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公开(公告)号:US20050201669A1
公开(公告)日:2005-09-15
申请号:US11124450
申请日:2005-05-05
申请人: David Welch , Radhakrishnan Nagarajan , Fred Kish , Mark Missey , Vincent Dominic , Atul Mathur , Frank Peters , Charles Joyner , Richard Schneider , Ting-Kuang Chiang
发明人: David Welch , Radhakrishnan Nagarajan , Fred Kish , Mark Missey , Vincent Dominic , Atul Mathur , Frank Peters , Charles Joyner , Richard Schneider , Ting-Kuang Chiang
IPC分类号: G02B6/12 , G02B6/34 , G02F1/017 , H01S5/026 , H01S5/0625 , H01S5/0683 , H01S5/12 , H01S5/20 , H01S5/22 , H01S5/34 , H01S5/40 , H01S5/50 , H04B10/12 , H04B10/145 , H04B10/158 , H04B10/17 , H04J14/02
CPC分类号: H04B10/2914 , B82Y20/00 , G02B6/12004 , G02B6/12007 , G02B6/12011 , G02B6/12019 , G02B6/12023 , G02B6/12026 , G02B6/12028 , G02B6/1203 , G02B6/12033 , G02B6/4249 , G02F1/01725 , G02F2001/0175 , G02F2001/01758 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/0425 , H01S5/06256 , H01S5/06258 , H01S5/0683 , H01S5/101 , H01S5/1014 , H01S5/12 , H01S5/1228 , H01S5/183 , H01S5/2077 , H01S5/22 , H01S5/2224 , H01S5/227 , H01S5/3404 , H01S5/3408 , H01S5/34306 , H01S5/4025 , H01S5/4031 , H01S5/4087 , H01S5/50 , H01S5/5072 , H04B10/25 , H04B10/50 , H04B10/675 , H04J14/02
摘要: An optical transport network comprises a monolithic transmitter photonic integrated circuit (TxPIC) InP-based chip and a monolithic receiver photonic integrated circuit (RxPIC) InP-based chip.
摘要翻译: 光传输网络包括单片发射器光子集成电路(TxPIC)基于InP的芯片和单片接收器光子集成电路(RxPIC)InP基芯片。
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公开(公告)号:US20050117834A1
公开(公告)日:2005-06-02
申请号:US11018162
申请日:2004-12-21
CPC分类号: G02B6/12011 , G02B6/12016 , G02B6/12019 , G02B6/12023 , G02B6/132 , G02B6/42 , G02B2006/12097 , G02B2006/12176 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/1014 , H01S5/2213 , H01S5/2231 , H01S5/227 , H01S5/4031 , H01S5/4087
摘要: A photonic integrated circuit (PIC) comprises a plurality of integrated optically coupled components formed in a surface of the PIC and a passivating layer overlies at least a portion of the PIC surface. The overlying passivating layer comprises a material selected from the group consisting of BCB, ZnS and ZnSe. Also, when the circuits are PIC chips are die in the semiconductor wafer, a plurality of linear cleave streets are formed in a wafer passivation layer where a pattern of the cleave streets define separate PIC chips in the wafer for their subsequent singulation from the wafer.
摘要翻译: 光子集成电路(PIC)包括形成在PIC的表面中的多个集成的光耦合部件,钝化层覆盖PIC表面的至少一部分。 上覆钝化层包括选自BCB,ZnS和ZnSe的材料。 此外,当电路是PIC芯片在半导体晶片中死亡时,在晶片钝化层中形成多个线性切割街道,其中劈裂街道的图案在晶片中限定了用于随后从晶片分离的单独的PIC芯片。
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公开(公告)号:US20050025409A1
公开(公告)日:2005-02-03
申请号:US10852988
申请日:2004-05-25
申请人: David Welch , Vincent Dominic , Fred Kish , Mark Missey , Radhakrishnan Nagarajan , Atul Mathur , Frank Peters , Robert Taylor , Matthew Mitchell , Alan Nilsson , Stephen Grubb , Richard Schneider , Charles Joyner , Jonas Webjorn , Ting-Kuang Chiang , Robert Grencavich , Vinh Nguyen , Donald Pavinski , Marco Sosa
发明人: David Welch , Vincent Dominic , Fred Kish , Mark Missey , Radhakrishnan Nagarajan , Atul Mathur , Frank Peters , Robert Taylor , Matthew Mitchell , Alan Nilsson , Stephen Grubb , Richard Schneider , Charles Joyner , Jonas Webjorn , Ting-Kuang Chiang , Robert Grencavich , Vinh Nguyen , Donald Pavinski , Marco Sosa
IPC分类号: G02B6/12 , G02B6/34 , G02F1/017 , H01L31/12 , H01S3/00 , H01S3/13 , H01S5/00 , H01S5/026 , H01S5/0625 , H01S5/0683 , H01S5/12 , H01S5/20 , H01S5/22 , H01S5/34 , H01S5/40 , H01S5/50 , H04B10/00 , H04B10/04 , H04B10/145 , H04B10/17 , H04J14/02
CPC分类号: G02B6/12011 , B82Y20/00 , G01R31/31728 , G01R31/318511 , G02B6/12004 , G02B6/12007 , G02B6/12019 , G02B6/12021 , G02B6/12023 , G02B6/12026 , G02B6/12028 , G02B6/12033 , G02B6/131 , G02B6/136 , G02B6/4204 , G02F1/01725 , G02F2001/0175 , G02F2001/01758 , G02F2203/69 , H01L31/125 , H01S5/0014 , H01S5/0085 , H01S5/02248 , H01S5/026 , H01S5/0262 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/06256 , H01S5/06258 , H01S5/0683 , H01S5/06832 , H01S5/12 , H01S5/1228 , H01S5/2077 , H01S5/22 , H01S5/3408 , H01S5/4031 , H01S5/4087 , H01S5/50 , H04B10/2914 , H04B10/50 , H04J14/02 , H04J14/0246 , H04J14/025 , H04J14/0258 , H04J14/0265 , H04J14/0276 , H04J14/0282
摘要: A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.
摘要翻译: 具有形成在芯片的主表面上的多个电光部件的光子集成电路(PIC)芯片和包括在芯片的主表面上延伸的基板的基板,该基板在基板和主体之间形成气隙 表面,基板支持电引线,用于电连接到芯片主表面上的一些电光元件。
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