公开(公告)号：US07600547B2

公开(公告)日：2009-10-13

申请号：US11202639

申请日：2005-08-12

申请人： Dong Yol Yang ,  Hyo Chan Kim ,  Sang Ho Lee ,  Seung Kyo Park

发明人： Dong Yol Yang ,  Hyo Chan Kim ,  Sang Ho Lee ,  Seung Kyo Park

IPC分类号： B32B37/18 ,  B32B41/00

CPC分类号： B29C64/141 ,  B33Y30/00 ,  Y10T156/12 ,  Y10T156/1749

摘要： The variable lamination rapid prototyping apparatus of the present invention includes a first feeding means which longitudinally reciprocates a sheet, a second feeding means which is provided under the first feeding means and reciprocates in a direction transverse to the sheet, and a rotating means which is coupled to the second feeding means and rotates around an axis parallel to the transverse direction of the sheet. The apparatus further includes a translation means which is linked to the rotating means, a cutting means which is coupled to the translation means, and a stacking means which subsequently stacks a plurality of cut sheets, thus forming the 3-dimensional object. The apparatus further includes a control means which previously stores data about the object therein and controls the above-mentioned plurality of means based on the data. Because a hot wire is provided in a parallelogram link structure, superior cutting accuracy and the stability are ensured. Furthermore, because the link structure is adjustable in length, it is possible to easily cut a sheet regardless of the size of the sheet.

摘要翻译： 本发明的可变层压快速成型装置包括一个纵向往复运动的第一进给装置，一个设置在第一进给装置下方并沿横向于该片材的方向往复运动的第二进给装置， 到第二进给装置并围绕与片材的横向方向平行的轴线旋转。 该装置还包括连接到旋转装置的平移装置，联接到平移装置的切割装置和随后堆叠多个切割片材的堆叠装置，从而形成3维物体。 该装置还包括控制装置，其预先存储关于其中的对象的数据，并基于该数据控制上述多个装置。 由于以平行四边形连杆结构设置热丝，因此确保了切割精度和稳定性。 此外，由于连杆结构的长度可调节，所以可以容易地切割片材，而与片材的尺寸无关。

公开(公告)号：US20090236752A1

公开(公告)日：2009-09-24

申请号：US12051625

申请日：2008-03-19

申请人： Taewoo Lee ,  Sang-Ho Lee ,  SeungYun Ahn

发明人： Taewoo Lee ,  Sang-Ho Lee ,  SeungYun Ahn

IPC分类号： H01L23/52

CPC分类号： H01L23/5385 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/5384 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package-on-package system includes: providing an interposer substrate; mounting a base substrate under the interposer substrate and having a first integrated circuit die connected thereto; forming an encapsulant between the interposer substrate and the base substrate, the encapsulant encapsulating the first integrated circuit die; and forming a via z-interconnection extending through the encapsulant and one of the substrates to the other of the substrates.

摘要翻译： 包装封装系统包括：提供插入器衬底; 将基底基板安装在所述插入器基板下方并具有与其连接的第一集成电路管芯; 在所述插入器基板和所述基底基板之间形成密封剂，所述密封剂封装所述第一集成电路管芯; 以及形成通过所述密封剂和所述衬底中的一个延伸到另一个衬底的通孔z-互连。

公开(公告)号：US20090190606A1

公开(公告)日：2009-07-30

申请号：US12034568

申请日：2008-02-20

申请人： Sang Ho Lee ,  Min Young Chung ,  Tae-Jin Lee ,  Hyun Seung Choo

发明人： Sang Ho Lee ,  Min Young Chung ,  Tae-Jin Lee ,  Hyun Seung Choo

IPC分类号： H04L12/403

CPC分类号： H04Q11/0067 ,  H04J3/0682 ,  H04Q2011/0064 ,  H04Q2011/0088

摘要： Disclosed is a system and a method for polling in an Ether net Passive Optical Network (EPON). The system includes: multiple Optical Network Units (ONUs) for sharing optical channels of the EPON with one another and transmitting traffic; and an Optical Line Terminal (OLT) for discriminating a plurality of ONUs gaining access to the EPON among the multiple ONUs and then collecting routing information on the plurality of ONUs gaining access to the EPON, and for classifying the plurality of ONUs gaining access to the EPON into two or more ONU groups according to the collected routing information and then carrying out forming a polling cycle and allocating bandwidth on each ONU group. Therefore, a transmission idle period in a traffic channel is not only minimized, but an availability ratio of traffic channels can also be maximized.

