公开(公告)号：US06995044B2

公开(公告)日：2006-02-07

申请号：US10650692

申请日：2003-08-29

申请人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Atsushi Kikuchi

发明人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Atsushi Kikuchi

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H05K1/141 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/049 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.

公开(公告)号：US20050108003A1

公开(公告)日：2005-05-19

申请号：US11023333

申请日：2004-12-27

申请人： Atsushi Kikuchi ,  Hiroyuki Honma ,  Kyoya Tsutsui

发明人： Atsushi Kikuchi ,  Hiroyuki Honma ,  Kyoya Tsutsui

IPC分类号： G10L19/02 ,  G06F17/14 ,  G10L19/00 ,  G10L19/032 ,  H03M7/30 ,  H04N19/40 ,  H04N19/426 ,  H04N19/60 ,  H04N19/625 ,  H04N19/80 ,  H04N19/86

CPC分类号： G06F17/147

摘要： A signal processing device and method for performing a code string transform by transforming a time series signal with a frequency band from 0 to 20 kHz from a coding system into another, wherein the arithmetic operations of MDCT and IMDCT with a limited frequency band from 0 to 15 kHz are carried out at high speed by performing computations using an FFT operation with a short tap length in the IMDCT processing operation. This allows a reduced work area and a higher speed for arithmetic operations by reducing the number of multiplications and additions when performing MDCT operations, IMDCT operation and/or transforming code strings between different coding system.

摘要翻译： 一种信号处理装置和方法，用于通过将具有0至20kHz的频带的时间序列信号从编码系统转换为另一个来执行编码串变换，其中，具有从0到...的有限频带的MDCT和IMDCT的算术运算 通过在IMDCT处理操作中使用具有短抽头长度的FFT操作进行计算，高速执行15kHz。 这允许通过在执行MDCT操作，IMDCT操作和/或在不同编码系统之间转换代码串时减少乘法和加法的次数来减少工作区域和更高的算术运算速度。

公开(公告)号：US20050104545A1

公开(公告)日：2005-05-19

申请号：US10972968

申请日：2004-10-25

申请人： Atsushi Kikuchi

发明人： Atsushi Kikuchi

IPC分类号： H02P6/18 ,  H02P6/16 ,  H02P5/06

CPC分类号： H02P6/182

摘要： A sensorless brushless motor controls a rotational speed of a rotor by sequentially energizing a plurality of excitation coils constituting a stator in accordance with a logical product between an energizing timing signal generated on the basis of a back electromotive forces and a pulse width modulation signal to control a pulse width of the pulse width modulation signal, wherein back EMF induced in the plurality of excitation coils are respectively supplied to first and second comparator circuits each having a different reference voltage, respective output signals from the first and the second comparator circuits are sampled simultaneously at a predetermined cycle, and the energizing timing signal is generated at the time of the respective output signals from the first and the second comparator circuits becoming a high-level or a low-level during the sampling. The accuracy of rotor position detection by using a back EMF is improved.

摘要翻译： 无传感器无刷电动机根据基于反电动势产生的通电定时信号与脉冲宽度调制信号之间的逻辑积顺序激励构成定子的多个励磁线圈来控制转子的转速，以控制 脉冲宽度调制信号的脉冲宽度，其中在多个激励线圈中感应的反电动势分别被提供给具有不同参考电压的第一和第二比较器电路，来自第一和第二比较器电路的相应输出信号被同时采样 并且在采样期间在来自第一和第二比较器电路的各个输出信号变为高电平或低电平时产生激励定时信号。 通过使用反电动势进行转子位置检测的精度得到改善。

公开(公告)号：US06875638B2

公开(公告)日：2005-04-05

申请号：US10100011

申请日：2002-03-19

申请人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaru Nukiwa ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Takumi Ihara ,  Muneharu Morioka ,  Yukihiro Kuriki ,  Masaki Uchida

发明人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaru Nukiwa ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Takumi Ihara ,  Muneharu Morioka ,  Yukihiro Kuriki ,  Masaki Uchida

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/36 ,  H01L23/498 ,  H01L25/065 ,  H05K1/14 ,  H05K1/16 ,  H01L21/44

CPC分类号： H05K1/141 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/049 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.

