Thin film transistor array panel and method for manufacturing the same
    31.
    发明申请
    Thin film transistor array panel and method for manufacturing the same 有权
    薄膜晶体管阵列面板及其制造方法

    公开(公告)号:US20060102907A1

    公开(公告)日:2006-05-18

    申请号:US11228852

    申请日:2005-09-16

    CPC classification number: H01L27/1214 H01L27/1225 H01L27/124

    Abstract: The present invention provides a thin film transistor array panel comprising an insulating substrate; a gate line formed on the insulating substrate; a gate insulating layer formed on the gate line; a drain electrode and a data line having a source electrode formed on the gate insulating layer, the drain electrode being adjacent to the source electrode with a gap therebetween; and a pixel electrode coupled to the drain electrode, wherein at least one of the gate line, the data line, and the drain electrode comprises a first conductive layer comprising a conductive oxide and a second conductive layer comprising copper (Cu).

    Abstract translation: 本发明提供一种薄膜晶体管阵列板,其包括绝缘基板; 形成在所述绝缘基板上的栅极线; 栅极绝缘层,形成在栅极线上; 漏电极和数据线,其具有形成在所述栅极绝缘层上的源电极,所述漏电极与所述源电极相邻,其间具有间隙; 以及耦合到所述漏电极的像素电极,其中所述栅极线,所述数据线和所述漏电极中的至少一个包括包括导电氧化物的第一导电层和包含铜(Cu)的第二导电层。

    OXIDE FOR SEMICONDUCTOR LAYER OF THIN-FILM TRANSISTOR, SEMICONDUCTOR LAYER OF THIN-FILM TRANSISTOR HAVING SAID OXIDE, AND THIN-FILM TRANSISTOR
    35.
    发明申请
    OXIDE FOR SEMICONDUCTOR LAYER OF THIN-FILM TRANSISTOR, SEMICONDUCTOR LAYER OF THIN-FILM TRANSISTOR HAVING SAID OXIDE, AND THIN-FILM TRANSISTOR 审中-公开
    薄膜晶体管半导体层氧化物,具有氧化硅的薄膜晶体管的半导体层和薄膜晶体管

    公开(公告)号:US20130341617A1

    公开(公告)日:2013-12-26

    申请号:US14004020

    申请日:2012-03-08

    Abstract: The oxide of the present invention for thin-film transistors is an In—Zn—Sn-based oxide containing In, Zn, and Sn, wherein when the respective contents (atomic %) of metal elements contained in the In—Zn—Sn-based oxide are expressed by [Zn], [Sn], and [In], the In—Zn—Sn-based oxide fulfills the following expressions (2) and (4) when [In]/([In]+[Sn])≦0.5; or the following expressions (1), (3), and (4) when [In]/([In]+[Sn])≧0.5. [In]/([In]+[Zn]+[Sn])≦0.3 - - - (1), [In]/([In]+[Zn]+[Sn])≦1.4×{[Zn]/([Zn]+[Sn])}−0.5 - - - (2), [Zn]/([In]+[Zn]+[Sn])≦0.83 - - - (3), and 0.1≦[In]/([In]+[Zn]+[Sn]) - - - (4). According to the present invention, oxide thin films for thin-film transistors can be obtained, which provide TFTs with excellent switching characteristics, and which have high sputtering rate in the sputtering and properly controlled etching rate in the wet etching.

    Abstract translation: 用于薄膜晶体管的本发明的氧化物是含有In,Zn和Sn的In-Zn-Sn系氧化物,其中,当In-Zn-Sn系中含有的金属元素的含量(原子% 当[In] /([In] + [Sn])[Zn],[In] + [Sn]表示[Zn],[Sn]和[In]时,In-Zn-Sn系氧化物满足下述(2) ])@ 0.5; 或[In] /([In] + [Sn])> = 0.5时的以下表达式(1),(3)和(4)。 [In] + [Zn] + [Sn])@ 0.3 - - - (1),[In] /([In] + [Zn] + [Sn])@ 1.4×{[Zn] /([Zn]+[Sn])}-0.5 - - - (2),[Zn] /([In] + [Zn] + [Sn])@ 0.83 - - - (3) In] /([In] + [Zn] + [Sn]) - - - (4)。 根据本发明,可以获得用于薄膜晶体管的氧化物薄膜,其提供具有优异的开关特性的TFT,并且在溅射中具有高溅射速率并且在湿蚀刻中具有适当控制的蚀刻速率。

    Thin film transistor substrate and method of fabricating the same
    36.
    发明授权
    Thin film transistor substrate and method of fabricating the same 有权
    薄膜晶体管基板及其制造方法

    公开(公告)号:US08558230B2

    公开(公告)日:2013-10-15

    申请号:US12756323

    申请日:2010-04-08

    CPC classification number: H01L27/1225 H01L27/1214 H01L27/1288 H01L29/7869

    Abstract: A thin film transistor (TFT) substrate and a method of fabricating the same are provided. The thin film transistor substrate may have low resistance characteristics and may have reduced mutual diffusion and contact resistance between an active layer pattern and data wiring. The thin film transistor substrate may include gate wiring formed on an insulating substrate. Oxide active layer patterns may be formed on the gate wiring and may include a first substance. Data wiring may be formed on the oxide active layer patterns to cross the gate wiring and may include a second substance. Barrier layer patterns may be disposed between the oxide active layer patterns and the data wiring and may include a third substance.

