公开(公告)号：US08912495B2

公开(公告)日：2014-12-16

申请号：US13742315

申请日：2013-01-15

申请人： KLA-Tencor Corporation

发明人： Steven R. Lange

IPC分类号： G01J5/00 ,  G01N21/95 ,  G01N21/35

CPC分类号： G01N21/9501 ,  G01N21/3563 ,  G01N21/359 ,  G01N21/55 ,  G01N21/9503 ,  G01N2201/0612 ,  G01N2201/105

摘要： Multi-spectral defect inspection for 3D wafers is provided. One system configured to detect defects in one or more structures formed on a wafer includes an illumination subsystem configured to direct light in discrete spectral bands to the one or more structures formed on the wafer. At least some of the discrete spectral bands are in the near infrared (NIR) wavelength range. Each of the discrete spectral bands has a bandpass that is less than 100 nm. The system also includes a detection subsystem configured to generate output responsive to light in the discrete spectral bands reflected from the one or more structures. In addition, the system includes a computer subsystem configured to detect defects in the one or more structures on the wafer using the output.

摘要翻译： 提供了三维晶圆的多光谱缺陷检测。 被配置为检测在晶片上形成的一个或多个结构中的缺陷的一个系统包括被配置为将离散光谱带中的光引导到在晶片上形成的一个或多个结构的照明子系统。 至少一些离散的光谱带处于近红外（NIR）波长范围。 每个离散的光谱带具有小于100nm的带通。 该系统还包括检测子系统，该检测子系统被配置为响应于从一个或多个结构反映的离散频谱带中的光产生输出。 另外，该系统包括被配置为使用输出来检测晶片上的一个或多个结构中的缺陷的计算机子系统。

公开(公告)号：US08873054B2

公开(公告)日：2014-10-28

申请号：US13865104

申请日：2013-04-17

申请人： KLA-Tencor Corporation

发明人： Daniel Kandel ,  Vladimir Levinski ,  Alexander Svizher ,  Joel Seligson ,  Andrew Hill ,  Ohad Bachar ,  Amnon Manassen ,  Yung-Ho Alex Chuang ,  Ilan Sela ,  Moshe Markowitz ,  Daria Negri ,  Efraim Rotem

IPC分类号： G01J4/00 ,  G01B11/14 ,  G01B11/04 ,  G01B11/00 ,  G01N21/47 ,  G01B11/02 ,  G03F7/20 ,  G01B11/06 ,  G01N21/21 ,  G01N21/956

CPC分类号： G01N21/47 ,  G01B11/02 ,  G01B11/0641 ,  G01B2210/56 ,  G01N21/211 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/4792 ,  G01N2201/06113 ,  G01N2201/105 ,  G03F7/70625 ,  G03F7/70633

摘要： Various metrology systems and methods are provided. One metrology system includes a light source configured to produce a diffraction-limited light beam, an apodizer configured to shape the light beam in the entrance pupil of illumination optics, and optical elements configured to direct the diffraction-limited light beam from the apodizer to an illumination spot on a grating target on a wafer and to collect scattered light from the grating target. The metrology system further includes a field stop and a detector configured to detect the scattered light that passes through the field stop. In addition, the metrology system includes a computer system configured to determine a characteristic of the grating target using output of the detector.

摘要翻译： 提供了各种计量系统和方法。 一个计量系统包括被配置为产生衍射受限光束的光源，被配置为使照明光学器件的入射光瞳中的光束成形的变迹器，以及被配置为将来自变迹器的衍射受限光束引导到 在晶片上的光栅目标上的照明点并且收集来自光栅目标的散射光。 测量系统还包括场停止器和检测器，其被配置为检测通过场停止器的散射光。 此外，计量系统包括被配置为使用检测器的输出来确定光栅目标的特性的计算机系统。

公开(公告)号：US08775101B2

公开(公告)日：2014-07-08

申请号：US13196758

申请日：2011-08-02

申请人： Junqing Huang ,  Yong Zhang ,  Stephanie Chen ,  Tao Luo ,  Lisheng Gao ,  Richard Wallingford

发明人： Junqing Huang ,  Yong Zhang ,  Stephanie Chen ,  Tao Luo ,  Lisheng Gao ,  Richard Wallingford

IPC分类号： G01R31/28

CPC分类号： G01R31/28 ,  G01N21/9501 ,  G01N21/956

摘要： Methods and systems for detecting defects on a wafer are provided.

