公开(公告)号：US06958597B1

公开(公告)日：2005-10-25

申请号：US10709470

申请日：2004-05-07

Applicant: Hong-chin Lin ,  Po-Hsuan Huang ,  Chien-Hung Ho

Inventor： Hong-chin Lin ,  Po-Hsuan Huang ,  Chien-Hung Ho

IPC: G05F1/40 ,  G05F3/16 ,  G05F3/26 ,  G05F3/30

CPC classification number: G05F3/262 ,  G05F3/30 ,  Y10S323/907

Abstract: Voltage generating apparatus includes a positive temperature coefficient current generating module, a negative temperature coefficient current generating module, a fine-tune current module and a voltage output module. The function of the positive temperature coefficient current generating module and the negative temperature coefficient current generating module, which take advantage of characteristics of MOS devices operated in the sub-threshold region, is to generate a stable current of positive temperature coefficient and a stable current of negative temperature coefficient, respectively. The current fine-tune module increases or decreases output current of the negative temperature coefficient current generating module. The voltage output module sums two output currents of the positive temperature coefficient current generating module and the negative temperature coefficient current generating module and transforms the total current into output voltage that is stable under temperature and process variation.

Abstract translation: 电压产生装置包括正温度系数电流产生模块，负温度系数电流产生模块，微调电流模块和电压输出模块。 利用在亚阈值区域工作的MOS器件的特性的正温度系数电流发生模块和负温度系数电流发生模块的功能是产生正温度系数和稳定电流的稳定电流 负温度系数。 当前微调模块增加或减少负温度系数电流发生模块的输出电流。 电压输出模块将正温度系数电流发生模块和负温度系数电流发生模块的两个输出电流相加，并将总电流转换为在温度和工艺变化下稳定的输出电压。

公开(公告)号：US06633804B2

公开(公告)日：2003-10-14

申请号：US10033843

申请日：2001-12-27

Applicant: Peter J. Dix ,  Anthony J. Lamela ,  Brian E. Felsing ,  Troy D. Bateman ,  Hong-Chin Lin ,  Daniel B. Shore

Inventor： Peter J. Dix ,  Anthony J. Lamela ,  Brian E. Felsing ,  Troy D. Bateman ,  Hong-Chin Lin ,  Daniel B. Shore

IPC: G06F1900

CPC classification number: B60G21/10 ,  B60G17/005 ,  B60G17/018 ,  B60G17/056 ,  B60G2300/09 ,  B60G2400/252 ,  B60G2600/02 ,  B60G2600/12 ,  B60G2600/20 ,  B60G2800/012 ,  B60G2800/014 ,  B60G2800/164 ,  B60G2800/912 ,  B60G2800/914

Abstract: A skid steer vehicle has a sprung suspension system including four wheels mounted on four swing arms that are pivotally coupled to the chassis of the vehicle. An electronic controller is connected both to position sensors coupled to the swing arms to sense the position of the swing arms and wheels with respect to the chassis and also to hydraulic cylinders that control the position of the swing arms and wheels. The electronic controller determines the average position of each suspension and controls the flow of fluid to the cylinders to keep the swing arms and wheels at their proper target height when vehicle load changes.

Abstract translation: 滑行转向车辆具有悬挂悬挂系统，其包括四个轮子，四个轮子安装在四个摆动臂上，该四个摆动臂枢转地联接到车辆的底盘。 电子控制器连接到与摆臂相连的位置传感器，以便相对于底盘感知摆臂和轮的位置，以及控制摇臂和轮的位置的液压缸。 电子控制器确定每个悬架的平均位置，并控制流体到气缸的流量，以便在车辆负载变化时将摆臂和轮子保持在适当的目标高度。

公开(公告)号：US06584710B1

公开(公告)日：2003-07-01

申请号：US10033837

申请日：2001-12-27

Applicant: Hong-Chin Lin ,  Peter J. Dix ,  Troy D. Bateman ,  Brian E. Felsing ,  Anthony J. Lamela ,  Daniel B. Shore

