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    Waveguide bodies including redirection features and methods of producing same
    31.
    发明授权
    Waveguide bodies including redirection features and methods of producing same 有权
    波导体包括重定向特征及其生产方法

    公开(公告)号：US09442243B2

    公开(公告)日：2016-09-13

    申请号：US14101132

    申请日：2013-12-09

    Applicant: Cree, Inc.

    Inventor： Eric J. Tarsa

    IPC: G02B6/26 ,  F21V8/00 ,  G02B6/42

    CPC classification number: G02B6/0076 ,  G02B6/0016 ,  G02B6/0021 ,  G02B6/0031 ,  G02B6/0036 ,  G02B6/0068

    Abstract: According to one aspect, a waveguide includes a body exhibiting a total internal reflectance characteristic and having a first face and a second face opposite the first face wherein the first and second faces extend along a lateral direction and a coupling cavity adapted to receive a light emitting diode (LED) that is configured to direct light into the body. The body additionally includes an extraction feature disposed on one of the first and second faces and configured to direct light traveling through the body out of at least one of the first and second faces. The body further includes a redirection feature disposed at least in part between the first and second faces and disposed between the coupling cavity and the extraction feature along the lateral direction, and configured to redirect light traveling through the body laterally within the body.

    Abstract translation: 根据一个方面，波导包括具有全内反射特性并具有第一面和与第一面相对的第二面的主体，其中第一和第二面沿着横向方向延伸，耦合腔适于接收发光 二极管（LED），其被配置为将光引导到身体中。 身体另外包括设置在第一和第二面中的一个上的提取特征，并且被配置为将穿过身体的光引导出第一和第二面中的至少一个。 身体还包括重新定向特征，该重定向特征至少部分地设置在第一和第二表面之间，并且沿着横向方向设置在联接腔和提取特征之间，并且被配置为使在身体内侧向移动穿过身体的光重定向。

    Optical Waveguide Bodies and Luminaires Utilizing Same
    34.
    发明申请
    Optical Waveguide Bodies and Luminaires Utilizing Same 审中-公开
    光波导体和利用相同的灯具

    公开(公告)号：US20150177439A1

    公开(公告)日：2015-06-25

    申请号：US14577730

    申请日：2014-12-19

    Applicant: CREE, INC.

    Inventor： John W. Durkee ,  Kurt S. Wilcox ,  Eric J. Tarsa

    IPC: F21V8/00

    CPC classification number: G02B6/0021 ,  F21S8/061 ,  F21V7/0008 ,  F21V17/10 ,  F21V21/005 ,  F21V23/001 ,  F21V23/06 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2103/33 ,  F21Y2115/10 ,  G02B6/0031 ,  G02B6/0035 ,  G02B6/0036 ,  G02B6/0046 ,  G02B6/0048 ,  G02B6/0063 ,  G02B6/0078

    Abstract: A waveguide body comprises a central section, first and second side sections, and a coupling portion located in the central section. Each of said side sections extend away from the central section along opposing first and second directions, respectively. The coupling portion includes an elongate coupling cavity symmetric about a plane extending in a third direction transverse to the first and second directions and configured to receive a light source. The coupling portion includes a control surface configured to collimate a portion of light emitted from the light source into at least one substantially collimated ray group. Light is emitted above and below the waveguide body. A portion of the light is emitted above and below the waveguide body at an angle other than parallel to an optical axis of the light source.

    Abstract translation: 波导体包括中心部分，第一和第二侧部分以及位于中心部分中的联接部分。 所述侧部分中的每一个分别沿相反的第一和第二方向远离中心部分延伸。 联接部分包括细长的联接腔，其围绕横向于第一和第二方向的第三方向延伸的平面对称并且被配置为接收光源。 耦合部分包括控制表面，其被配置为将从光源发射的光的一部分准直到至少一个基本上准直的光线组。 光在波导体的上方和下方发射。 一部分光以与光源的光轴平行的角度发射在波导体的上方和下方。

    MOLDED CHIP FABRICATION METHOD AND APPARATUS
    36.
    发明申请
    MOLDED CHIP FABRICATION METHOD AND APPARATUS 有权
    模制芯片制造方法和装置

    公开(公告)号：US20140191259A1

    公开(公告)日：2014-07-10

    申请号：US14209652

    申请日：2014-03-13

    Applicant: CREE, INC.

