公开(公告)号：US20050104545A1

公开(公告)日：2005-05-19

申请号：US10972968

申请日：2004-10-25

申请人： Atsushi Kikuchi

发明人： Atsushi Kikuchi

IPC分类号： H02P6/18 ,  H02P6/16 ,  H02P5/06

CPC分类号： H02P6/182

摘要： A sensorless brushless motor controls a rotational speed of a rotor by sequentially energizing a plurality of excitation coils constituting a stator in accordance with a logical product between an energizing timing signal generated on the basis of a back electromotive forces and a pulse width modulation signal to control a pulse width of the pulse width modulation signal, wherein back EMF induced in the plurality of excitation coils are respectively supplied to first and second comparator circuits each having a different reference voltage, respective output signals from the first and the second comparator circuits are sampled simultaneously at a predetermined cycle, and the energizing timing signal is generated at the time of the respective output signals from the first and the second comparator circuits becoming a high-level or a low-level during the sampling. The accuracy of rotor position detection by using a back EMF is improved.

摘要翻译： 无传感器无刷电动机根据基于反电动势产生的通电定时信号与脉冲宽度调制信号之间的逻辑积顺序激励构成定子的多个励磁线圈来控制转子的转速，以控制 脉冲宽度调制信号的脉冲宽度，其中在多个激励线圈中感应的反电动势分别被提供给具有不同参考电压的第一和第二比较器电路，来自第一和第二比较器电路的相应输出信号被同时采样 并且在采样期间在来自第一和第二比较器电路的各个输出信号变为高电平或低电平时产生激励定时信号。 通过使用反电动势进行转子位置检测的精度得到改善。

公开(公告)号：US06875638B2

公开(公告)日：2005-04-05

申请号：US10100011

申请日：2002-03-19

申请人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaru Nukiwa ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Takumi Ihara ,  Muneharu Morioka ,  Yukihiro Kuriki ,  Masaki Uchida

发明人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaru Nukiwa ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Takumi Ihara ,  Muneharu Morioka ,  Yukihiro Kuriki ,  Masaki Uchida

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/36 ,  H01L23/498 ,  H01L25/065 ,  H05K1/14 ,  H05K1/16 ,  H01L21/44

CPC分类号： H05K1/141 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/049 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.

摘要翻译： 包含无源元件的半导体器件的制造方法包括以下步骤：再分布板形成步骤在基板上形成包含无源元件的再分布板; 半导体元件安装步骤安装相对于基板在形成在再分布板的相对侧表面上的至少一个半导体元件; 基板分离步骤将基板与再分布板分离并暴露再分布板的另一个表面; 再分布板安装步骤通过从再分布板的另一表面暴露的电极焊盘将再分布板安装在封装板上。

公开(公告)号：US06794273B2

公开(公告)日：2004-09-21

申请号：US10331560

申请日：2002-12-31

申请人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

发明人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

IPC分类号： H01L2178

CPC分类号： H01L21/6836 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75315 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

公开(公告)号：US5246385A

公开(公告)日：1993-09-21

申请号：US842462

申请日：1992-02-27

申请人： Yoshifumi Chida ,  Mituaki Hayashi ,  Atsushi Kikuchi ,  Kenichi Hatakeyama

发明人： Yoshifumi Chida ,  Mituaki Hayashi ,  Atsushi Kikuchi ,  Kenichi Hatakeyama

IPC分类号： H01R13/648 ,  H01R13/658 ,  H01R43/00

CPC分类号： H01R13/6599 ,  H01R23/6873 ,  Y10S439/931

摘要： A connector comprises a socket portion which is subjected to surface treatment and a base portion which is not subjected to the surface treatment, or comprises a socket portion and a base portion subjected to different kinds of surface treatments. The socket and base portions are each provided with a coupling mechanism. The socket and base portions may be easily surface treated independently, after which they are coupled together, thereby forming a connector capable of preventing short circuit arising from surface treatments.

摘要翻译： 连接器包括经受表面处理的插座部分和不经过表面处理的基部，或包括承受不同种类的表面处理的插座部分和基部。 插座和基部分别设有耦合机构。 插座和底座部分可以独立地进行表面处理，然后将它们联接在一起，从而形成能够防止表面处理产生短路的连接器。

公开(公告)号：US4819192A

公开(公告)日：1989-04-04

申请号：US832990

申请日：1986-02-24

申请人： Tetsuzo Kuragano ,  Atsushi Kikuchi

发明人： Tetsuzo Kuragano ,  Atsushi Kikuchi

IPC分类号： G06T15/00 ,  G06T15/50 ,  G09B9/08

CPC分类号： G06T15/50 ,  G06T15/005

摘要： A method of displaying graphic image surface information data of an object lying within a three-dimensional space on a two-dimensional display screen when seen from a predetermined observing point is disclosed. A patch of the surface of an object is separated into plural triangular units, and image information data (luminance, visible-nonvisible, and distance) are all represented at the three apexes of each triangular unit area which includes a number of display pixels. The positional data at the three apexes are transformed from three- to two-dimensional space. The other image information data are calculated in accordance with interpolation calculation. Prior to the interpolation calculation a display area is determined and a triangular area including pixels to be processed is determined to reduce the processing time. This process is repeated for the entire surface to be displayed.