Inventor： Hong-Chin Lin ,  Peter J. Dix ,  Troy D. Bateman ,  Brian E. Felsing ,  Anthony J. Lamela ,  Daniel B. Shore

IPC: E02F502

CPC classification number: B60G11/18 ,  B60G3/145 ,  B60G17/0155 ,  B60G17/018 ,  B60G17/0195 ,  B60G2200/132 ,  B60G2202/134 ,  B60G2202/21 ,  B60G2300/09 ,  B60G2400/0511 ,  B60G2400/0522 ,  B60G2400/25 ,  E02F3/3414 ,  E02F9/2217 ,  E02F9/2257 ,  E02F9/2292 ,  E02F9/2296 ,  Y10S37/902

Abstract: A skid steer vehicle with sprung suspensions is configured to lock the suspensions whenever the operator manipulates a manual control that generates a signal to move the loader arms or the bucket of the vehicle. The operator control, such as a joystick, sends a signal to an electronic controller indicating that the operator has moved the control and is thereby requesting the loader arms or bucket to move. The electronic controller responds to this signal by moving the loader arms or bucket and simultaneously locking the suspensions.

Abstract translation: 具有弹簧悬架的滑移转向车辆被配置为在操作者操纵产生用于移动装载机臂或铲斗的信号的手动控制时锁定悬架。 诸如操纵杆的操作员控制向电子控制器发送一个信号，指示操作者已经移动了控制，从而请求装载机臂或铲斗移动。 电子控制器通过移动装载机臂或铲斗同时锁定悬架来响应该信号。

公开(公告)号：US06480414B1

公开(公告)日：2002-11-12

申请号：US09586835

申请日：2000-06-05

Applicant: Hong Chin Lin ,  Shyh-Chyi Wong ,  Tai-Yuan Chen

Inventor： Hong Chin Lin ,  Shyh-Chyi Wong ,  Tai-Yuan Chen

IPC: G11C1604

CPC classification number: G11C16/0475 ,  G11C11/5621 ,  G11C16/0458 ,  G11C2211/5612 ,  G11C2211/5613

Abstract: A multi-level memory cell has a substrate, a first floating gate, a second floating gate and a control gate. A first doped region, a second doped region and a channel region located between the first doped region and the second doped region are provided in the substrate. The first floating gate is located over the channel region near the first doped region. The second floating gate is located over the channel region near the second doped region and isolated from the first floating gate. A control gate is located over the first and the second floating gates. When writing operations are proceeding, the bias voltages of the control gates are the same, and a constant bias voltage is provided on the first doped region or the second doped region depending on which binary states 11, 10, 01 or 00 are to write. Furthermore, the same bias voltage is used on the control gate during writing operation. Thus, the memory per unit chip area is enhanced and the peripheral circuits are simplified.

Abstract translation: 多级存储单元具有衬底，第一浮动栅极，第二浮动栅极和控制栅极。 位于第一掺杂区和第二掺杂区之间的第一掺杂区，第二掺杂区和沟道区设置在衬底中。 第一浮栅位于靠近第一掺杂区的沟道区之上。 第二浮栅位于靠近第二掺杂区的沟道区上方并与第一浮栅隔离。 控制栅极位于第一和第二浮动栅极之上。 当写入操作进行时，控制栅极的偏置电压相同，并且根据要写入的二进制状态11,10,21或00，在第一掺杂区域或第二掺杂区域上提供恒定的偏置电压。 此外，在写入操作期间，在控制栅极上使用相同的偏置电压。 因此，每单位芯片面积的存储器被增强并且外围电路被简化。

公开(公告)号：US08666618B2

公开(公告)日：2014-03-04

申请号：US12289694

申请日：2008-10-31

Applicant: Hong-Chin Lin ,  Rami Nabil Nasrallah

Inventor： Hong-Chin Lin ,  Rami Nabil Nasrallah

IPC: G06G7/00

CPC classification number: B60W10/02 ,  B60W10/30 ,  B60Y2200/415 ,  E02F9/2079 ,  F16D48/06 ,  F16D2500/1112 ,  F16D2500/31 ,  F16D2500/3108 ,  F16D2500/31413 ,  F16D2500/70288 ,  Y10T477/26 ,  Y10T477/27 ,  Y10T477/75

