公开(公告)号：US07479695B2

公开(公告)日：2009-01-20

申请号：US11375302

申请日：2006-03-14

Applicant: Mark Adam Bachman ,  David L. Crouthamel

Inventor： Mark Adam Bachman ,  David L. Crouthamel

IPC: H01L23/34

CPC classification number: H01L21/563 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/17 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: An assembly comprises a stiffener, a circuit substrate and an integrated circuit (IC) chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers the first region, while the IC chip overlies at least a portion of each of the first and second regions. Moreover, the assembly further comprises a plurality of first solder bumps and a plurality of second solder bumps. The first solder bumps contact both the IC chip and the circuit substrate. The second solder bumps are larger than the first solder bumps, contact the IC chip and are disposed above the second region of the stiffener.

Abstract translation: 组件包括加强件，电路基板和集成电路（IC）芯片。 加强件具有带有第一区域和第二区域的表面。 电路基板覆盖第一区域，而IC芯片覆盖第一和第二区域中的每一个的至少一部分。 此外，组件还包括多个第一焊料凸块和多个第二焊料凸块。 第一焊料凸块与IC芯片和电路基板接触。 第二焊料凸块大于第一焊料凸块，与IC芯片接触并设置在加强件的第二区域之上。

公开(公告)号：US20080197587A1

公开(公告)日：2008-08-21

申请号：US12070116

申请日：2008-02-14

Applicant: Mark Adam Nowak

Inventor： Mark Adam Nowak

IPC: B62B1/12 ,  B62B1/16 ,  F16M11/42 ,  B67D5/00

CPC classification number: F16M11/42 ,  B62B1/008 ,  B62B1/264 ,  B62B2202/02 ,  F16M11/245 ,  F16M2200/08

Abstract: Combination cart and stand device comprised of a main frame assembly, a wheel assembly operatively coupled proximate to one end of the main frame assembly, and inner and outer support members pivotally coupled to the main frame assembly at a location distal from said wheel assembly wherein the main frame assembly, the inner support member, and the outer support member nest together to form a folded cart configuration while the main frame supports a liquid dispensing container which is transported by wheels of the wheel assembly rolling along an underlying surface of the device and wherein the inner and outer support members pivot apart and the main frame assembly pivots to an inverted elevated position for forming a stand configuration for supporting the liquid dispensing container in an elevated liquid dispensing position. Other types of containers can also be employed with the combination cart and stand device.

Abstract translation: 组合推车和支架装置，包括主框架组件，靠近主框架组件的一端可操作地联接的车轮组件，以及在远离所述车轮组件的位置枢转地联接到主框架组件的内部和外部支撑构件，其中， 主框架组件，内部支撑构件和外部支撑构件嵌套在一起以形成折叠的推车构造，同时主框架支撑液体分配容器，该液体分配容器由沿着装置的下表面滚动的轮组件的轮子传送，并且其中 内部和外部支撑构件枢转分开，并且主框架组件枢转到倒置的升高位置，以形成用于将液体分配容器支撑在升高的液体分配位置中的支架构型。 其他类型的容器也可以与组合推车和支架装置一起使用。

公开(公告)号：US20080046260A1

公开(公告)日：2008-02-21

申请号：US11501151

申请日：2006-08-07

Applicant: Jeffrey Brian Ghielmetti ,  Cynthia Lynn Ghielmetti ,  Daniel M. Fischler ,  Mark E. Michels ,  Mark Adam Buxbaum

Inventor： Jeffrey Brian Ghielmetti ,  Cynthia Lynn Ghielmetti ,  Daniel M. Fischler ,  Mark E. Michels ,  Mark Adam Buxbaum

IPC: G06Q10/00 ,  G06Q30/00

CPC classification number: G06Q10/00 ,  G06Q50/18

Abstract: An automated litigation discovery method and system are described. Data having a number of files is electronically gathered from different sources. The gathered data is automatically processed using a processor. The processor identifies software application files and compares the software application files to a database having a number of pre-existing files. If the software application file matches a pre-existing file in the database, then the software application file is removed. Also, the processor identifies and marks the duplicate files. The processed data is transmitted to a reviewer. The reviewer reviews the processed data.