摘要翻译： 公开了一种在从预定观察点观察时，在二维显示屏上显示位于三维空间内的对象的图形图像表面信息数据的方法。 物体表面的斑块被分成多个三角形单元，并且图像信息数据（亮度，可视不可见和距离）都表示在包括多个显示像素的每个三角形单位区域的三个顶点处。 三个顶点的位置数据从三维空间变换为二维空间。 根据插补计算来计算其他图像信息数据。 在插值计算之前，确定显示区域，并且确定包括要处理的像素的三角形区域以减少处理时间。 对整个表面重复该过程进行显示。

公开(公告)号：US20170232741A1

公开(公告)日：2017-08-17

申请号：US15431693

申请日：2017-02-13

申请人： Atsushi Kikuchi ,  Yoshitaka Fujinuma ,  Junichi Iwata

发明人： Atsushi Kikuchi ,  Yoshitaka Fujinuma ,  Junichi Iwata

IPC分类号： B41J2/14 ,  H01R12/77

CPC分类号： B41J2/1433 ,  B41J2002/14491 ,  H01R12/77 ,  H01R13/516 ,  H01R13/5213

摘要： A liquid discharge head includes a head body, a wiring member, a connector, and a protector. The head body discharges liquid. The wiring member transmits a signal to the head body. The connector is disposed at the wiring member to connect the wiring member to the head body. The protector covers the head body and the connector. The head body includes a fitting portion. The protector includes a fitting portion to fit the fitting portion of the head body in a fitting direction. The connector is disposed more backward than a leading end of the fitting portion of the protector in the fitting direction.

公开(公告)号：US09126797B2

公开(公告)日：2015-09-08

申请号：US14154227

申请日：2014-01-14

申请人： Atsushi Kikuchi ,  Takuya Sano ,  Takao Watanabe ,  Makoto Hidaka ,  Satoshi Saito ,  Shohichi Satoh ,  Tomomichi Hoshino ,  Kiyoshi Hata ,  Keisuke Sugiyama

发明人： Atsushi Kikuchi ,  Takuya Sano ,  Takao Watanabe ,  Makoto Hidaka ,  Satoshi Saito ,  Shohichi Satoh ,  Tomomichi Hoshino ,  Kiyoshi Hata ,  Keisuke Sugiyama

IPC分类号： B65H45/12 ,  B31F1/00 ,  B65H37/04 ,  B65H45/18 ,  B65H45/04

CPC分类号： B65H45/12 ,  B31F1/00 ,  B65H37/04 ,  B65H45/04 ,  B65H45/18 ,  B65H2301/51232 ,  B65H2701/13212 ,  B65H2801/27

摘要： The present invention is concerning to a sheet processing apparatus comprising: a pressing unit configured to provide additional folding to a fold line portion of a sheet bundle by pressing the fold line portion; a carriage unit configured to reciprocate the pressing unit in width directions of the sheet bundle; a guiding shaft configured to support the pressing unit and guides movement of the pressing unit; and a supporting unit configured to support the pressing unit and moves on a structure provided to the sheet processing apparatus.

摘要翻译： 本发明涉及一种片材处理设备，包括：按压单元，其构造成通过按压折叠线部分向片材折叠线的折叠线部分提供附加折叠; 滑架单元，其构造成使所述按压单元在所述薄片束的宽度方向上往复运动; 引导轴，其构造成支撑所述按压单元并引导所述按压单元的移动; 以及支撑单元，其构造成支撑所述按压单元并且在设置到所述片材处理设备的结构上移动。

公开(公告)号：US09061859B2

公开(公告)日：2015-06-23

申请号：US14160671

申请日：2014-01-22

申请人： Keisuke Sugiyama ,  Kiyoshi Hata ,  Atsushi Kikuchi ,  Tomomichi Hoshino ,  Makoto Hidaka ,  Shohichi Satoh ,  Satoshi Saito ,  Takao Watanabe ,  Takuya Sano

发明人： Keisuke Sugiyama ,  Kiyoshi Hata ,  Atsushi Kikuchi ,  Tomomichi Hoshino ,  Makoto Hidaka ,  Shohichi Satoh ,  Satoshi Saito ,  Takao Watanabe ,  Takuya Sano

IPC分类号： B31F1/00 ,  B65H45/04 ,  B65H45/18 ,  B65H45/16 ,  B65H37/04

CPC分类号： B65H45/04 ,  B31F1/00 ,  B31F1/0006 ,  B31F1/0012 ,  B31F1/0035 ,  B65H37/04 ,  B65H45/16 ,  B65H45/18 ,  B65H2301/51232 ,  B65H2701/13212 ,  B65H2801/27

摘要： A sheet processing apparatus includes: an abutting member that abuts against a sheet surface to bend a sheet; a first moving unit that moves the abutting member; a folding unit that performs a folding process on the sheet bent by the abutting member; a pressing unit that presses a folded portion of the sheet subjected to the folding process; a second moving unit that moves the pressing unit in a direction along a fold of the sheet; and a single operation unit that allows the first moving unit and the second moving unit to be operated.