摘要翻译： 公开了一种在以太网无源光网络（EPON）中轮询的系统和方法。 该系统包括：多个光网络单元（ONU），用于共享EPON的光信道并传输业务; 以及光线路终端（OLT），用于区分多个ONU中获得对EPON的访问的多个ONU，然后收集对获得对EPON的访问的多个ONU的路由信息​​，并且对多个ONU进行访问 EPON根据收集的路由信息​​分成两个或更多个ONU组，然后执行轮询周期并在每个ONU组上分配带宽。 因此，业务信道中的传输空闲时段不仅最小化，而且业务信道的可用率也可以最大化。

公开(公告)号：US20090057864A1

公开(公告)日：2009-03-05

申请号：US12201896

申请日：2008-08-29

申请人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L23/488 ,  H01L21/58

CPC分类号： H01L24/81 ,  H01L23/552 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/8592 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00

摘要： A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.

摘要翻译： 一种用于制造集成电路封装系统的方法，包括：通过在一侧形成的电互连，提供包括耦合到基底基板的第一集成电路的基底封装; 以及将偏移封装安装在所述基底封装上，所述偏移封装通过系统互连电耦合到所述基底衬底。

公开(公告)号：US20080242053A1

公开(公告)日：2008-10-02

申请号：US11694933

申请日：2007-03-30

申请人： Taewoo Lee ,  Sang-Ho Lee ,  BoHan Yoon

发明人： Taewoo Lee ,  Sang-Ho Lee ,  BoHan Yoon

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  H01L21/3043 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834

摘要： An integrated circuit system including: providing an integrated circuit wafer having an integrated circuit side and a backside; mounting a protective adhesive on the integrated circuit side of the integrated circuit wafer; removing material from the backside of the integrated circuit wafer; and dicing the integrated circuit wafer through the protective adhesive to form an integrated circuit die.

摘要翻译： 一种集成电路系统，包括：提供具有集成电路侧和背面的集成电路晶片; 在集成电路晶片的集成电路侧上安装保护性粘合剂; 从集成电路晶片的背面去除材料; 并且通过保护性粘合剂对集成电路晶片进行切割以形成集成电路管芯。

公开(公告)号：US07350395B2

公开(公告)日：2008-04-01

申请号：US11311106

申请日：2005-12-19

申请人： Sang Ho Lee

发明人： Sang Ho Lee

IPC分类号： G01M17/06

CPC分类号： G01M17/06

摘要： An apparatus for generating a road surface reaction force in a test apparatus for a steer-by-wire system includes a steering actuation unit, and actuators arranged in parallel to tie rods of the steering actuation unit. In accordance with this arrangement, there is an advantage of a reduced installation space. Also, it is possible to transmit the force of each actuator to the associated tie rod without loss, and thus, to accurately implement the generation of a road surface reaction force.

摘要翻译： 在用于线控转向系统的测试装置中产生路面反作用力的装置包括转向致动单元和与转向致动单元的拉杆平行布置的致动器。 根据这种安排，具有减小的安装空间的优点。 此外，可以不损失地将每个致动器的力传递到相关联的拉杆，从而准确地实现路面反作用力的产生。

公开(公告)号：US20080006921A1

公开(公告)日：2008-01-10

申请号：US11456554

申请日：2006-07-10

申请人： Soo-San Park ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L23/02 ,  H01L23/52

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/06183 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit packaging system with ultra-thin die is provided including providing an ultra-thin integrated circuit stack, having a vertical sidewall contact, including providing a semiconductor wafer having an active side, forming a solder bump on the active side of the semiconductor wafer, forming a support layer over the solder bump and the active side of the semiconductor wafer, forming an ultra-thin wafer from the semiconductor wafer and singulating the ultra-thin integrated circuit stack for exposing the vertical sidewall contact, mounting the ultra-thin integrated circuit stack on a substrate, and coupling the substrate to the vertical sidewall contact.