摘要翻译： 包含无源元件的半导体器件的制造方法包括以下步骤：再分布板形成步骤在基板上形成包含无源元件的再分布板; 半导体元件安装步骤安装相对于基板在形成在再分布板的相对侧表面上的至少一个半导体元件; 基板分离步骤将基板与再分布板分离并暴露再分布板的另一个表面; 再分布板安装步骤通过从再分布板的另一表面暴露的电极焊盘将再分布板安装在封装板上。

公开(公告)号：US06794273B2

公开(公告)日：2004-09-21

申请号：US10331560

申请日：2002-12-31

申请人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

发明人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

IPC分类号： H01L2178

CPC分类号： H01L21/6836 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75315 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

公开(公告)号：US06627279B2

公开(公告)日：2003-09-30

申请号：US09847956

申请日：2001-05-02

申请人： Norihisa Hirota ,  Atsushi Kikuchi

发明人： Norihisa Hirota ,  Atsushi Kikuchi

IPC分类号： B29C4908

CPC分类号： B65D1/02 ,  B29B2911/1402 ,  B29B2911/14026 ,  B29B2911/14033 ,  B29B2911/1404 ,  B29B2911/14053 ,  B29B2911/14066 ,  B29B2911/1408 ,  B29B2911/14093 ,  B29B2911/14106 ,  B29B2911/1412 ,  B29B2911/14133 ,  B29B2911/14146 ,  B29C49/06 ,  B29C49/08 ,  B29C49/18 ,  B29C49/649 ,  B29C49/66 ,  B29C49/68 ,  B29K2067/00 ,  B29K2995/004 ,  B29K2995/0041 ,  B29L2031/716 ,  Y10S264/906 ,  Y10T428/1352

摘要： The invention provides a highly heat-stable polyester container and a method of manufacturing the polyester container, which can be treated by retort sterilization at a high temperature after filling food, a drink or the like in the container and sealing off it, and which has superior heat stability enough to prevent deformation and whitening due to heat shrinkage in a bottom portion of the container even when treated by the retort sterilization. In the polyester container, a barrel portion and a bottom portion of the container are heat-set, and at least the bottom portion of the container has an endothermic peak on a DSC curve in the range of not lower than about 150° C. but not higher than a melting start point.

公开(公告)号：US5246385A

公开(公告)日：1993-09-21

申请号：US842462

申请日：1992-02-27

申请人： Yoshifumi Chida ,  Mituaki Hayashi ,  Atsushi Kikuchi ,  Kenichi Hatakeyama

发明人： Yoshifumi Chida ,  Mituaki Hayashi ,  Atsushi Kikuchi ,  Kenichi Hatakeyama

IPC分类号： H01R13/648 ,  H01R13/658 ,  H01R43/00

CPC分类号： H01R13/6599 ,  H01R23/6873 ,  Y10S439/931

摘要： A connector comprises a socket portion which is subjected to surface treatment and a base portion which is not subjected to the surface treatment, or comprises a socket portion and a base portion subjected to different kinds of surface treatments. The socket and base portions are each provided with a coupling mechanism. The socket and base portions may be easily surface treated independently, after which they are coupled together, thereby forming a connector capable of preventing short circuit arising from surface treatments.