    Abstract translation: 提供薄膜晶体管(TFT)基板及其制造方法。 薄膜晶体管基板可以具有低电阻特性,并且可以减少有源层图案和数据布线之间的相互扩散和接触电阻。 薄膜晶体管基板可以包括形成在绝缘基板上的栅极布线。 氧化物有源层图案可以形成在栅极布线上,并且可以包括第一物质。 数据布线可以形成在氧化物有源层图案上以跨越栅极布线,并且可以包括第二物质。 阻挡层图案可以设置在氧化物活性层图案和数据布线之间,并且可以包括第三物质。

    Thin film transistor and method of manufacturing the same
    38.
    发明授权
    Thin film transistor and method of manufacturing the same 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US08492770B2

    公开(公告)日:2013-07-23

    申请号:US13035054

    申请日:2011-02-25

    CPC classification number: H01L29/04 H01L29/786

    Abstract: A thin film transistor includes a gate electrode formed on a substrate, a semiconductor pattern overlapped with the gate electrode, a source electrode overlapped with a first end of the semiconductor pattern and a drain electrode overlapped with a second end of the semiconductor pattern and spaced apart from the source electrode. The semiconductor pattern includes an amorphous multi-elements compound including a II B element and a VI A element or including a III A element and a V A element and having an electron mobility no less than 1.0 cm2/Vs and an amorphous phase, wherein the VI A element excludes oxygen. Thus, a driving characteristic of the thin film transistor may be improved.

    Abstract translation: 薄膜晶体管包括形成在基板上的栅极电极,与栅电极重叠的半导体图案,与半导体图案的第一端重叠的源电极和与半导体图案的第二端重叠并分开的漏电极 源极电极。 半导体图案包括包含IIB元素和VIA元素或包含IIIA元素和VA元素并且具有不小于1.0cm 2 / Vs的电子迁移率的无定形多元素化合物和非晶相,其中VI 一个元素排除氧气。 因此,可以提高薄膜晶体管的驱动特性。

    SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
    39.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME 有权
    半导体器件及其形成方法

    公开(公告)号:US20130181212A1

    公开(公告)日:2013-07-18

    申请号:US13543235

    申请日:2012-07-06

    CPC classification number: H01L29/7869 H01L21/02554

    Abstract: A semiconductor device includes: a substrate, a semiconductor layer including an oxide semiconductor disposed on the substrate, a barrier layer disposed on the semiconductor layer and an insulating layer disposed on the barrier layer. The semiconductor layer includes an oxide semiconductor, and the barrier layer includes a material having a lower standard electrode potential than a semiconductor material of the oxide semiconductor, a lower electron affinity than the semiconductor material of the oxide semiconductor, or a larger band gap than the semiconductor material of the oxide semiconductor. The insulating layer includes at least one of a silicon-based oxide or a silicon-based nitride, and the insulating layer includes a portion which contacts with an upper surface of the barrier layer.

    Abstract translation: 半导体器件包括:衬底,包括设置在衬底上的氧化物半导体的半导体层,设置在半导体层上的阻挡层和设置在阻挡层上的绝缘层。 半导体层包括氧化物半导体,并且阻挡层包括具有比氧化物半导体的半导体材料低的标准电极电位的材料,比氧化物半导体的半导体材料低的电子亲和力或比 氧化物半导体的半导体材料。 绝缘层包括硅基氧化物或硅基氮化物中的至少一种,并且绝缘层包括与阻挡层的上表面接触的部分。

    Receiver for high-speed wireless communication system and control method thereof
    40.
    发明授权
    Receiver for high-speed wireless communication system and control method thereof 有权
    高速无线通信系统接收机及其控制方法

    公开(公告)号:US08416897B2

    公开(公告)日:2013-04-09

    申请号:US12561076

    申请日:2009-09-16

    Abstract: An apparatus for reducing power consumption of a receiver in a high-speed wireless communication system and a control method thereof are provided. The apparatus for processing a signal in a receiver of a wireless communication system includes a carrier sensor configured to sense a carrier used in the wireless communication system, a decoder configured to decode the detected carrier signal to a signal and data, and a controller configured to control supplying power and a clock only to the carrier sensor during carrier sensing, and supplying power and a clock to an overall receiver when a carrier is sensed.

    Abstract translation: 提供一种用于降低高速无线通信系统中的接收机的功耗的装置及其控制方法。 用于处理无线通信系统的接收机中的信号的装置包括被配置为感测在无线通信系统中使用的载波的载波传感器,被配置为将检测到的载波信号解码为信号和数据的解码器,以及控制器, 在载波检测期间仅控制向载波传感器提供功率和时钟,并且当检测到载波时,向整个接收机提供功率和时钟。

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