摘要:
An antitumor antibiotic designated BMY-42428 is produced by fermentation of Actinomadura madurae ATCC-53806. The BMY-42428 antibiotic exhibits both antimicrobial and antitumor activities.
摘要:
Novel peptides of the formula ##STR1## wherein R is CH.sub.3 --(CH.sub.2).sub.6, CH.sub.3 --(CH.sub.2).sub.4 --CH.dbd.CH--(CH.sub.2).sub.2 and CH.sub.3 (CH.sub.2).sub.8 having antibiotic and antitumor activity are prepared by cultivation of the novel microorganism Polyangium brachysporum. Enzymatic hydrolysis of those peptides gives other peptides useful as intermediates in the preparation of peptides having activity as antibiotics and/or antitumor agents.
摘要:
The present invention relates to the antitumor antibiotic compound BU-3285T and its preparation. The compound is obtained by culturing a new strain of Chainia rosea and demonstrates both antitumor and antifungal activity. It also relates to the desulfated derivative of BU-3285T which is obtained by treatment of BU-3285T with sulfatase enzyme. BU-3285T desulfate possesses antitumor activity.
摘要:
A new antibiotic having the chromophore structure of the pluramycin family of antibiotics is produced by fermentation of Streptomyces ciolaceus ATCC 53807. The new antibiotic designated BU-3839T, exhibits potent antibacterial activity and also inhibits the growth of tumors in experimental animal systems.
摘要:
Peptides of the formula ##STR1## wherein R is CH.sub.3 --(CH.sub.2).sub.6, CH.sub.3 --(CH.sub.2).sub.4 --CH.dbd.CH--(CH.sub.2).sub.2 and CH.sub.3 (CH.sub.2).sub.8 having antibiotic and antitumor activity are prepared by cultivation of the novel microorganism Polyangium brachysporum. Enzymatic hydrolysis of those peptides gives other peptides useful as intermediates in the preparation of peptides having activity as antibiotics and/or antitumor agents.
摘要:
A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.
摘要:
A pressure-sensitive adhesive composition for PDP front filters includes 100 parts by weight of a high molecular weight acrylic polymer A having a COOH or OH group, a weight average molecular weight (Mw) of 400,000 to less than 800,000, a molecular weight distribution (Mw/Mn) of not more than 5 and a glass transition temperature (Tg-A) of −40 to −10° C., and 5 to 20 parts by weight of a low molecular weight acrylic polymer B having a weight average molecular weight (Mw) of 10,000 to 50,000, a molecular weight distribution (Mw/Mn) of not more than 5 and a glass transition temperature (Tg-B) of 40 to 120° C.; and is crosslinked to a gel fraction of 50 to 90% and has a 90° peel strength of 5 to 15 N/25 mm. The pressure-sensitive adhesive composition does not cause bonding failures such as lifting even when exposed to thermal cycles.
摘要:
Provided is a semiconductor device capable of preventing a semiconductor chip from being damaged by any sharp burrs of a metallic shielding plate. The semiconductor device includes a semiconductor chip and a metallic shielding plate provided on a circuit surface of the semiconductor chip. The metallic shielding plate is disposed in such a manner that a second surface of a shielding plate body is directed towards the circuit surface of the semiconductor chip, and burrs are positioned contiguous to the second surface of the shielding plate body. At distal ends of the burrs, cutting burrs are formed in a direction orthogonal to the second surface. The sharp burrs extend in a direction opposite to the semiconductor chip, so that the sharp burrs are prevented from damaging the circuit surface of the semiconductor chip.
摘要:
An adhesive composition for optical films, which inhibits contamination in the re-release process and peeling under severe conditions while favorably maintaining its durability and light leakage prevention properties. The adhesive composition includes: (A) an acrylic-based polymer which is obtained by copolymerizing at least the following monomer components: (a1) a (meth)acrylic acid alkyl ester and/or a (meth)acrylic acid alkoxyalkyl ester, (a2) an aromatic ring-containing monomer, (a3) a hydroxyl group-containing monomer, and optionally, (a4) a carboxyl group- or amino group-containing monomer, and which has a weight-average molecular weight of 800,000 to 1,600,000 and a value (Mw/Mn), as obtained by dividing the weight-average molecular weight of the copolymer by the number-average molecular weight thereof, of 10 to 50, (B) an isocyanate-based crosslinking agent, (C) a silane coupling agent, and optionally, (D) a crosslinking accelerator.