摘要翻译： 连接器包括经受表面处理的插座部分和不经过表面处理的基部，或包括承受不同种类的表面处理的插座部分和基部。 插座和基部分别设有耦合机构。 插座和底座部分可以独立地进行表面处理，然后将它们联接在一起，从而形成能够防止表面处理产生短路的连接器。

公开(公告)号：US4819192A

公开(公告)日：1989-04-04

申请号：US832990

申请日：1986-02-24

申请人： Tetsuzo Kuragano ,  Atsushi Kikuchi

发明人： Tetsuzo Kuragano ,  Atsushi Kikuchi

IPC分类号： G06T15/00 ,  G06T15/50 ,  G09B9/08

CPC分类号： G06T15/50 ,  G06T15/005

摘要： A method of displaying graphic image surface information data of an object lying within a three-dimensional space on a two-dimensional display screen when seen from a predetermined observing point is disclosed. A patch of the surface of an object is separated into plural triangular units, and image information data (luminance, visible-nonvisible, and distance) are all represented at the three apexes of each triangular unit area which includes a number of display pixels. The positional data at the three apexes are transformed from three- to two-dimensional space. The other image information data are calculated in accordance with interpolation calculation. Prior to the interpolation calculation a display area is determined and a triangular area including pixels to be processed is determined to reduce the processing time. This process is repeated for the entire surface to be displayed.

摘要翻译： 公开了一种在从预定观察点观察时，在二维显示屏上显示位于三维空间内的对象的图形图像表面信息数据的方法。 物体表面的斑块被分成多个三角形单元，并且图像信息数据（亮度，可视不可见和距离）都表示在包括多个显示像素的每个三角形单位区域的三个顶点处。 三个顶点的位置数据从三维空间变换为二维空间。 根据插补计算来计算其他图像信息数据。 在插值计算之前，确定显示区域，并且确定包括要处理的像素的三角形区域以减少处理时间。 对整个表面重复该过程进行显示。

公开(公告)号：US12111460B2

公开(公告)日：2024-10-08

申请号：US17595524

申请日：2020-05-22

申请人： Tomohiko Osaka ,  Ichiro Hayashi ,  Atsushi Kikuchi

发明人： Tomohiko Osaka ,  Ichiro Hayashi ,  Atsushi Kikuchi

IPC分类号： G02B26/08 ,  G02B3/14 ,  G02B26/00 ,  G02B27/64 ,  G03B13/36 ,  G03B30/00 ,  H02K41/035

CPC分类号： G02B26/0875 ,  G02B3/14 ,  G02B26/004 ,  G03B13/36 ,  G03B30/00 ,  H02K41/0356 ,  G02B27/646 ,  G03B2205/0007 ,  G03B2205/0069

摘要： This lens driving device is configured separately from a lens unit including a liquid lens, and is provided with: a fixed part; a movable part; a support part that supports the movable part with respect to the fixed part; a driving unit that is formed from a voice coil motor comprising a coil and a magnet and that moves the movable part in an optical axis direction with respect to the fixed part; and a lens deformation unit that is connected to the movable part and that applies, in association with the movement of the movable part, a force to the liquid lens in the optical axis direction. The movable part has a plurality of movable units, and the driving unit drives the movable units independently so as to change the curvature of the liquid lens or to change the optical axis of the liquid lens.

公开(公告)号：US20170232741A1

公开(公告)日：2017-08-17

申请号：US15431693

申请日：2017-02-13

申请人： Atsushi Kikuchi ,  Yoshitaka Fujinuma ,  Junichi Iwata

发明人： Atsushi Kikuchi ,  Yoshitaka Fujinuma ,  Junichi Iwata

IPC分类号： B41J2/14 ,  H01R12/77

CPC分类号： B41J2/1433 ,  B41J2002/14491 ,  H01R12/77 ,  H01R13/516 ,  H01R13/5213

摘要： A liquid discharge head includes a head body, a wiring member, a connector, and a protector. The head body discharges liquid. The wiring member transmits a signal to the head body. The connector is disposed at the wiring member to connect the wiring member to the head body. The protector covers the head body and the connector. The head body includes a fitting portion. The protector includes a fitting portion to fit the fitting portion of the head body in a fitting direction. The connector is disposed more backward than a leading end of the fitting portion of the protector in the fitting direction.