摘要翻译： 片材处理装置包括：抵靠件，其抵靠片材表面弯曲片材; 移动所述邻接构件的第一移动单元; 折叠单元，其对由所述抵接构件弯曲的片材进行折叠处理; 按压单元，其压缩经受折叠处理的片材的折叠部分; 第二移动单元，其沿着所述片材的折叠方向移动所述按压单元; 以及允许第一移动单元和第二移动单元被操作的单个操作单元。

公开(公告)号：US20150115516A1

公开(公告)日：2015-04-30

申请号：US14508991

申请日：2014-10-07

申请人： Shohichi Satoh ,  Makoto Hidaka ,  Satoshi Saito ,  Mamoru Kambayashi ,  Tomomichi Hoshino ,  Atsushi Kikuchi ,  Kiyoshi Hata ,  Keisuke Sugiyama

发明人： Shohichi Satoh ,  Makoto Hidaka ,  Satoshi Saito ,  Mamoru Kambayashi ,  Tomomichi Hoshino ,  Atsushi Kikuchi ,  Kiyoshi Hata ,  Keisuke Sugiyama

IPC分类号： B65H37/04 ,  B65H43/00 ,  B65H45/18 ,  B65H29/70 ,  B65H37/06

CPC分类号： B31F1/0035 ,  B31F1/00 ,  B31F1/0006 ,  B65H31/34 ,  B65H45/04 ,  B65H45/12 ,  B65H45/18 ,  B65H2301/51232 ,  B65H2701/13212 ,  B65H2801/27 ,  G03G15/6541 ,  G03G2215/00877

摘要： A sheet processing apparatus comprises a pressing member configured to press a fold line portion of a folded sheet bundle; and moving unit configured to move a position of pressing by the pressing member in a direction of a fold line of the folded sheet bundle, wherein the moving unit is configured to stand by at a pressing start position in which the pressing member is in a non-pressing state, before the folded sheet bundle is conveyed to the pressing member.

摘要翻译： 片材处理设备包括：压制构件，其压制折叠的片材束的折叠部分; 以及移动单元，被构造成使所述按压构件在所述折叠的薄片束的折叠方向上移动的位置移动，其中，所述移动单元构造成在所述按压构件处于非压缩状态的按压开始位置待机， 在折叠的片材束被传送到按压构件之前。

公开(公告)号：US20130192207A1

公开(公告)日：2013-08-01

申请号：US13878054

申请日：2011-07-27

申请人： Kunihiro Chiba ,  Atsushi Kikuchi ,  Takeshi Miyamoto ,  Toshiki Sawaki ,  Masanori Watanabe ,  Hiroyuki Watanabe

发明人： Kunihiro Chiba ,  Atsushi Kikuchi ,  Takeshi Miyamoto ,  Toshiki Sawaki ,  Masanori Watanabe ,  Hiroyuki Watanabe

IPC分类号： F01N3/20

CPC分类号： F01N3/208 ,  F01N3/2066 ,  F01N2610/02 ,  F01N2610/14 ,  F01N2610/1493 ,  F01N2900/08 ,  Y02T10/24

摘要： [Problem] To provide a reducing agent supply apparatus that can quickly melt urea aqueous solution solidified in a reducing agent injection valve to allow early start of the injection control of urea aqueous solution, a method for controlling the reducing agent supply apparatus, and an exhaust gas purification apparatus.[Means for Resolution] reducing agent supply apparatus, including: a storage tank for storing liquid reducing agent; a pump for pumping the reducing agent; a reducing agent injection valve for injecting the reducing agent pumped by the pump in an exhaust pipe of an internal combustion engine; and a reducing agent passage connecting the pump to the reducing agent injection valve, wherein, when the internal combustion engine stops, a purge process of collecting the reducing agent in the reducing agent passage into the storage tank is performed, and wherein, on part of the reducing agent passage, a siphon function portion is provided for, even when, at the start of the internal combustion engine, the reducing agent injection valve is in injection failure due to solidification of the reducing agent in the reducing agent injection valve, causing some of the reducing agent to reach the reducing agent injection valve after the start of the pump to cause the solidified reducing agent to melt.

摘要翻译： 本发明提供一种还原剂供给装置，其能够快速地将在还原剂喷射阀中固化的尿素水溶液迅速地熔融，从而能够早期开始进行尿素水溶液的喷射控制，控制还原剂供给装置的方法和排气 气体净化装置。 [解决方法]还原剂供给装置，包括：储存液体还原剂的储罐; 用于泵送还原剂的泵; 用于将由泵泵送的还原剂注入内燃机的排气管的还原剂喷射阀; 以及将泵连接到还原剂喷射阀的还原剂通路，其中，当内燃机停止时，执行将还原剂通道中的还原剂收集到储罐中的净化过程，并且其中部分 还原剂通道，虹吸功能部分，即使在内燃机启动时，还原剂喷射阀由于还原剂喷射阀中的还原剂的固化而引起喷射故障，导致一些 的还原剂在泵启动后到达还原剂注入阀以使固化的还原剂熔化。