公开(公告)号：US2695594A

公开(公告)日：1954-11-30

申请号：US28970152

申请日：1952-05-23

申请人： UNITED STATES STEEL CORP

发明人： FAIRBURN A JOHN B

IPC分类号： C25D17/04

CPC分类号： C25D17/04

公开(公告)号：US12006584B2

公开(公告)日：2024-06-11

申请号：US17931965

申请日：2022-09-14

申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Haruki Kondoh ,  Koji Inagaki ,  Keiji Kuroda ,  Kazuaki Okamoto

IPC分类号： C25D17/10 ,  C25D17/00 ,  C25D17/04 ,  C25D21/02 ,  C25D21/12

CPC分类号： C25D17/10 ,  C25D17/002 ,  C25D17/04 ,  C25D21/02 ,  C25D21/12

摘要： A film formation apparatus includes an anode, a solid electrolyte membrane between the anode and a substrate, a power supply that applies voltage between the anode and the substrate as a cathode, and a liquid reservoir that holds the anode and the solid electrolyte membrane while separating them apart from each other, the liquid reservoir storing electrolyte solution including metal ions between the anode and the solid electrolyte membrane. The solid electrolyte membrane includes a central portion that comes in contact with the substrate and the electrolyte solution, and an outer edge portion outside the central portion. The apparatus includes a membrane tensioning mechanism to apply a tensile force to the central portion toward the outer edge portion while storing the heated electrolyte solution in the liquid reservoir, to elongate the central portion.

公开(公告)号：US11739434B2

公开(公告)日：2023-08-29

申请号：US16739569

申请日：2020-01-10

申请人： Applied Materials, Inc.

发明人： Cameron Law ,  Daniel Durado ,  Thomas Oberlitner

IPC分类号： C25D17/02 ,  C25D7/12 ,  H01L21/288 ,  H01L21/67 ,  H01L21/768 ,  C25D17/04 ,  C25D21/10 ,  C25D17/00 ,  C25D21/12

CPC分类号： C25D17/02 ,  C25D7/12 ,  C25D17/04 ,  C25D21/10 ,  H01L21/288 ,  H01L21/6723 ,  H01L21/76873 ,  C25D17/001 ,  C25D21/12

摘要： Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

公开(公告)号：US11713514B2

公开(公告)日：2023-08-01

申请号：US16987105

申请日：2020-08-06

申请人： Hutchinson Technology Incorporated

发明人： Douglas P. Riemer ,  Stephen P. Toperzer ,  Donovan D. Turvold ,  Christopher R. Rosenau ,  Dylan S. Johnson

IPC分类号： C25D17/04 ,  C25D3/22 ,  C25D3/38

CPC分类号： C25D17/04 ,  C25D3/22 ,  C25D3/38

摘要： A system for electroplating a web of conductive material with a source material comprises a transport mechanism, an electrical contact, a plating bath, and at least one nozzle. The transport mechanism transports the web through the system. The electrical contact electrically engages the web to cause current to flow into the web. The plating bath contains a volume of an electrically conductive liquid contain ions of the source material. The nozzle is configured to flow a low electrical conductivity fluid onto the web. A portion of the web is immersed in the electrically conductive liquid. The current flowing in the web causes the ions of the source material in the electrically conductive liquid to attach to a surface of the portion of the web.

公开(公告)号：US20180209057A1

公开(公告)日：2018-07-26

申请号：US15744022

申请日：2016-07-15

申请人： BATTELLE ENERGY ALLIANCE, LLC

发明人： Prabhat K. TRIPATHY ,  Guy L. FREDRICKSON ,  Eric J. DUFEK ,  Laura A. WURTH ,  J. Stephen HERRING

