公开(公告)号：US20170297163A1

公开(公告)日：2017-10-19

申请号：US15635770

申请日：2017-06-28

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Thomas H. Osterheld ,  Hung Chen ,  Terrance Y. Lee

IPC: B24B37/04 ,  H01L21/321 ,  B24B57/02

CPC classification number: B24B37/044 ,  B24B57/02 ,  H01L21/30625 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092

Abstract: A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

公开(公告)号：US20160347002A1

公开(公告)日：2016-12-01

申请号：US15237140

申请日：2016-08-15

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Barry Lee Chin ,  Terrance Y. Lee

IPC: B29C67/00 ,  B33Y30/00 ,  B24D18/00 ,  B33Y50/02 ,  B33Y80/00 ,  B24B37/26 ,  B33Y10/00 ,  B29C35/08

CPC classification number: B29C64/209 ,  B24B37/26 ,  B24D18/00 ,  B24D18/009 ,  B29C35/0805 ,  B29C64/112 ,  B29C64/20 ,  B29C2035/0827 ,  B29K2075/00 ,  B29K2105/0002 ,  B29K2105/16 ,  B29K2509/02 ,  B29L2031/736 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

公开(公告)号：US12011801B2

公开(公告)日：2024-06-18

申请号：US18316216

申请日：2023-05-11

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Barry Lee Chin ,  Terrance Y. Lee

IPC: B33Y10/00 ,  B24B37/26 ,  B24D18/00 ,  B29C35/08 ,  B29C64/112 ,  B29C64/209 ,  B29C64/393 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00 ,  B29K75/00 ,  B29K105/00 ,  B29K105/16 ,  B29K509/02 ,  B29L31/00

CPC classification number: B24B37/26 ,  B24D18/00 ,  B24D18/009 ,  B29C35/0805 ,  B29C64/112 ,  B29C64/209 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00 ,  B29C2035/0827 ,  B29K2075/00 ,  B29K2105/0002 ,  B29K2105/16 ,  B29K2509/02 ,  B29L2031/736

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

公开(公告)号：US20240066660A1

公开(公告)日：2024-02-29

申请号：US18505913

申请日：2023-11-09

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Hari Soundararajan ,  Jianshe Tang ,  Shou-Sung Chang ,  Brian J. Brown ,  Yen-Chu Yang ,  You Wang ,  Rajeev Bajaj

IPC: B24B37/015 ,  B24B37/10 ,  B24B55/03

CPC classification number: B24B37/015 ,  B24B37/105 ,  B24B55/03 ,  H01L21/30625

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.

公开(公告)号：US11911870B2

公开(公告)日：2024-02-27

申请号：US17472006

申请日：2021-09-10

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Rajeev Bajaj ,  Yingdong Luo ,  Aniruddh Jagdish Khanna ,  You Wang ,  Daniel Redfield

IPC: B24B37/24 ,  B24B37/26 ,  B24B37/22

CPC classification number: B24B37/24 ,  B24B37/26 ,  B24B37/22

Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface to define a plurality of channels disposed between the polishing elements. Each of the polishing elements has a plurality of pore-features formed therein. Each of the polishing elements is formed of a pre-polymer composition and a sacrificial material composition. In some cases, a sample of the cured pre-polymer composition has a glass transition temperature (Tg) of about 80° C. or greater. A storage modulus (E′) of the cured pre-polymer composition at a temperature of 80° C. (E′80) can be about 200 MPa or greater.

公开(公告)号：US11685014B2

公开(公告)日：2023-06-27

申请号：US16529884

申请日：2019-08-02

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Ankit Vora ,  Boyi Fu ,  Venkat Hariharan ,  Mayu Yamamura ,  Mario Cornejo ,  Igor Abramson ,  Mo Yang ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla

IPC: B24B37/24 ,  C08F283/00 ,  B33Y10/00 ,  B29C64/112 ,  B33Y70/10 ,  B29L31/00 ,  B33Y80/00

CPC classification number: B24B37/24 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/10 ,  C08F283/008 ,  B29L2031/736 ,  B33Y80/00

Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

公开(公告)号：US11612978B2

公开(公告)日：2023-03-28

申请号：US16897184

申请日：2020-06-09

Applicant: Applied Materials, Inc.

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Mayu Felicia Yamamura ,  Daniel Redfield ,  Rajeev Bajaj ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  B33Y10/00 ,  C09D11/101 ,  C09D11/102 ,  B33Y70/00 ,  B29C64/112 ,  B33Y80/00 ,  H01L21/306 ,  B29L31/00 ,  B29K63/00 ,  B29K75/00

Abstract: Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US11597054B2

公开(公告)日：2023-03-07

申请号：US17478836

申请日：2021-09-17

Applicant: Applied Materials, Inc.

Inventor： Mayu Felicia Yamamura ,  Jason Garcheung Fung ,  Daniel Redfield ,  Rajeev Bajaj ,  Hou T. Ng

IPC: B24B37/26 ,  B24D18/00 ,  B29C64/393 ,  B29C64/112 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00 ,  B24B37/20 ,  B29L31/00

Abstract: A method of fabricating an object using an additive manufacturing system includes receiving data indicative of a desired shape of the object to be fabricated by droplet ejection. The desired shape defines a profile including a top surface and one or more recesses. Data indicative of a pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the pattern.

公开(公告)号：US11471999B2

公开(公告)日：2022-10-18

申请号：US16042016

申请日：2018-07-23

Applicant: Applied Materials, Inc.

Inventor： Ashavani Kumar ,  Ashwin Chockalingam ,  Sivapackia Ganapathiappan ,  Rajeev Bajaj ,  Boyi Fu ,  Daniel Redfield ,  Nag B. Patibandla ,  Mario Dagio Cornejo ,  Amritanshu Sinha ,  Yan Zhao ,  Ranga Rao Arnepalli ,  Fred C. Redeker

IPC: B24B37/24 ,  B24D11/04 ,  B24B37/26 ,  B24D18/00 ,  B24B37/16 ,  B24B37/20 ,  B33Y80/00 ,  B33Y10/00 ,  B29C64/112 ,  B33Y30/00 ,  H01L21/306

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

公开(公告)号：US20220055181A1

公开(公告)日：2022-02-24

申请号：US17407052

申请日：2021-08-19

Applicant: Applied Materials, Inc.

Inventor： Aniruddh Jagdish Khanna ,  Daniel Redfield ,  Ehud Chatow ,  Kenneth Mason ,  Steven Turner ,  Rajeev Bajaj ,  Kieran Joseph Rynne ,  Periya G. Gopalan

IPC: B24B37/32

Abstract: The present disclosure relates to retaining rings that include tunable chemical, material and structural properties, improved structural and fluid transport configurations and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a retaining ring with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure provide an advanced retaining ring that has discrete features and geometries, formed from at least two different materials that are formed from one or more polymers. The layers and/or regions of the advanced retaining ring may include a composite material structure, such as a polymer that contains at least one filler, such as metals, semimetal oxides, carbides, nitrides and/or polymer particles.