Abstract translation: 描述了自动诉讼发现方法和系统。 具有多个文件的数据是从不同来源进行电子收集的。 使用处理器自动处理收集的数据。 处理器识别软件应用程序文件，并将软件应用程序文件与具有多个预先存在的文件的数据库进行比较。 如果软件应用程序文件与数据库中的一个预先存在的文件相匹配，则删除软件应用程序文件。 此外，处理器识别并标记重复文件。 处理的数据被传送给审阅者。 审阅者审查已处理的数据。

公开(公告)号：US07328830B2

公开(公告)日：2008-02-12

申请号：US10741155

申请日：2003-12-19

Applicant: Mark Adam Bachman ,  Daniel Patrick Chesire ,  Sailesh Mansinh Merchant

Inventor： Mark Adam Bachman ,  Daniel Patrick Chesire ,  Sailesh Mansinh Merchant

IPC: B23K31/02

CPC classification number: H01L21/02063 ,  H01L21/31116 ,  H01L21/32136 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05022 ,  H01L2224/05093 ,  H01L2224/05096 ,  H01L2224/05554 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11901 ,  H01L2224/13006 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8501 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00

Abstract: An integrated circuit structure and a method for fabricating the structure. The method comprises forming a copper bond pad for attaching the integrated circuit to a package. Copper oxide is removed from the pad by reduction in a hydrogen ion atmosphere. For attaching the integrated circuit to a bump-bonding package an under-bump metallization layer is formed over the reduced copper pad and a solder bump formed thereover. The process can also be employed in a wire bonding process by forming an aluminum layer overlying the cleaned copper pad. The structure of the present invention comprises a copper pad formed in a substrate. A passivation layer defining an opening therein overlies the copper pad. A under-bump metallization layer is disposed in the opening and a solder bump overlies the metallization layer. Alternatively, the structure further comprises an aluminum pad disposed overlying the reduced copper pad.

Abstract translation: 集成电路结构及其制造方法。 该方法包括形成用于将集成电路附接到封装的铜焊盘。 通过在氢离子气氛中还原，将铜氧化物从垫中除去。 为了将集成电路连接到凸块焊接封装，在减小的铜焊盘上形成凸起下金属化层，并在其上形成焊料凸块。 该方法也可以通过形成覆盖在清洁的铜垫上的铝层在引线接合工艺中使用。 本发明的结构包括形成在基板中的铜焊盘。 限定其中的开口的钝化层覆盖在铜焊盘上。 凸起下金属化层设置在开口中，并且焊料凸块覆盖在金属化层上。 或者，该结构还包括设置在还原铜垫上的铝垫。

公开(公告)号：USD556076S1

公开(公告)日：2007-11-27

申请号：US29276105

申请日：2007-01-16

Applicant: Bradford Brian Jensen ,  Mark Adam Goldy

Designer： Bradford Brian Jensen ,  Mark Adam Goldy

公开(公告)号：US20060272827A1

公开(公告)日：2006-12-07

申请号：US11349014

申请日：2006-02-07

Applicant: Mark Adam ,  Michael Carmody ,  Matthew Jabs ,  Robert O'Brien ,  Dennis Jiral ,  Harold Payne

Inventor： Mark Adam ,  Michael Carmody ,  Matthew Jabs ,  Robert O'Brien ,  Dennis Jiral ,  Harold Payne