摘要翻译： 提供了用于检测晶片上的缺陷的方法和系统。

公开(公告)号：US08213704B2

公开(公告)日：2012-07-03

申请号：US12116664

申请日：2008-05-07

申请人： Ingrid B. Peterson ,  Ed Yum

发明人： Ingrid B. Peterson ,  Ed Yum

IPC分类号： G06K9/00 ,  G01N21/00

CPC分类号： G03F7/7085 ,  G03F1/84 ,  G03F7/7065 ,  G03F7/70666

摘要： Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of the reticle design pattern using a sensor disposed on a substrate arranged proximate to an image plane of an exposure system configured to perform a wafer printing process using the reticle design pattern. The images illustrate how the reticle design pattern will be projected on a wafer by the exposure system at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in the reticle design pattern based on a comparison of two or more of the images corresponding to two or more of the different values.

摘要翻译： 提供了用于检测标线设计图案中的缺陷的计算机实现的方法和系统。 一种计算机实现的方法包括使用布置在接近于被配置为使用标线设计图案执行晶片印刷处理的曝光系统的图像平面的基板上布置的传感器来获取标线设计图案的图像。 图像示出了在晶片印刷过程的一个或多个参数的不同值下，曝光系统如何将标线设计图案投影在晶片上。 该方法还包括基于对应于两个或更多个不同值的两个或更多个图像的比较来检测掩模版设计图案中的缺陷。

公开(公告)号：US08112241B2

公开(公告)日：2012-02-07

申请号：US12403905

申请日：2009-03-13

申请人： Yan Xiong

发明人： Yan Xiong

IPC分类号： G01R27/28 ,  G06K9/00

CPC分类号： G01N21/9501 ,  G01N2021/8854

摘要： Methods and systems for generating an inspection process for a wafer are provided. One computer-implemented method includes separately determining a value of a local attribute for different locations within a design for a wafer based on a defect that can cause at least one type of fault mechanism at the different locations. The method also includes determining a sensitivity with which defects will be reported for different locations on the wafer corresponding to the different locations within the design based on the value of the local attribute. In addition, the method includes generating an inspection process for the wafer based on the determined sensitivity. Groups may be generated based on the value of the local attribute thereby assigning pixels that will have at least similar noise statistics to the same group, which can be important for defect detection algorithms. Better segmentation may lead to better noise statistics estimation.

摘要翻译： 提供了用于产生晶片检查过程的方法和系统。 一种计算机实现的方法包括基于可能在不同位置处引起至少一种类型的故障机制的缺陷单独地确定用于晶片的设计中不同位置的局部属性的值。 该方法还包括基于局部属性的值来确定对于与设计中的不同位置相对应的晶片上的不同位置将报告缺陷的灵敏度。 另外，该方法包括基于所确定的灵敏度产生晶片的检查处理。 可以基于本地属性的值生成组，从而将具有至少相似噪声统计的像素分配给同一组，这对缺陷检测算法可能是重要的。 更好的分割可以导致更好的噪声统计估计。

公开(公告)号：US08049877B2

公开(公告)日：2011-11-01

申请号：US12120577

申请日：2008-05-14

申请人： Richard Wallingford ,  Stephanie Chen ,  Jason Kirkwood ,  Tao Luo ,  Yong Zhang ,  Lisheng Gao

发明人： Richard Wallingford ,  Stephanie Chen ,  Jason Kirkwood ,  Tao Luo ,  Yong Zhang ,  Lisheng Gao

IPC分类号： G01N21/00

CPC分类号： G01N21/21 ,  G01N21/9501 ,  G01N2021/8822 ,  G01N2021/8867

摘要： Computer-implemented methods, carrier media, and systems for selecting polarization settings for an inspection system for inspection of a layer of a wafer are provided. One method includes detecting a population of defects on the layer of the wafer using results of each of two or more scans of the wafer performed with different combinations of polarization settings of the inspection system for illumination and collection of light scattered from the wafer. The method also includes identifying a subpopulation of the defects for each of the different combinations, each of which includes the defects that are common to at least two of the different combinations, and determining a characteristic of a measure of signal-to-noise for each of the subpopulations. The method further includes selecting the polarization settings for the illumination and the collection to be used for the inspection corresponding to the subpopulation having the best value for the characteristic.

摘要翻译： 提供了计算机实现的方法，载体介质和用于选择用于检查晶片层的检查系统的偏振设置的系统。 一种方法包括使用用于照明的偏光设置的不同组合和从晶片散射的光的收集的晶片的两次或多次扫描中的每一个的结果来检测晶片层上的缺陷群。 该方法还包括识别每个不同组合的缺陷的子群体，每个组合包括对于至少两个不同组合是共同的缺陷，以及确定每个组合的信噪比度量的特性 的亚群。 该方法还包括选择用于与用于该特征具有最佳值的亚群相对应的检查的照明和收集的偏振设置。

