公开(公告)号：US07673386B2

公开(公告)日：2010-03-09

申请号：US12277927

申请日：2008-11-25

申请人： Alois Stelzl ,  Christian Bauer ,  Hans Krueger ,  Robert Hammedinger

发明人： Alois Stelzl ,  Christian Bauer ,  Hans Krueger ,  Robert Hammedinger

IPC分类号： H05K3/34 ,  H01L23/02

CPC分类号： H01L23/3192 ,  H01L23/3164 ,  H01L23/3185 ,  H01L24/10 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/10165 ,  H01L2224/16057 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/81 ,  H01L2224/13099 ,  H01L2924/00

摘要： The electrical and mechanical connection between a component chip and a carrier substrate having electrical wiring is realized by means of bumps. A support frame that is adapted in its height to the height of the bumps is arranged between the carrier substrate and the component chip and has a planar or planarized surface, so that it contacts closely to the bottom side of the component chip. Different covers are proposed for the additional encapsulation.

摘要翻译： 组件芯片和具有电线的载体基板之间的电气和机械连接通过凸块实现。 在承载基板和部件芯片之间布置有高度相对于凸块的高度的支撑框架，并且具有平面或平面化的表面，使得其紧密接触到部件芯片的底侧。 提出了不同的封装用于附加封装。

公开(公告)号：US07552532B2

公开(公告)日：2009-06-30

申请号：US10484942

申请日：2002-06-14

申请人： Alois Stelzl ,  Hans Krueger ,  Gregor Feiertag ,  Ernst Christl

发明人： Alois Stelzl ,  Hans Krueger ,  Gregor Feiertag ,  Ernst Christl

IPC分类号： H05K13/00

CPC分类号： H01L24/97 ,  H01L21/50 ,  H01L23/10 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49171 ,  Y10T29/49176 ,  Y10T29/49789 ,  H01L2224/81 ,  H01L2924/00

摘要： A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises attaching and electrically contacting a component based on a chip to a carrier comprising electrical connection surfaces, such that a front of the chip bearing component structures facing the carrier is arranged to clear it, covering a back of the chip with a film made of synthetic material, such that edges of the film overlap the chip; tightly bonding the film and carrier in an entire edge region around the chip; structuring the film such that the film is removed around the edge region in a continuous strip parallel to the edge region; and applying a hermetically sealing layer over the film, such that this layer hermetically terminates with the carrier in a contact region outside of the edge region.

摘要翻译： 提供了一种用于产生电子部件的密封封装的方法，其可以是光学和至少部分透光的部件或表面波部件，包括将基于芯片的部件附接并电接触到包括电连接 表面，使得面向载体的芯片轴承部件结构的前部布置成将其清除，用合成材料制成的膜覆盖芯片的后部，使得膜的边缘与芯片重叠; 在芯片周围的整个边缘区域紧密地结合薄膜和载体; 构造膜，使得膜在与边缘区域平行的连续条带中围绕边缘区域移除; 以及在所述膜上施加气密密封层，使得所述层在所述边缘区域外部的接触区域中与所述载体气密地终止。

公开(公告)号：US20090071710A1

公开(公告)日：2009-03-19

申请号：US12277927

申请日：2008-11-25

申请人： Alois Stelzl ,  Christian Bauer ,  Hans Krueger ,  Robert Hammedinger

发明人： Alois Stelzl ,  Christian Bauer ,  Hans Krueger ,  Robert Hammedinger

IPC分类号： H05K5/06 ,  H01L21/50

CPC分类号： H01L23/3192 ,  H01L23/3164 ,  H01L23/3185 ,  H01L24/10 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/10165 ,  H01L2224/16057 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/81 ,  H01L2224/13099 ,  H01L2924/00

摘要： The electrical and mechanical connection between a component chip and a carrier substrate having electrical wiring is realized by means of bumps. A support frame that is adapted in its height to the height of the bumps is arranged between the carrier substrate and the component chip and has a planar or planarized surface, so that it contacts closely to the bottom side of the component chip. Different covers are proposed for the additional encapsulation.

