公开(公告)号：US20080164550A1

公开(公告)日：2008-07-10

申请号：US11707110

申请日：2007-02-16

申请人： Teng-Sheng Chen ,  Pai-Chun Peter Zung ,  Tzu-Han Lin ,  Shin-Chang Shiung

发明人： Teng-Sheng Chen ,  Pai-Chun Peter Zung ,  Tzu-Han Lin ,  Shin-Chang Shiung

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： H04N5/335 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/10 ,  H01L2924/00014 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.

摘要翻译： 公开了一种用于图像传感器装置的封装模块。 封装模块包括设置在下基板和上基板之间的器件芯片。 第一导电层在下基板的第一侧壁上方并且与器件芯片绝缘。 第一保护层在第一导电层上，并且将第一导电层的一部分暴露在下基板的第一侧壁上。 第一焊盘位于下基板的底表面上并与第一导电层电连接。 本发明还公开了一种用于图像传感器装置的电子组件及其制造方法。

公开(公告)号：US07829966B2

公开(公告)日：2010-11-09

申请号：US11944558

申请日：2007-11-23

申请人： Jui-Ping Weng ,  Tzu-Han Lin

发明人： Jui-Ping Weng ,  Tzu-Han Lin

IPC分类号： H01L31/0232

CPC分类号： H01L27/14627 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14685 ,  H04N5/2252 ,  H04N5/2257

摘要： An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.

摘要翻译： 公开了一种用于图像传感器装置的电子组件。 电子组件包括安装在其上的封装模块和透镜组。 封装模块包括其中包括至少一个接地插头的器件衬底，其中接地插头与器件衬底绝缘，并且其中的光电器件阵列。 透明基板包括附接到装置基板的坝部，以在装置和透明基板之间形成空腔。 微透镜阵列设置在腔内。 导电层电连接到接地插头并且覆盖透镜组和封装模块的侧壁和透镜组的上表面。 还公开了一种用于制造电子组件的方法。

公开(公告)号：US20090134483A1

公开(公告)日：2009-05-28

申请号：US11944558

申请日：2007-11-23

申请人： Jui-Ping Weng ,  Tzu-Han Lin

发明人： Jui-Ping Weng ,  Tzu-Han Lin

IPC分类号： H01L31/0232

CPC分类号： H01L27/14627 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14685 ,  H04N5/2252 ,  H04N5/2257

摘要： An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.

摘要翻译： 公开了一种用于图像传感器装置的电子组件。 电子组件包括安装在其上的封装模块和透镜组。 封装模块包括其中包括至少一个接地插头的器件衬底，其中接地插头与器件衬底绝缘，并且其中的光电器件阵列。 透明基板包括附接到装置基板的坝部，以在装置和透明基板之间形成空腔。 微透镜阵列设置在腔内。 导电层电连接到接地插头并且覆盖透镜组和封装模块的侧壁和透镜组的上表面。 还公开了一种用于制造电子组件的方法。

公开(公告)号：US20110018082A1

公开(公告)日：2011-01-27

申请号：US12897176

申请日：2010-10-04

申请人： Jui-Ping WENG ,  Tzu-Han Lin

发明人： Jui-Ping WENG ,  Tzu-Han Lin

IPC分类号： H01L31/0232

CPC分类号： H01L27/14627 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14685 ,  H04N5/2252 ,  H04N5/2257

摘要： An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.

摘要翻译： 公开了一种用于图像传感器装置的电子组件。 电子组件包括安装在其上的封装模块和透镜组。 封装模块包括其中包括至少一个接地插头的器件衬底，其中接地插头与器件衬底绝缘，并且其中的光电器件阵列。 透明基板包括附接到装置基板的坝部，以在装置和透明基板之间形成空腔。 微透镜阵列设置在腔内。 导电层电连接到接地插头并且覆盖透镜组和封装模块的侧壁和透镜组的上表面。 还公开了一种用于制造电子组件的方法。

公开(公告)号：US20100252845A1

公开(公告)日：2010-10-07

申请号：US12417412

申请日：2009-04-02

申请人： Chun-Chi Lin ,  Tzu-Han Lin ,  Wei-Hung Kang

发明人： Chun-Chi Lin ,  Tzu-Han Lin ,  Wei-Hung Kang

IPC分类号： H01L33/00 ,  H01L21/78

CPC分类号： H01L33/508

摘要： A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.

