摘要:
The invention creates a method for connection of circuit units (101a-10n) which are arranged on a wafer (100), in which the wafer (100) is fitted to a first film (102a), the wafer (100) is sawn such that the circuit units (101a-101n) which are arranged on the wafer (100) are separated, the functional circuit units (101d) are picked up by means of a handling device (101) and are placed down on a second film (102b) by means of the handling device (103), so as to produce a separation distance which can be predetermined between connection contacts of the circuit units (101d).
摘要:
In a semiconductor chip, conductive tracks run in a rewiring layer from contact pads to contact elevations. The contact pads are formed as vias. The conductive tracks are constructed in sections as bottom electrodes of trimming capacitors. The top electrode of the trimming capacitors is formed by a metal plane of the rewiring layer.
摘要:
An electronic component assembly is disclosed. The electronic component assembly may comprise a printed circuit board, a frame secured to the printed circuit board and one or more electronic components mounted in the frame and arranged in electrical contact with conductive traces of the printed circuit board, wherein no solder is used to connect the electronic components to the printed circuit board. A method for assembling the electronic component assembly is also disclosed.
摘要:
An integrated circuit is provided, the integrated circuit having a test circuit for reading out an error datum from the integrated circuit in accordance with a test mode, wherein the error datum is output via a first and a second data output, and wherein an address and a read command are applied to the integrated circuit to read out the error datum associated with the address via one of the data outputs. The test circuit is configured in such a manner that, when a first read command is applied, the test circuit outputs the error datum at the first data output and switches the second data output to high impedance and, when a second read command is applied, the test circuit outputs the error datum at the second data output and switches the first data output to high impedance.
摘要:
Methods and apparatus for testing a semiconductor device. A testing interface is configured to interface with an external test apparatus and a device under test (DUT). In one embodiment, the testing interface receives test data and a test clock signal from the external test apparatus. The test data is clocked out of the testing interface and to the DUT according to the test clock signal. Further, the test clock signal is delayed by a period of time and then a delayed clock signal is issued to the device. The data previously written to the DUT is read out of the DUT and compared with the test data received from the external test apparatus. The period of time by which the test clock signal is delayed can be varied to achieve a desired timing.
摘要:
A calibration device for the calibration of a tester channel of a tester device is provided. The calibration device includes a connecting device and a planar contact carrier with a first contact area and a second contact area insulated from the first contact area, the first contact area being generally surrounded by the second contact area, so that, when a needle card connected to the tester device is placed onto the contact carrier of the calibration device, one of the contact-connecting needles of the needle card which is connected to the tester channel to be calibrated is placed onto the first contact area and a plurality or all of the further contact-connecting needles of the needle card at tester channels that are not to be calibrated are placed onto the second contact area.
摘要:
Assessing the burn-in of faulty memory units on a wafer includes detecting only those defective memory cells that lie along control lines in the case of which the total number of defective memory cells does not exceed a predetermined limit value. With such a quality criterion, it is also possible to monitor the burn-in of faulty memory units on a wafer.
摘要:
A novel DRAM refresh method and system and a novel method of designing a low-power leakage monitoring device. With the DRAM refresh method, the time is adjusted based directly on the cell leakage condition. The method of designing a low-power leakage monitoring devices uses a memory cell identical to the cells in the real array. This monitor cell is designed so that it will represent the average cell or the worst cell leakage condition. If the leakage is severe, the refresh cycle time is significantly reduced, or halved. If the leakage level is very low or undetectable, then the refresh cycle time is significantly increased, or doubled. If the leakage is moderate, or in the normal range, the refresh time is optimized, so that the power consumption used for DRAM refresh is minimized. The advantages of this method over the existing method, that is, adjusting the refresh cycle time based on chip temperature include (1) the contributions from non-temperature dependent leakage factors are taken into consideration, (2) the present invention does not require different process steps, or extra process costs to integrate such device in the chip, and (3) the present invention is a straight forward method, the monitor cell does not need any calibration. In addition, its leakage mechanism and reliability concern are all identical to the cells in a real array.
摘要:
A dynamic logic circuit having a charging circuit, comprising a first transistor having a first source/drain electrode adapted for coupling to a voltage supply and a second source/drain electrode connected to a node. The charging circuit couples the voltage supply to the node to place an initial charge on the node. A data transfer circuit is provided comprising a second transistor having a gate adapted for coupling to an input strobe pulse, a first source/drain electrode connected to the node, and a second source/drain electrode responsive to an input data and the input strobe pulse, for transferring the input data to the node to the node such that the pre-charged node is either discharged or remains depending on the input data. An output circuit is responsive to an output strobe pulse for coupling the data at the node to an output. A trailing edge detector of the output strobe pulse detects a time at which the coupling of the data to the output is complete and pre-charges the node at a high level for a subsequent input strobe pulse.
摘要:
A system and method for testing an integrated circuit is provided. In one embodiment, a method includes comparing the signal level of the output signal of the integrated circuit to the signal level of a reference signal, wherein a comparison signal is output, which has a first or a second value depending on whether the actual signal level of the output signal is above or below the actual signal level of the reference signal; determining the value of the comparison signal at a certain time; evaluating the value of the comparison signal determined at the time by way of a default; and outputting an error signal if the determined value of the comparison signal does not correspond to the default.