Abstract: A machine control system for use with a machine having a power source and a transmission is disclosed. The machine control system may have a clutch configured to connect an output of the power source with an input of the transmission. The machine control system may also have a sensors configured to generate signals indicative of machine operations, and a controller in communication with the clutch and the sensors. The controller may be configured to determine the current machine application based on the signals, and vary an actuating force of the clutch based on the type of machine application.

Abstract translation: 公开了一种与具有电源和变速器的机器一起使用的机器控制系统。 机器控制系统可以具有将电源的输出与变速器的输入连接的离合器。 机器控制系统还可以具有被配置为产生指示机器操作的信号的传感器，以及与离合器和传感器通信的控制器。 控制器可以被配置为基于信号来确定当前的机器应用，并且基于机器应用的类型改变离合器的致动力。

公开(公告)号：US07932586B2

公开(公告)日：2011-04-26

申请号：US11949800

申请日：2007-12-04

Applicant: Nan-Jang Chen ,  Hong-Chin Lin

Inventor： Nan-Jang Chen ,  Hong-Chin Lin

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49589 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: The invention relates to leadframe semiconductor packages mounted on a heat-sink and fabrication thereof. A system in package (SiP) comprises a leadframe having extension leads, configured with divisional heat sinks serving as power and ground nets. A set of semiconductor dies is attached by adhesive on the central region of the lead frame. Pluralities of wire bonds electrically connect the set of semiconductor dies to the leadframe and to the divisional heat sinks respectively. An encapsulation encloses the leadframe, but leaves the extension leads and the divisional heat sink uncovered, exposing a heat dissipating surface.

Abstract translation: 本发明涉及安装在散热器上的引线框半导体封装及其制造。 封装系统（SiP）包括具有延伸引线的引线框，配置有用作电源和地网的分散散热器。 一组半导体管芯通过粘合剂附着在引线框架的中心区域上。 多个引线键将半导体管芯组分别电连接到引线框架和分开的散热器。 封装封装引线框架，但是将延伸引线和分开的散热片未被覆盖，露出散热表面。

公开(公告)号：US20090236709A1

公开(公告)日：2009-09-24

申请号：US12050210

申请日：2008-03-18

Applicant: Nan-Jang Chen ,  Hong-Chin Lin

Inventor： Nan-Jang Chen ,  Hong-Chin Lin

IPC: H01L23/495

CPC classification number: H01L23/49503 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor chip package is disclosed. The semiconductor chip package comprises a lead frame having a chip carrier, wherein the chip carrier has a first surface and an opposite second surface. A semiconductor chip is mounted on the first surface, having a plurality of bonding pads thereon, wherein the semiconductor chip has an area larger than that of the chip carrier. A package substrate comprises a central region attached to the second surface, having an area larger than that of the semiconductor chip, wherein some of the bonding pads of the semiconductor chip are electrically connected to a marginal region of the package substrate.

Abstract translation: 公开了半导体芯片封装。 半导体芯片封装包括具有芯片载体的引线框架，其中芯片载体具有第一表面和相对的第二表面。 半导体芯片安装在第一表面上，其上具有多个焊盘，其中半导体芯片的面积大于芯片载体的面积。 封装衬底包括附接到第二表面的中心区域，其具有比半导体芯片大的面积，其中半导体芯片的一些焊盘电连接到封装衬底的边缘区域。

公开(公告)号：US20090187318A1

公开(公告)日：2009-07-23

申请号：US12010260

申请日：2008-01-23

Applicant: Hong-Chin Lin ,  Michael A. Spielman, JR. ,  Paul Douglas Hagen

Inventor： Hong-Chin Lin ,  Michael A. Spielman, JR. ,  Paul Douglas Hagen

IPC: G06F19/00

CPC classification number: B60W10/02 ,  B60W10/18 ,  B60W30/18054 ,  B60W2510/0638 ,  B60W2540/14 ,  B60Y2200/415