    Inventor： MICHAEL S. LEUNG ,  Eric J. Tarsa ,  James Ibbetson

    IPC: H01L33/50 ,  H01L27/15

    CPC classification number: H01L33/504 ,  H01L21/565 ,  H01L24/96 ,  H01L27/15 ,  H01L33/50 ,  H01L2224/2518 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0041 ,  H01L2924/00

    Abstract: A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.

    Abstract translation: 一种用于涂覆多个半导体器件的方法和设备，其特别适用于涂覆含有转化颗粒的涂层材料的LED。 根据本发明的一种方法包括提供具有地层腔的模具。 多个半导体器件安装在模具形成腔内，并且可固化涂层材料被注入或以其它方式被引入到模具中以填充模具形成腔并且至少部分地覆盖半导体器件。 固化涂层材料，使得半导体器件至少部分地嵌入固化的涂层材料中。 具有嵌入式半导体器件的固化的涂层材料从形成腔中移除。 半导体器件被分离成使得每个半导体器件至少部分被固化的涂层材料层覆盖。 根据本发明的用于涂覆多个半导体器件的设备的一个实施例包括具有布置成保持半导体器件的形成空腔的模具外壳。 形成空腔也被布置成使得可固化的涂层材料可以注入并填充地层腔以至少部分地覆盖半导体器件。

    LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING PLANAR SURFACES
    37.
    发明申请
    LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING PLANAR SURFACES 有权
    带多个元件的LED封装光源和具有平面表面的封装

    公开(公告)号：US20130328073A1

    公开(公告)日：2013-12-12

    申请号：US13649067

    申请日：2012-10-10

    Applicant: CREE, INC.

    Inventor： THEODORE LOWES ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  Jesse Reiherzer ,  Hormoz Benjamin

    IPC: H01L33/50 ,  H01L33/54

    CPC classification number: H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with a plurality of LEDs, which emit different colors of light, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material to be absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. The LED package can have a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package provides unique dimensional relationships between the features and LED package ratios, enabling more flexibility with different applications.

    Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有发射不同颜色的光的多个LED的底座和LED和底座上的毯子转换材料层。 密封剂可以在基座上，LED上方，并且在密封剂内反射的光将到达转换材料以被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时，反射光现在可以逃避密封剂，从而有效地发射和更宽的发射特征。 LED封装可以具有更高的芯片面积与LED封装面积比。 通过使用具有平面表面的密封剂，LED封装在特征和LED封装比率之间提供独特的尺寸关系，从而在不同应用中实现更大的灵活性。

    SOLID STATE LAMP WITH LIGHT DIRECTING OPTICS AND DIFFUSER
    38.
    发明申请
    SOLID STATE LAMP WITH LIGHT DIRECTING OPTICS AND DIFFUSER 审中-公开
    具有光导向和透光的固态灯

    公开(公告)号：US20130214666A1

    公开(公告)日：2013-08-22

    申请号：US13758763

    申请日：2013-02-04

    Applicant: CREE, INC.

    Inventor： Michael S. Leung ,  Eric J. Tarsa ,  John A. Edmond

    IPC: F21V13/04 ,  F21V29/00 ,  F21V7/00

    CPC classification number: F21V13/04 ,  F21K9/232 ,  F21K9/64 ,  F21K9/68 ,  F21V3/08 ,  F21V3/12 ,  F21V7/00 ,  F21V7/0058 ,  F21V13/02 ,  F21V29/74 ,  F21V29/773 ,  F21Y2107/40 ,  F21Y2115/10

    Abstract: Lamps and bulbs are disclosed generally comprising different combinations and arrangements of a light source, a reflective optical element, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of an arrangement of LEDs. The lamps according to the present invention can also comprise thermal management features that provide for efficient dissipation of heat from the LEDs, which in turn allows the LEDs to operate at lower temperatures. The lamps can also comprise optical elements to help change the emission pattern from the generally directional pattern of the LEDs to a more omni-directional pattern.

    Abstract translation: 公开通常包括光源，反射光学元件和单独漫射层的不同组合和布置的灯和灯泡。 这种布置允许制造高效，可靠和成本有效的灯和灯泡，并且可以提供基本上全方位的发射图案，即使是由LED的布置组成的光源。 根据本发明的灯还可以包括热管理特征，其提供来自LED的热量的有效耗散，这又允许LED在较低温度下操作。 灯还可以包括光学元件，以帮助将发射图案从LED的大致定向图案改变为更全面的图案。

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