摘要:
An antenna unit having an antenna coil pattern is disposed in a casing. A sensor unit has a surface acoustic wave detecting element including a first sensing electrode that generates and receives a surface acoustic wave and a first reflector that reflects the surface acoustic wave, which are provided on a substrate configured of a piezoelectric material, and a sensor coil pattern electrically connected to the first sensing electrode and coupled to the antenna coil pattern. The sensor unit is disposed in a pressure receiving portion, and a signal is transmitted between the sensor unit and the antenna unit by wireless communication resulting from a coil coupling.
摘要:
A semiconductor sensor device has a lead frame having an outer frame with wire bond pads and a die pad to which a pressure sensor die is mounted. The die pad is vertically offset from the outer frame and wire bond pads by tie bars that have down set structures. The die pad has an opening, and the sensor die is mounted on the first die attach pad such that the opening provides access to an active region of the sensor die. Pressure sensitive gel is applied over the active region of the sensor die. Molding compound covers the sensor die and gel. The molding compound has a hole corresponding to the opening in the die pad to enable ambient atmospheric pressure outside of the sensor device to reach the sensor die via the pressure sensitive gel.
摘要:
A pressure sensor includes a socket portion and a nut portion which are integrally molded with resin, a screw portion which is tightly fixed to a side wall of an opening in a concave part of the nut portion by adhesive, and a sense element which is fixed to the screw portion and is disposed in the concave part of the nut portion. The socket portion, the nut portion and the screw portion constitute a package. A through hole introducing the pressure measurement target liquid is formed in the screw portion. An external lead-out terminal is fixed to the sense element. The external lead-out terminal passes through the through hole on a base of the concave part of the nut portion, and is tightly fixed to the socket portion with adhesive. The external lead-out terminal is a connection terminal to be connected with external wiring.
摘要:
The invention provides a submersible, electrically-powered sensor assembly that incorporates a flexible seal assembly having operative and non-operative electrical traces of a uniform vertical height for carrying clamping loads and avoiding signal loss along a signal carrying trace due to compression of the flex seal, minimizing fluid leak paths between two flange surfaces, providing stability in compression, and enabling electrical communication in an environment having an operating fluid.
摘要:
A pressure sensor 100 may comprise a nylon socket 200, an upper PCB 320, a lower PCB 340, and a hex housing 400. The nylon socket 200 may include co-molded electrical pin conductors 230a, 230b, 230c extending axially from electrical connectors 240a, 240b, 240c defined within a top end of the nylon socket 200 to a bottom end of the nylon socket 200. The upper PCB 320 may have contacts configured to contact the electrical pin conductors 230a, 230b, 230c. The lower PCB 340 may be electrically coupled to the upper PCB 320 and to strain gauges 355 coupled to a diaphragm 360. The hex housing 440 may have an interior axial port 430 extending from a bottom of said hex housing 400 to a counterbore 440 for holding the diaphragm 360, thereby exposing a first side of said diaphragm 360 to the fluid within the axial port 430.
摘要:
The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor unit subassembly for installation in or use with a pressure sensor housing may include at least one pressure sensor signal output terminal supported by a printed circuit board, a pressure input port, and a pressure sense element secured relative to one or more printed circuit boards. The printed circuit board(s) may include circuitry configured to format pressure output signals provided by the pressure sense element into a particularly chosen output format, and may provide the formatted pressure output signal(s) to an attached electrical connector of the pressure sensor housing. In some cases, the sensor unit subassemblies can be mixed with a multitude of different electrical connectors and/or with a multitude of different port connections to from a wide array of pressure sensor assemblies.
摘要:
A pressure sensor includes a metal port member having a first closed end and a second opposing opened end. A metal shell surrounds a portion of the periphery of the port. A first weld connection joins the port to the shell. A metal base has upper and lower surfaces and a second weld connection joins the shell to the lower surface of the base. Sensing structure is associated with the closed end of the port member. The sensing structure is constructed and arranged to sense pressure changes at the closed end of the port member. A connector housing covers the sensing structure.
摘要:
A pressure sensor assembly comprises a fluid channel having an inlet portion and an outlet portion, wherein the outlet portion is larger than the inlet portion.
摘要:
A general pressure sensor for an automobile comprising a sensor shell, a silicon piezoresistive sensitive core, a sensor core seat, a signal conditioning circuit, and an automobile electric device interface is disclosed. The silicon piezoresistive sensitive core, the sensor core seat and the signal conditioning circuit are disposed in the inner cavity of the sensor housing. The sensor housing is installed to the automobile electric device interface, and the silicon piezoresistive sensitive core comprises a silicon piezoresistive sensitive element and a glass ring sheet. The silicon piezoresistive sensitive element is welded and fixed to a surface of the glass ring sheet. An insulation oxidation layer is formed on one surface of the glass ring sheet and the silicon piezoresistive sensitive element. The other surface of the glass ring sheet is hermetically fixed to the ring-shape recession surface provided on the sensor core seat. The sensor core seat is hermetically and rotationally fixed to a pressure inlet on the sensor housing, after the inner lead wire on the silicon piezoresistive sensitive core is led to an interposing board provided on one end of the central hole through the other end of the central hole on the ring-shape recession surface of the sensor core seat, and then is led out by the automobile electric device interface via the signal conditioning circuit.
摘要:
A semiconductor sensor die is packaged with a footed lid that has side walls and a top portion with a central hole. Gel material is dispensed into a cavity formed by the side walls such that it covers the die prior to attaching the lid top portion.