摘要翻译： 组件芯片和具有电线的载体基板之间的电气和机械连接通过凸块实现。 在承载基板和部件芯片之间布置有高度相对于凸块的高度的支撑框架，并且具有平面或平面化的表面，使得其紧密接触到部件芯片的底侧。 提出了不同的封装用于附加封装。

公开(公告)号：US09114979B2

公开(公告)日：2015-08-25

申请号：US13228971

申请日：2011-09-09

申请人： Michael Gerner ,  Hans Krueger ,  Alois Stelzl

发明人： Michael Gerner ,  Hans Krueger ,  Alois Stelzl

IPC分类号： H01L21/00 ,  B81C1/00

CPC分类号： B81C1/00333

摘要： A chip device is produced providing at least one wafer having a plurality of chip components. The wafer or wafers are separated into the individual chip components and/or into groups of chip components. The individual chip components and/or the groups of chip components are applied to a carrier element, in such a way that interspaces having a predetermined width are formed between the individual chip components and/or the groups of chip components. A polymer is introduced into the interspaces in order to form a composite element composed of the chip components and a polymer matrix. The composite element is separated in such a way that chip devices composed of in each case one of the chip components and at least one section of the polymer matrix are formed. The invention furthermore relates to a chip device produced by means of the method.

摘要翻译： 制造提供具有多个芯片部件的至少一个晶片的芯片器件。 将晶片或晶片分离成各个芯片组件和/或分组成芯片组件。 单个芯片组件和/或芯片组件组被施加到载体元件，使得在各个芯片组件和/或芯片组件组之间形成具有预定宽度的间隙。 将聚合物引入到间隙中以形成由芯片部件和聚合物基体组成的复合元件。 复合元件以这样的方式分离，即在每种情况下由芯片部件和聚合物基体的至少一个部分组成的芯片器件形成。 本发明还涉及通过该方法制造的芯片器件。

公开(公告)号：US20130214405A1

公开(公告)日：2013-08-22

申请号：US13818916

申请日：2011-07-29

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0077 ,  B81B2207/093 ,  B81C1/00269 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/0118 ,  H01L2224/16225 ,  H01L2224/8114 ,  H01L2924/1461 ,  H01L2924/00

摘要： A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.

摘要翻译： 部件包括基板，芯片和框架。 框架结合到基板，芯片搁置在框架上。 框架和芯片的部件上的密封层被设计成密封由衬底，芯片和金属框架包围的体积。

公开(公告)号：US20050121785A1

公开(公告)日：2005-06-09

申请号：US10500279

申请日：2002-12-18

申请人： Alois Stelzl ,  Hans Krueger ,  Ernst Christl

发明人： Alois Stelzl ,  Hans Krueger ,  Ernst Christl

IPC分类号： H01L23/04 ,  H01L21/56 ,  H03H9/10 ,  H03H9/25 ,  H01L21/48 ,  H01L23/48

CPC分类号： H03H9/1078 ,  H01L21/561 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2224/81 ,  H01L2924/00

摘要： For hermetic encapsulation of a component, which includes a chip with component structures applied on a substrate in a flip-chip construction, a material is applied onto the lower edge of the chip and regions of the substrate abutting the chip, and then a first continuous metal layer is applied on the back side of the chip and on the material, as well as on edge regions of the substrate abutting the material. For hermetic encapsulation, a second sealing metal layer is subsequently applied by a solvent-free process at least on those regions of the first metal layer that cover the material.