IPC: E21B43/00 ,  E21B23/02

CPC classification number: E21B21/10 ,  E21B34/14 ,  E21B43/103

Abstract: An apparatus to protect the mounting area of casing and a locating profile and optionally a sliding sleeve valve and a flow path from the outside of the valve to the annulus when subsequent attachment of an expanded liner is intended and the expanded liner is to be cemented in place. A barrier sleeve, nose, and outer sleeve define a sealed cavity having a loose incompressible material inside that covers the mounting location on the casing. A locating profile and an optional sliding sleeve valve and a flow path from the outside of the valve to the annulus can be provided. The cementing of the casing takes place through the barrier sleeve. After the cementing, the sleeve and nose are drilled out and the incompressible material is removed to the surface with the drill cuttings. A liner is inserted in the casing and is preferably expanded into sealing contact with the mounting location on the casing. After expansion a cement retainer positioned at the bottom of the expanded liner and the sliding sleeve located either above the mounting location of the liner in the casing shoe or in the liner below the mounted top section allow cement to be delivered outside the expanded liner and the displaced wellbore fluid to return into the casing through so that the liner can be cemented. The cement retainer can be delivered with either the liner or the expansion tools to allow expansion and cementing in a single trip. A shifting tool can be run on the expansion string to actuate the sliding sleeve and if necessary to allow for cement to be pumped from the drill string into the annulus through the sliding sleeve. The cement retainer can be milled out in a separate trip.

公开(公告)号：USD522706S1

公开(公告)日：2006-06-06

申请号：US29208743

申请日：2004-07-01

Applicant: Duncan Ross Stewart ,  Jon Stewart-Miller ,  David Funnell ,  Mark Adam Stewart

Designer： Duncan Ross Stewart ,  Jon Stewart-Miller ,  David Funnell ,  Mark Adam Stewart

公开(公告)号：US06960836B2

公开(公告)日：2005-11-01

申请号：US10675260

申请日：2003-09-30

Applicant: Mark Adam Bachman ,  Daniel Patrick Chesire ,  Sailesh Mansinh Merchant ,  John William Osenbach ,  Kurt George Steiner

Inventor： Mark Adam Bachman ,  Daniel Patrick Chesire ,  Sailesh Mansinh Merchant ,  John William Osenbach ,  Kurt George Steiner

IPC: H01L21/60 ,  H01L23/00 ,  H01L23/485 ,  H01L23/52

CPC classification number: H01L24/05 ,  H01L21/768 ,  H01L23/562 ,  H01L24/03 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05093 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2224/05552

Abstract: Disclosed herein is a reinforcing system and method for reinforcing a contact pad of an integrated circuit. Specifically exemplified is a system and method that comprises a reinforcing structure interposed between a top contact pad layer and an underlying metal layer.

Abstract translation: 本文公开了一种用于加强集成电路的接触焊盘的增强系统和方法。 具体示出的是包括插入在顶部接触垫层和下面的金属层之间的加强结构的系统和方法。

公开(公告)号：USD432651S

公开(公告)日：2000-10-24

申请号：US107984

申请日：1999-07-16

Applicant: Deborah Ann Wiechman ,  Mark Adam Wiechman

Designer： Deborah Ann Wiechman ,  Mark Adam Wiechman

公开(公告)号：US10000960B2

公开(公告)日：2018-06-19

申请号：US15224572

申请日：2016-07-31

Applicant: Ralph Carl Angiuli ,  Bradley Lee Lightner ,  Mark Adam Bullock

Inventor： Ralph Carl Angiuli ,  Bradley Lee Lightner ,  Mark Adam Bullock

IPC: E05F15/00 ,  E05F15/686 ,  E05F15/40 ,  E05D13/00 ,  E05D15/24

CPC classification number: E05F15/686 ,  E05D13/1215 ,  E05D15/24 ,  E05F15/40 ,  E05Y2201/216 ,  E05Y2400/32 ,  E05Y2900/106

Abstract: An operator for moving a barrier between closed and open positions mounted on, or close to, the counterbalance for said barrier. The operator is connected to the counterbalance shaft and lifts the barrier by rotating the counterbalance shaft with attached cable drums and thereby takes up cable connected to the bottom of the door. There is an upper cable connected to the top of the door through a cable drum in the operator. A power spring biases the operator cable drum to always take up the upper cable, keeping it wound. The operator cable drum is connected to the motor through a clutch which when engaged allows the operator to pull the door closed. While the door is closing the clutch can be disengaged to allow the operator cable drum to take up and then pay out the upper cable connected to the top of the door as needed.