IPC分类号： C25D3/66 ,  C25D21/12 ,  C25D21/02 ,  C25D3/44 ,  C25D17/10 ,  C25D5/50

CPC分类号： C25D3/66 ,  C25D3/44 ,  C25D5/50 ,  C25D17/04 ,  C25D17/10 ,  C25D21/02 ,  C25D21/12

摘要： Systems and methods for coating a metallic component are provided. In one embodiment, a metallic coating may be disposed in a plating bath comprising AlBr3. The metallic coating may be coupled with, or configured as, a working electrode. A counter electrode formed of aluminum may be disposed within the plating bath. An electric current may be applied between the two electrodes resulting in the electrodeposition of aluminum on the metallic component. In one particular embodiment, the plating bath may include LiBr, KBr and CsBr, with AlBr3 being present in an amount of approximately 80 percent or greater by weight. Various types of metals may be coated with aluminum using embodiments of the present disclosure. Additionally, the methods and systems described herein are amenable to coating of complex geometries.

公开(公告)号：US20160369421A1

公开(公告)日：2016-12-22

申请号：US15118036

申请日：2015-02-05

申请人： EBARA CORPORATION

发明人： Mitsutoshi YAHAGI ,  Masaaki KIMURA ,  Junichiro TSUJINO

IPC分类号： C25D17/10 ,  C25D17/04 ,  C25D17/06 ,  C25D17/00

CPC分类号： C25D17/10 ,  C25D17/00 ,  C25D17/001 ,  C25D17/002 ,  C25D17/04 ,  C25D17/06

摘要： To provide an anode holder and a plating apparatus including the same, the anode holder being configured to prevent additives and black films from spreading by moving between an internal space in which an anode is provided and an external space.An anode holder 60 according to the present invention includes: an internal space 61 that houses an anode therein; a diaphragm configured so as to cover a front face of the internal space 61; a hole 71 that is formed on an external surface of the anode holder and which communicates with the internal space 61; and a valve 91 that seals the hole 71 shut.

摘要翻译： 根据本发明的阳极保持器60包括：内部容纳阳极的内部空间61; 隔膜，其构造成覆盖所述内部空间61的前表面; 孔71，形成在阳极保持件的外表面上并与内部空间61连通; 以及密封孔71关闭的阀91。

公开(公告)号：US20160032476A1

公开(公告)日：2016-02-04

申请号：US14715608

申请日：2015-05-19

申请人： MIN AIK PRECISION INDUSTRIAL CO., LTD.

发明人： Yu-Cheng Su ,  Chun-Yang Chang

IPC分类号： C25D3/48 ,  C25D7/04 ,  C25D21/00

CPC分类号： C25D5/022 ,  C25D3/12 ,  C25D3/48 ,  C25D7/04 ,  C25D17/00 ,  C25D17/004 ,  C25D17/04

摘要： The electroplating equipment disposes a hollow first ring between a first mold and a through hole of a workpiece, and a hollow second ring between a second mold and the through hole of the workpiece, such that the first ring and the second ring provide substantially equivalent channel as the openings of the through hole when the first mold and the second mold are set to hold tight the workpiece. The first ring and the second ring, along with an injection channel of the first mold and a recycling channel of the second mold and the through hole of the workpiece, form a seamless flow channel for an electroplating fluid to flow and be electroplated on the wall of the through hole.

摘要翻译： 电镀设备在第一模具和工件的通孔之间设置中空的第一环，并且在第二模具和工件的通孔之间设置中空的第二环，使得第一环和第二环提供基本相等的通道 当第一模具和第二模具被设置成夹持工件时，作为通孔的开口。 第一环和第二环以及第一模具的注入通道和第二模具的再循环通道和工件的通孔形成用于电镀流体流动并电镀在壁上的无缝流动通道 的通孔。

公开(公告)号：US08469042B2

公开(公告)日：2013-06-25

申请号：US12845934

申请日：2010-07-29

申请人： Ralf Jankowski

发明人： Ralf Jankowski

IPC分类号： B08B3/00

CPC分类号： B65G49/0459 ,  B65G45/10 ,  C25D17/04

摘要： A treatment system for the surface treatment of workpieces, particularly vehicle bodies, includes a plurality of transport devices, on which at least one workpiece to be treated can be attached in a releasable manner. A conveying device moves the transport devices through the treatment system. At least one treatment bath is disposed in a first conveying plane of the treatment system and the transport devices with the workpieces arranged thereon are introduced into the treatment bath. At least one cleaning device, which is suitable and designed for cleaning the transport devices after the surface treatment of the workpieces, is disposed in a second conveying plane of the treatment system. The second conveying plane is offset in the vertical direction relative to the first conveying plane.

