Abstract:
Provided is a transfer unit. The transfer unit includes a robot transferring a substrate and a controller controlling a speed of the robot according to the number of substrates to be transferred by the robot for a preset period. When the number of substrates to be transferred for the preset period increases, the robot increases in moving speed by the controller.
Abstract:
Provided are an apparatus and a method of cleaning a substrate. The apparatus includes a substrate supporting unit supporting a substrate, a container surrounding the substrate supporting unit and collecting an organic solvent scattered from the substrate, and a fluid supplying unit provided on one side of the container and spraying a liquid organic solvent with bubbles to the substrate. The fluid supplying unit includes a nozzle head ejecting the organic solvent to the substrate, an organic solvent supplying line supplying the organic solvent from an organic solvent storage tank to the nozzle head, and a bubble providing element provided on the organic solvent supplying line and providing bubbles to the liquid organic solvent.
Abstract:
Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.
Abstract:
Provided is a substrate treating apparatus using a process gas and an adjustment plate used thereof. A substrate treating apparatus including a chamber providing a space in which a process is performed, a support member supporting a substrate in the chamber, a gas supply member supplying a process gas onto the substrate disposed on the support member, and an exhaust assembly coupled to the chamber to exhaust a gas in the chamber, wherein the exhaust assembly includes an exhaust pipe connected to the chamber, an exhaust member connected to the exhaust pipe to provide a vacuum pressure in the exhaust pipe, a valve adjusting an opening rate of the exhaust pipe, and an adjustment plate having a cover plate which is provided in the chamber to interfere with a flow of the process gas in an internal region of the chamber in a direction corresponding to, when the exhaust pipe is partially opened, an opened region of the exhaust pipe. Consequently, the process gas may be uniformly supplied onto the substrate.
Abstract:
The substrate cleaning apparatus includes a first process chamber in which a liquid treating process is performed on a substrate by supplying a treating solution, a second process chamber in which a drying process is performed on the substrate, and a carrying unit carrying the substrate between the first process chamber and the second process chamber. The first process chamber includes a liquid treating housing providing a space in which the liquid treating process is performed on the substrate, a spin chuck supporting the substrate within the liquid treating housing, and a liquid supply member supplying the treating solution onto the substrate supported by the spin chuck. The second process chamber includes a drying housing providing a space in which the substrate is dried, a substrate support member supporting the substrate within the drying housing, and a heater heating the substrate.
Abstract:
Provided is a substrate treating apparatus. The substrate treating apparatus includes a chamber, a support member disposed within the chamber to support a substrate, and an exhaust member for exhausting a gas within an inner space of the chamber to the outside of the chamber. A trap space for collecting fumes contained in the gas is defined in the exhaust member.
Abstract:
Disclosed are a microwave heat treatment apparatus and an impedance matching method between a microwave power supply and a chamber in the microwave heat treatment apparatus. The impedance matching method includes the steps of initially adjusting the impedance of a tuner circuit between the microwave power supply and the chamber based on pre-matching data for a heat treatment process, applying microwave power to the chamber from the microwave power supply through the tuner circuit having the initially adjusted impedance, measuring process data related to the impedance of the chamber to which the microwave power has been applied, determining an impedance tuning value of the tuner circuit by comparing the process data and the pre-matching data, and adjusting the impedance of the tuner circuit based on the impedance tuning value.
Abstract:
Disclosed is a method of treating a substrate, the method including: a liquid treatment operation of treating a substrate by supplying a treatment solution to a rotating substrate to form a liquid film on the substrate; after the liquid treatment operation, a gas treatment operation of discharging gas to the substrate and removing an upper layer of the liquid film from the substrate; and after the gas treatment operation, a liquid film removal operation of removing a lower layer in the liquid film on the substrate.
Abstract:
A storage and transfer module includes a module body, a storage and transfer unit disposed in the module body, the storage and transfer unit including a liftable transfer portion, and a storage portion disposed on the outside of the transfer portion, the storage portion having a storage space therein, and a transfer target portion in which a substrate is transferred by the transfer portion. A pair of the storage and transfer units are provided. The pair of storage and transfer units are disposed to oppose each other with the transfer target portion interposed therebetween. A substrate loading portion is disposed on one side of the storage and transfer units.
Abstract:
A substrate lifting apparatus according to the present disclosure includes: a lift pin penetrating through a substrate support unit supporting a substrate in a processing space and lifting and lowering the substrate; a pin holder into which a lower portion of the lift pin is inserted; and a bellows surrounding the pin holder, wherein the pin holder is formed with a guide member whose lower portion is coupled with a bolt and guiding an air flow generated inside the bellows in a direction of the processing space.