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公开(公告)号:US20180333956A1
公开(公告)日:2018-11-22
申请号:US16050912
申请日:2018-07-31
CPC分类号: B41J2/1632 , B29C69/001 , B41J2/14016 , B41J2/1404 , B41J2/14145 , B41J2/14201 , B41J2/1433 , B41J2/155 , B41J2/1601 , B41J2/1603 , B41J2/1607 , B41J2/162 , B41J2/1623 , B41J2/1628 , B41J2/1637 , B41J2/1645 , B41J2002/14419 , B41J2002/14491 , B41J2202/19 , B41J2202/20 , H05K1/186 , H05K3/284 , H05K3/32 , H05K3/4007 , H05K2203/0228 , H05K2203/1316
摘要: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.
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公开(公告)号:US20180319655A1
公开(公告)日:2018-11-08
申请号:US15772377
申请日:2016-02-29
CPC分类号: B81B7/0083 , B01L3/5027 , B01L3/502707 , B01L3/50273 , B01L3/502784 , B01L2300/0867 , B01L2300/087 , B01L2300/088 , B01L2300/1827 , B01L2300/1894 , B01L2400/0442 , B01L2400/046 , B41J2/1433 , B81B1/006 , B81B2203/0338 , B81C1/00119 , F04B19/006 , F04B43/046
摘要: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.
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公开(公告)号:US10081186B2
公开(公告)日:2018-09-25
申请号:US15646163
申请日:2017-07-11
发明人: Chien-Hua Chen , Michael W. Cumbie
CPC分类号: B41J2/1601 , B41J2/04523 , B41J2/14145 , B41J2/1607 , B41J2/1628 , B41J2/1632 , B41J2/1637 , B41J2/1639 , B41J2/1645 , B41J2202/19 , B41J2202/20
摘要: In an example implementation, a printhead includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding and flush with the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.
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公开(公告)号:US20180154636A1
公开(公告)日:2018-06-07
申请号:US15890058
申请日:2018-02-06
发明人: Chien-Hua Chen , Michael W. Cumbie
CPC分类号: B41J2/155 , B41J2/14 , B41J2/1404 , B41J2/14129 , B41J2/14145 , B41J2/14201 , B41J2/1433 , B41J2/145 , B41J2/1603 , B41J2/1607 , B41J2/1637 , B41J25/34 , B41J2002/14419 , B41J2202/20
摘要: In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow to the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.
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公开(公告)号:US20180154576A1
公开(公告)日:2018-06-07
申请号:US15558633
申请日:2015-08-21
发明人: Chien-Hua Chen , Qin Liu , Hua Tan , Zhizhang Chen
IPC分类号: B29C64/277 , B29C64/112 , B29C64/209 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B41J2/14 , B41J11/00
CPC分类号: B29C64/277 , B29C35/0805 , B29C64/112 , B29C64/20 , B29C64/209 , B29C64/393 , B29C2035/0822 , B29C2035/0827 , B29C2035/0833 , B29K2105/0094 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y50/02 , B41J2/14016 , B41J2/14201 , B41J2/155 , B41J2/44 , B41J11/002
摘要: Examples include a printhead comprising a plurality of nozzles for ejecting printing material drops. Examples include at least one emission device positioned proximate the printhead, where the at least one emission device is to emit energy to thereby expose ejected printing material drops to emitted energy to change at least one material property of ejected printing material drops in-flight.
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公开(公告)号:US09895889B2
公开(公告)日:2018-02-20
申请号:US15307310
申请日:2014-06-23
CPC分类号: B41J2/1433 , B41J2/14072 , B41J2/155 , B41J2/165 , B41J2/16538 , B41J2/16585 , B41J2/1714 , B41J2002/14491 , B41J2002/16502
摘要: Examples of a printhead assembly are disclosed herein. An example of the printhead assembly includes a die to print, a base member, and at least one electrode. The electrode may be used to provide a charge to attract and collect particles that would normally otherwise interfere with operation of the die.
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公开(公告)号:US09731509B2
公开(公告)日:2017-08-15
申请号:US14770425
申请日:2013-07-29
发明人: Chien-Hua Chen , Michael W. Cumbie
CPC分类号: B41J2/1637 , B41J2/14016 , B41J2/14201 , B41J2/1601 , B41J2/1607 , B41J2/1628 , B41J2/1632 , B41J2/1645 , B41J2002/14491 , B41J2202/19 , B41J2202/20
摘要: In an embodiment, a fluid flow structure includes a micro device embedded in a molding, and a fluid feed hole formed through the micro device. A fluid channel is fluidically coupled to the fluid feed hole and includes a first compression molded channel segment and a second material ablated channel segment.
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公开(公告)号:US09707766B2
公开(公告)日:2017-07-18
申请号:US15111148
申请日:2014-01-29
CPC分类号: B41J2/175 , B29B11/06 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1637 , B41J2002/14362 , H01L2924/181 , H01L2924/186
摘要: A fluid directing assembly can comprise a molded support comprising a modified epoxy molded compound which includes epoxy resin, cross-linker, filler, and is devoid of wax release agent. The assembly can also include a silicon die attached to the molded support and wherein the silicon die and the molded support define a fluid directing channel.
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公开(公告)号:US20170072693A1
公开(公告)日:2017-03-16
申请号:US15341851
申请日:2016-11-02
发明人: Chien-Hua Chen , Michael W. Cumbie
IPC分类号: B41J2/155
CPC分类号: B41J2/155 , B41J2/14 , B41J2/1404 , B41J2/14129 , B41J2/14145 , B41J2/14201 , B41J2/1433 , B41J2/145 , B41J2/1603 , B41J2/1607 , B41J2/1637 , B41J25/34 , B41J2002/14419 , B41J2202/20
摘要: In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow o the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.
摘要翻译: 在一个示例中,流体喷射装置包括嵌入印刷电路板中的打印头芯片。 流体可以通过印刷电路板中的插入式流体供给槽并进入打印头芯片而流过打印头芯片。
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公开(公告)号:US20160257117A1
公开(公告)日:2016-09-08
申请号:US15032022
申请日:2013-10-28
发明人: Chien-Hua Chen , Michael W. Cumbie , Zhuqing Zhang
CPC分类号: B41J2/1433 , B41J2/14024 , B41J2/14072 , B41J2/1601 , B41J2/1623 , H01L21/56 , H01L21/67126 , H01L24/48 , H01L24/85 , H01L2224/4382 , H01L2224/45005 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48157 , H01L2224/4845 , H01L2224/48464 , H01L2224/8592 , H01L2924/01004 , H01L2924/01047 , H01L2924/10253 , H01L2924/00014
摘要: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.
摘要翻译: 封装具有低轮廓封装的接合线包括在与第一端上的管芯连接的接合线上施加封装,并在第二端上施加封装,并截断封装形状以形成截头形状。
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