Abstract: A machine control system for use with a machine having a power source and a transmission is disclosed. The machine control system may have a clutch configured to connect an output of the power source with an input of the transmission. The machine control system may also have a sensor configured to generate a signal indicative of a speed of the power source, and a controller in communication with the clutch and the sensor. The controller may be configured to vary an actuating force of the clutch based on the signal.

Abstract translation: 公开了一种与具有电源和变速器的机器一起使用的机器控制系统。 机器控制系统可以具有将电源的输出与变速器的输入连接的离合器。 机器控制系统还可以具有被配置为产生指示电源速度的信号的传感器以及与离合器和传感器通信的控制器。 控制器可以被配置为基于该信号改变离合器的致动力。

公开(公告)号：US20080242502A1

公开(公告)日：2008-10-02

申请号：US11730384

申请日：2007-03-30

Applicant: Hong-Chin Lin

Inventor： Hong-Chin Lin

IPC: B60W10/04

CPC classification number: F16D48/06 ,  B60W10/023 ,  B60W10/06 ,  B60Y2200/415 ,  F16D2500/10412 ,  F16D2500/1045 ,  F16D2500/1112 ,  F16D2500/3108 ,  F16D2500/31413 ,  F16D2500/31466 ,  F16D2500/51 ,  F16D2500/5126 ,  F16D2500/70494 ,  F16D2500/7105 ,  F16H61/143 ,  F16H61/21 ,  F16H2061/0237 ,  F16H2061/147 ,  F16H2061/216 ,  Y10T477/6403 ,  Y10T477/6414 ,  Y10T477/6422 ,  Y10T477/753 ,  Y10T477/87

Abstract: An overspeed system for a vehicle is disclosed. The overspeed system may have a power source, a transmission unit, and a torque converter assembly operatively coupling the power source to the transmission unit. The overspeed system may also have a travel speed sensor configured to generate a signal indicative of a vehicle speed, and a controller in communication with the torque converter assembly and the travel speed sensor. The controller may be configured to prevent a decoupling of the torque converter assembly in response to the signal.

Abstract translation: 公开了一种用于车辆的超速系统。 超速系统可以具有电源，传输单元和将电源可操作地耦合到传动单元的变矩器组件。 超速系统还可以具有配置成产生指示车辆速度的信号的行驶速度传感器，以及与变矩器组件和行驶速度传感器通信的控制器。 控制器可以被配置为防止响应于信号的变矩器组件的去耦。

公开(公告)号：US20080142937A1

公开(公告)日：2008-06-19

申请号：US11949800

申请日：2007-12-04

Applicant: Nan-Jang Chen ,  Hong-Chin Lin

Inventor： Nan-Jang Chen ,  Hong-Chin Lin

IPC: H01L23/36

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49589 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: The invention relates to leadframe semiconductor packages mounted on a heat-sink and fabrication thereof. A system in package (SiP) comprises a leadframe having extension leads, configured with divisional heat sinks serving as power and ground nets. A set of semiconductor dies is attached by adhesive on the central region of the lead frame. Pluralities of wire bonds electrically connect the set of semiconductor dies to the leadframe and to the divisional heat sinks respectively. An encapsulation encloses the leadframe, but leaves the extension leads and the divisional heat sink uncovered, exposing a heat dissipating surface.

Abstract translation: 本发明涉及安装在散热器上的引线框半导体封装及其制造。 封装系统（SiP）包括具有延伸引线的引线框，配置有用作电源和地网的分散散热器。 一组半导体管芯通过粘合剂附着在引线框架的中心区域上。 多个引线键将半导体管芯组分别电连接到引线框架和分开的散热器。 封装封装引线框架，但是将延伸引线和分开的散热片未被覆盖，露出散热表面。