0038 ,  B81B7/0032 ,  B81B7/0064 ,  B81C1/00261 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/019 ,  H01L23/043 ,  H01L23/053 ,  H01L23/08 ,  H01L23/10 ,  H01L23/18 ,  H01L23/4952 ,  H01L23/49811 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/00

摘要： A hermetically packaged microelectromechanical system (MEMS) device has a substrate with an assembly pad (101) and a plurality of terminals (102); a chip (110) with a MEMS mechanical element (111) of a first height (111a) assembled on the pad and connected to the terminals by wires (120) with an insulating coat (121); a ridge (130) on the substrate, which surrounds the MEMS element (111) with a second height (130c) greater than the first height and comprises a plastic compound (131) filled with particles (132) and a surface (130a, 130b) having an adhering moisture-impermeable seal layer (133); and a moisture-impervious lid (140) attached to the ridge by moisture-proof bonds (150, 151), sealing the volume (160) enclosed by the lid, the chip, and the metalized ridge as a hermetic space for the MEMS element (111).

公开(公告)号：US20150343575A1

公开(公告)日：2015-12-03

申请号：US14821459

申请日：2015-08-07

申请人： DunAn Sensing LLC

发明人： TOM T. NGUYEN

IPC分类号： B23P11/00 ,  G01D11/24 ,  G01D11/26 ,  B23P19/04

CPC分类号： G01D11/245 ,  B23P11/005 ,  B81B7/0032 ,  B81B2201/0264 ,  B81C1/00261 ,  B81C1/00325 ,  B81C3/00 ,  B81C3/008 ,  B81C2203/019 ,  G01D11/26 ,  G01L5/165 ,  G01L19/0672 ,  G01L19/14 ,  G01L19/145 ,  G12B9/06 ,  H01L23/10 ,  Y10T29/49872 ,  Y10T29/49874 ,  Y10T29/49913 ,  Y10T29/49915

摘要： Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.

公开(公告)号：US20150325492A1

公开(公告)日：2015-11-12

申请号：US14698436

申请日：2015-04-28

申请人： Sensirion AG

发明人： Werner HUNZIKER

IPC分类号： H01L23/31 ,  H01L23/29 ,  H01L21/302 ,  H01L21/56

CPC分类号： H01L23/3185 ,  B81B7/0016 ,  B81C1/00261 ,  B81C1/00777 ,  B81C1/00896 ,  H01L21/302 ,  H01L21/561 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor package comprises an integrated device, a front side of a material A and a back side of a material B opposite to the front side. Side walls link the front side and the back side. Each side wall is coated with a coating material to at least 80% of its area, wherein the coating material is different from the material A and different from the material B.

摘要翻译： 半导体封装包括集成器件，材料A的正面和与正面相反的材料B的背面。 侧壁连接前侧和后侧。 每个侧壁涂覆有至少80％的涂层材料，其中涂层材料与材料A不同，不同于材料B.

公开(公告)号：US09162871B1

公开(公告)日：2015-10-20

申请号：US13969052

申请日：2013-08-16

申请人： Amkor Technology, Inc.

发明人： Bob Shih-Wei Kuo ,  Russell Shumway ,  Louis B. Troche, Jr.

IPC分类号： H01L29/84 ,  B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0032 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/0074 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/09 ,  B81C1/00261 ,  B81C1/00269 ,  B81C2203/01 ,  B81C2203/0109 ,  B81C2203/0154 ,  B81C2203/0163 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48111 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/00

摘要： A metal mesh lid MEMS package includes a substrate, a MEMS electronic component coupled to the substrate, and a metal mesh lid coupled to the substrate with a lid adhesive. The metal mesh lid includes a polymeric lid body having a top port formed therein and a metal mesh cap coupled to the lid body. The metal mesh cap covers the top port and serves as both a particulate filter and a continuous conductive shield for EMI/RF interferences. Further, the metal mesh cap provides a locking feature for the lid adhesive to maximize the attach strength of the metal mesh lid to the substrate.

摘要翻译： 金属网盖MEMS封装包括衬底，耦合到衬底的MEMS电子部件和用盖粘合剂耦合到衬底的金属网盖。 金属网盖包括聚合物盖体，其具有形成在其中的顶部端口和联接到盖体的金属网罩。 金属网罩覆盖顶部端口，既用于颗粒过滤器又可用于EMI / RF干扰的连续导电屏蔽。 此外，金属网盖为盖粘合剂提供了锁定特征，以最大化金属网盖对基底的附着强度。

公开(公告)号：US09029204B2

公开(公告)日：2015-05-12

申请号：US14000780

申请日：2011-03-18

申请人： Yasuhiro Horimoto ,  Yusuke Nakagawa ,  Tadashi Inoue ,  Toshiyuki Takahashi

发明人： Yasuhiro Horimoto ,  Yusuke Nakagawa ,  Tadashi Inoue ,  Toshiyuki Takahashi

IPC分类号： H01L21/00 ,  B81C1/00 ,  H01L21/58 ,  H01L21/304 ,  H04R19/00 ,  H04R31/00 ,  H01L21/50

CPC分类号： B81C1/00261 ,  H01L21/304 ,  H01L21/50 ,  H01L24/80 ,  H04R19/005 ,  H04R31/00 ,  H04R2201/003

摘要： A method for manufacturing a semiconductor device is provided, the method comprising: fabricating a semiconductor element on a semiconductor substrate; joining a surface of the semiconductor substrate to a support member, the surface being on a side where the semiconductor element is fabricated; and polishing a surface on an opposite side of the surface of the semiconductor substrate where the semiconductor element is fabricated and reducing a thickness of the semiconductor substrate, in a state where the semiconductor substrate and the support member are joined.

摘要翻译： 提供一种制造半导体器件的方法，所述方法包括：在半导体衬底上制造半导体元件; 将所述半导体衬底的表面接合到支撑构件，所述表面位于制造所述半导体元件的一侧; 并且在半导体衬底和支撑构件接合的状态下抛光半导体衬底的制造半导体元件的表面的相对侧上的表面并减小半导体衬底的厚度。