摘要翻译： 对于包括具有以倒装芯片结构施加在基板上的部件结构的芯片的部件的气密封装，将材料施加到芯片的下边缘和邻接芯片的基板的区域，然后施加第一连续 金属层被施加在芯片的背面和材料上，以及与衬底邻接的材料的边缘区域上。 为了气密封装，随后通过无溶剂工艺至少在覆盖材料的第一金属层的那些区域上施加第二密封金属层。

公开(公告)号：US06722030B1

公开(公告)日：2004-04-20

申请号：US09622351

申请日：2000-11-13

申请人： Alois Stelzl ,  Hans Krueger ,  Peter Demmer

发明人： Alois Stelzl ,  Hans Krueger ,  Peter Demmer

IPC分类号： H05K330

CPC分类号： H01L24/97 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/3025 ,  H03H3/08 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49789 ,  H01L2224/81

摘要： A method is provided for manufacturing a saw filter in which a carrier plate 10 that can be separated into base plates 2 is respectively provided with interconnects in the base plate regions A and these are contacted to the active structures of SAW chips 1 in flip-chip technique. A metal foil 3 or plastic film 4 is placed onto the chip-equipped carrier plate 10 and, for example, is pressure and heat treated such that it envelopes each chip 1 (except for the chip surface facing toward the carrier plate 10) and lies hermetically tight on the carrier plate surface in regions between the chips.

摘要翻译： 提供了一种用于制造锯切式过滤器的方法，其中可分离成基板2的承载板10在基板区域A中分别设置有互连，并且这些接触件与倒装芯片中的SAW芯片1的有源结构接触 技术。 将金属箔3或塑料膜4放置在装有芯片的承载板10上，并且例如进行压力和热处理，使得其包围每个芯片1（除了面向载体板10的芯片表面）并且位于 在芯片之间的区域中，在承载板表面上气密地密封。

公开(公告)号：US20100187949A1

公开(公告)日：2010-07-29

申请号：US12700446

申请日：2010-02-04

申请人： Wolfgang Pahl ,  Hans Krueger ,  Werner Ruile

发明人： Wolfgang Pahl ,  Hans Krueger ,  Werner Ruile

IPC分类号： H01L41/053 ,  H01L41/047 ,  H01L41/22

CPC分类号： H03H9/02834 ,  H03H9/02574 ,  Y10T29/42

摘要： A component has a substrate and a compensation layer. A lower face of the substrate is mechanically firmly connected to the compensation layer. The lower face of the substrate and the upper face of the compensation layer have a topography.

摘要翻译： 组件具有衬底和补偿层。 基板的下表面机械地牢固地连接到补偿层。 衬底的下表面和补偿层的上表面具有形貌。

公开(公告)号：US20110214905A1

公开(公告)日：2011-09-08

申请号：US12997867

申请日：2009-06-08

申请人： Wolfgang Pahl ,  Hans Krueger ,  Peter Demmer

发明人： Wolfgang Pahl ,  Hans Krueger ,  Peter Demmer

IPC分类号： H05K1/02 ,  H05K3/00

CPC分类号： H05K1/189 ,  H01L2224/16225 ,  H05K3/4691 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/09109 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T428/24322

摘要： A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.

摘要翻译： 一种电路板，包括电路载体，由非导电材料构成的覆盖层，包括布置在电路载体上的有机物质，至少部分地布置在覆盖层上的第一金属化层，其中第一金属化层具有柔性区域 。

公开(公告)号：US08098001B2

公开(公告)日：2012-01-17

申请号：US12700446

申请日：2010-02-04

申请人： Wolfgang Pahl ,  Hans Krueger ,  Werner Ruile

发明人： Wolfgang Pahl ,  Hans Krueger ,  Werner Ruile

IPC分类号： H01L41/08

CPC分类号： H03H9/02834 ,  H03H9/02574 ,  Y10T29/42

摘要： A component has a substrate and a compensation layer. A lower face of the substrate is mechanically firmly connected to the compensation layer. The lower face of the substrate and the upper face of the compensation layer have a topography.

摘要翻译： 组件具有衬底和补偿层。 基板的下表面机械地牢固地连接到补偿层。 衬底的下表面和补偿层的上表面具有形貌。