摘要翻译： 用于表面处理工件，特别是车体的处理系统包括多个输送装置，待处理的至少一个工件可以以可释放方式附接到该处理系统上。 输送装置使运输装置移动通过处理系统。 在处理系统的第一输送平面中设置至少一个处理槽，并且将其上布置有工件的输送装置引入处理槽。 至少一个适于和设计用于在工件的表面处理之后清洁运输装置的清洁装置设置在处理系统的第二输送平面中。 第二输送平面相对于第一输送平面在垂直方向偏移。

公开(公告)号：US08252154B2

公开(公告)日：2012-08-28

申请号：US12913782

申请日：2010-10-28

申请人： Chien-Pang Cheng

发明人： Chien-Pang Cheng

IPC分类号： C25D17/06 ,  C25D17/08

CPC分类号： C25D17/04

摘要： An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in the tank from the first supporting bar, and the first holding element is configured for holding a plate-shaped workpiece in a manner that the workpiece is oriented along the first supporting bar. The second holding elements are suspended from the corresponding crossbars, each of the second holding elements arranged between the first and one of the second supporting bars and configured for holding a metal block. The power supply includes a cathode for electrical connection to the workpiece through the first supporting bar and the first holding element and an anode for electrically connection to the metal blocks through the second supporting bars and the second holding elements.

摘要翻译： 电镀设备包括电镀槽，第一支撑杆，第一保持元件，两个第二支撑杆，多个隔开的横梁，多个第二保持元件和电源。 第一保持元件从第一支撑杆悬挂在箱中，并且第一保持元件构造成用于沿着第一支撑杆定位工件以保持板状工件。 第二保持元件从相应的横梁悬挂，每个第二保持元件布置在第一和第二支撑杆之间，并且构造成用于保持金属块。 电源包括用于通过第一支撑杆和第一保持元件与工件电连接的阴极和用于通过第二支撑杆和第二保持元件电连接到金属块的阳极。

公开(公告)号：US20120064188A1

公开(公告)日：2012-03-15

申请号：US13302098

申请日：2011-11-22

申请人： W. Dennis Slafer

发明人： W. Dennis Slafer

IPC分类号： B28B21/42 ,  C25B15/00 ,  C25B9/00

CPC分类号： G11B7/263 ,  B29C33/3857 ,  B29C59/04 ,  B29L2031/757 ,  B82Y10/00 ,  B82Y40/00 ,  C25D1/02 ,  C25D1/10 ,  C25D3/04 ,  C25D3/12 ,  C25D3/46 ,  C25D3/48 ,  C25D5/02 ,  C25D5/022 ,  C25D7/04 ,  C25D17/02 ,  C25D17/04 ,  C25D17/06 ,  C25D17/12 ,  C25D21/02 ,  C25D21/06 ,  C25D21/10 ,  G03F7/0002 ,  G03F7/24 ,  G11B7/26 ,  G11B7/261

摘要： Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.

摘要翻译： 公开了耐久的无缝复制工具，用于在期望的介质（例如光学记录或数据存储介质）中复制无缝浮雕图案。 公开了制造这种耐用的复制工具的方法，包括在支撑圆筒的内表面上制备记录基底，在基底中记录和显影浮雕图案，形成图案的耐久的负浮雕复制品，提取所得到的耐用的工具套 并且将工具套筒安装在安装夹具上。 公开了用于制造这种无缝复制工具的装置，包括用于在支撑筒的内表面上的感光层上记录期望的浮雕图案的系统。 还公开了用于形成具有期望的浮雕图案的耐用工具套筒的电沉积池。 复制工具浮雕功能可能具有至微米和纳米方面的关键尺寸。