公开(公告)号：US07962863B2

公开(公告)日：2011-06-14

申请号：US12115830

申请日：2008-05-06

申请人： Bo Su ,  Gaurav Verma ,  Hong Du ,  Rui-fang Shi ,  Scott Andrews

发明人： Bo Su ,  Gaurav Verma ,  Hong Du ,  Rui-fang Shi ,  Scott Andrews

IPC分类号： G06F17/50

CPC分类号： G03F7/70441 ,  G03F1/36 ,  G03F1/68

摘要： Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer are provided. One method includes generating simulated images of the reticle features printed on the wafer using different generated models for a set of different values of exposure conditions. The method also includes determining one or more characteristics of the reticle features of the simulated images. In addition, the method includes comparing the one or more characteristics of the reticle features of the simulated images to one or more characteristics of the reticle features printed on the wafer using a lithography process. The method further includes selecting one of the different generated models as the model to be used for predicting the printability of the reticle features based on results of the comparing step.

摘要翻译： 提供了用于确定用于预测晶片上的掩模版特征的可印刷性的模型的计算机实现的方法，系统和计算机可读介质。 一种方法包括使用针对一组不同曝光条件值的不同生成模型产生印刷在晶片上的掩模版特征的模拟图像。 该方法还包括确定模拟图像的掩模版特征的一个或多个特征。 此外，该方法包括使用光刻工艺将模拟图像的掩模版特征的一个或多个特征与印刷在晶片上的掩模版特征的一个或多个特性进行比较。 该方法还包括基于比较步骤的结果，选择不同的生成模型中的一个作为用于预测标线图特征的可印刷性的模型。

公开(公告)号：US07904845B2

公开(公告)日：2011-03-08

申请号：US11950961

申请日：2007-12-05

申请人： Christophe Fouquet ,  Gordon Abbott ,  Ellis Chang ,  Zain K. Saidin

发明人： Christophe Fouquet ,  Gordon Abbott ,  Ellis Chang ,  Zain K. Saidin

IPC分类号： G06F17/50

CPC分类号： G03F1/84 ,  G03F7/7065

摘要： Various methods, designs, defect review tools, and systems for determining locations on a wafer to be reviewed during defect review are provided. One computer-implemented method includes acquiring coordinates of defects detected by two or more inspection systems. The defects do not include defects detected on the wafer. The method also includes determining coordinates of the locations on the wafer to be reviewed during the defect review by translating the coordinates of the defects into the coordinates on the wafer such that results of the defect review performed at the locations can be used to determine if the defects cause systematic defects on the wafer.

摘要翻译： 提供了各种方法，设计，缺陷评估工具和用于在缺陷评估期间确定待检查的晶片上的位置的系统。 一种计算机实现的方法包括获取由两个或更多个检查系统检测到的缺陷的坐标。 缺陷不包括在晶片上检测到的缺陷。 该方法还包括通过将缺陷的坐标转换为晶片上的坐标来确定在缺陷审查期间待审查的晶片上的位置的坐标，使得可以使用在位置处执行的缺陷评估的结果来确定是否 缺陷导致晶片上的系统缺陷。

公开(公告)号：US07400403B2

公开(公告)日：2008-07-15

申请号：US11715584

申请日：2007-03-08

申请人： Jon Opsal

发明人： Jon Opsal

IPC分类号： G01J4/00

CPC分类号： G01J4/04 ,  G01N21/211

摘要： An optical inspection device includes a light source for generating a probe beam. The probe beam is focused onto a sample to create a spread of angles of incidence. After reflecting from the sample, the light is imaged onto a two dimensional array of photodetectors. Prior to reaching the detector array, the beam is passed through a rotating compensator. A processor functions to evaluate the sample by analyzing the output of the photodetectors lying along one or more azimuthal angles and at different compensator positions.

摘要翻译： 光学检查装置包括用于产生探测光束的光源。 探测光束被聚焦到样品上以产生入射角的扩展。 从样品反射后，将光成像到二维阵列的光电探测器上。 在到达检测器阵列之前，光束通过旋转补偿器。 处理器用于通过分析沿着一个或多个方位角并且处于不同补偿器位置的光电探测器的输出来评估样本。

公开(公告)号：US10769761B2

公开(公告)日：2020-09-08

申请号：US16019422

申请日：2018-06-26

申请人： KLA-Tencor Corporation

发明人： Saurabh Sharma ,  Amitoz Singh Dandiana ,  Mohan Mahadevan ,  Chao Fang ,  Amir Azordegan ,  Brian Duffy

IPC分类号： G06T5/00 ,  G06T3/40

摘要： Methods and systems for generating a high resolution image for a specimen from a low resolution image of the specimen are provided. One system includes one or more computer subsystems configured for acquiring a low resolution image of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a deep convolutional neural network that includes one or more first layers configured for generating a representation of the low resolution image. The deep convolutional neural network also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the low resolution image. The second layer(s) include a final layer configured to output the high resolution image and configured as a sub-pixel convolutional layer.