摘要翻译： 提供一种具有超薄管芯的集成电路封装系统，包括提供具有垂直侧壁接触的超薄集成电路堆叠，包括提供具有有源侧的半导体晶片，在半导体晶片的有源侧上形成焊料凸块 在焊料凸块和半导体晶片的有源侧上形成支撑层，从半导体晶片形成超薄晶片，并且对超薄集成电路堆叠进行单片化，以暴露垂直侧壁接触，安装超薄集成 电路堆叠，并将衬底耦合到垂直侧壁接触。

公开(公告)号：US20070263194A1

公开(公告)日：2007-11-15

申请号：US11830439

申请日：2007-07-30

申请人： Byong-Cheol Park ,  Dong-Hwa Shin ,  Seung-Ki Chae ,  Sang-Ho Lee

发明人： Byong-Cheol Park ,  Dong-Hwa Shin ,  Seung-Ki Chae ,  Sang-Ho Lee

IPC分类号： G03F1/00

CPC分类号： G03F7/70425 ,  G03B27/42 ,  G03F7/70466

摘要： A method of exposing a wafer to a light comprises transferring an image onto a plurality of shot areas by irradiating a projection light, each of the plurality of shot areas including at least one die area defined on the wafer on which a photoresist film is formed, and scanning the at least one die area adjacent to an edge portion of the wafer by irradiating a scanning light.

摘要翻译： 将晶片暴露于光的方法包括通过照射投影光将图像转印到多个照射区域上，所述多个照射区域中的每一个包括限定在其上形成有光致抗蚀剂膜的晶片上的至少一个管芯区域， 并通过照射扫描光来扫描与晶片的边缘部分相邻的至少一个管芯区域。

公开(公告)号：US07293215B2

公开(公告)日：2007-11-06

申请号：US10653156

申请日：2003-09-03

申请人： Sang Ho Lee

发明人： Sang Ho Lee

IPC分类号： H04L1/18

CPC分类号： H04L69/16 ,  H04L1/0061 ,  H04L1/08 ,  H04L1/187 ,  H04L1/1874 ,  H04L1/1887 ,  H04L1/203 ,  H04L69/163 ,  H04L69/32 ,  H04W80/06 ,  H04W80/10

摘要： A system and method for controlling transmission of a radio packet data are disclosed. A time point when a congestion controlling mechanism, causing a TCP performance degradation with the mobile station and the PDSN, is previously detected, and when the mechanism is operated, it is quickly returned. Thus, in spite of a bit error (data loss) existing due to the characteristics of the radio data service, a reliable data service can be guaranteed.

摘要翻译： 公开了一种用于控制无线电分组数据传输的系统和方法。 预先检测到伴随移动台和PDSN造成TCP性能下降的拥塞控制机制的时间点，并且当该机制被操作时，其迅速返回。 因此，尽管由于无线电数据服务的特性而存在一个位错误（数据丢失），可以保证可靠的数据服务。

公开(公告)号：US07264008B2

公开(公告)日：2007-09-04

申请号：US10608074

申请日：2003-06-30

申请人： Dong-Hyun Kim ,  Sang-Ho Lee

发明人： Dong-Hyun Kim ,  Sang-Ho Lee

IPC分类号： B08B3/00

CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902

摘要： An apparatus for cleaning a wafer includes a plurality of holders for contacting and securing peripheral portions of a wafer, and for rotating the wafer, a first plate disposed to face a first surface of the wafer, the first plate having a plurality of first nozzles for spraying a first cleaning solution onto the first surface of the wafer, and a second plate disposed to face a second surface of the wafer that is opposite to the first surface, the second plate having a plurality of second nozzles for spraying a second cleaning solution onto the second surface of the wafer. In operation, the first and second plates and the wafer are rotated in opposite directions. The opposite rotation causes the cleaning solutions to flow abruptly thereby increasing a frictional force between the surfaces on the wafer and the cleaning solutions to improve the efficiency of the cleaning process.

摘要翻译： 一种用于清洁晶片的设备包括多个保持器，用于接触和固定晶片的周边部分，并且用于旋转晶片，设置成面对晶片的第一表面的第一板，所述第一板具有多个第一喷嘴， 将第一清洗溶液喷射到晶片的第一表面上，以及设置成面对与第一表面相对的晶片的第二表面的第二板，第二板具有多个第二喷嘴，用于将第二清洁溶液喷射到 晶片的第二表面。 在操作中，第一和第二板和晶片沿相反的方向旋转。 相反的旋转导致清洁溶液突然流动，从而增加了晶片表面和清洁溶液之间的摩擦力，以提高清洁过程的效率。