摘要翻译： 提供了一种白光LED芯片及其制造方法。 白光LED芯片包括蓝光LED芯片和直接设置在蓝光LED芯片的顶表面上的荧光体层。 该方法包括提供附着在基板上的多个蓝光LED芯片，其中至少一个接触焊盘形成在每个蓝光LED芯片的顶表面上。 在接触垫上形成保护层。 通过成型工艺在蓝光LED芯片的顶表面上形成荧光体层，露出接触垫。 最后，从蓝光LED芯片去除保护层和基板，以形成白光LED芯片。

公开(公告)号：US07807484B2

公开(公告)日：2010-10-05

申请号：US12251957

申请日：2008-10-15

申请人： Wei-Ko Wang ,  Tzu-Han Lin

发明人： Wei-Ko Wang ,  Tzu-Han Lin

IPC分类号： H01L21/00

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2924/10253 ,  Y10S438/979 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a light-emitting diode chip disposed thereon. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the light-emitting diode chip. In one embodiment, the lens module comprises a glass substrate having a first cavity formed at a first surface thereof, a fluorescent layer formed over a portion of a first surface exposed by the first cavity, facing the light-emitting diode chip, and a molded lens formed over a second surface of the glass carrier opposing to the first surface.

摘要翻译： 公开了一种发光二极管（LED）装置。 LED装置包括其上设置有发光二极管芯片的半导体衬底。 至少两个隔离的外部布线层设置在半导体衬底的底表面上，并且与用作输入端子的发光二极管芯片电连接。 透镜模块粘附到半导体衬底的顶表面以盖住发光二极管芯片。 在一个实施例中，透镜模块包括玻璃基板，其具有在其第一表面形成的第一空腔，形成在由第一腔暴露的第一表面的暴露于面向发光二极管芯片的部分上的荧光层， 透镜形成在玻璃载体的与第一表面相对的第二表面上。

公开(公告)号：US20100127288A1

公开(公告)日：2010-05-27

申请号：US12323094

申请日：2008-11-25

申请人： Wu-Cheng KUO ,  Tzu-Han Lin

发明人： Wu-Cheng KUO ,  Tzu-Han Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2933/005 ,  H01L2924/00014

摘要： An LED device including a support structure with at least one LED die mounted thereon, a recess formed in a part of the support structure from a side of the LED die, and a lens formed over the support structure to encapsulate the LED die and the recess, thereby forming a protrusion in the support structure is disclosed.

摘要翻译： 一种LED装置，包括具有安装在其上的至少一个LED管芯的支撑结构，从所述LED管芯的一侧形成在所述支撑结构的一部分中的凹部，以及形成在所述支撑结构上的透镜，以封装所述LED管芯和所述凹部 从而在支撑结构中形成突起。

公开(公告)号：US07187078B2

公开(公告)日：2007-03-06

申请号：US10938594

申请日：2004-09-13

申请人： Tzu-Han Lin ,  Huei-Mei Yu ,  Chia-Jen Cheng ,  Chun-Yen Lo ,  Li-Hsin Tseng ,  Boe Su ,  Simon Lu

发明人： Tzu-Han Lin ,  Huei-Mei Yu ,  Chia-Jen Cheng ,  Chun-Yen Lo ,  Li-Hsin Tseng ,  Boe Su ,  Simon Lu

IPC分类号： H01L29/40

CPC分类号： H01L24/13 ,  H01L24/05 ,  H01L2224/02125 ,  H01L2224/05001 ,  H01L2224/05007 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Solder bump structures for semiconductor device packaging is provided. In one embodiment, a solder bump structure comprises a semiconductor substrate, the substrate has at least one contact pad and an upper passivation layer having at least one opening formed therein exposing a portion of the contact pad. At least one patterned and etched polymer layer is formed on a portion of the contact pad. At least one patterned and etched conductive metal layer is formed above the polymer layer and is aligned therewith. And at least one layer of solder material having a solder height is provided above the conductive metal layer, the layer of solder is aligned with the conductive metal layer, the layer of solder is thereafter reflown thereby creating a solder ball.

摘要翻译： 提供了用于半导体器件封装的焊接凸块结构。 在一个实施例中，焊料凸块结构包括半导体衬底，所述衬底具有至少一个接触焊盘和具有形成在其中的至少一个开口的上钝化层，其暴露接触焊盘的一部分。 在接触垫的一部分上形成至少一个图案化和蚀刻的聚合物层。 在聚合物层之上形成至少一个图案化和蚀刻的导电金属层并与其对准。 并且在导电金属层的上方设置至少一层具有焊料高度的焊料材料，该焊料层与导电金属层对准，此后焊料层被回流，从而形成焊球。

公开(公告)号：US20120205695A1

公开(公告)日：2012-08-16

申请号：US13028809

申请日：2011-02-16

申请人： Tzu-Han Lin ,  Izy-Ying Lin ,  Ming-Nan Lin

发明人： Tzu-Han Lin ,  Izy-Ying Lin ,  Ming-Nan Lin

IPC分类号： H01L33/44

CPC分类号： H01L33/44 ,  H01L33/42 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

摘要： A light-emitting diode device is provided, including a submount, a light-emitting diode (LED) chip mounted on the submount, a first transparent insulating layer formed on the submount and the LED chip, a transparent conductive layer formed on the first transparent insulating layer, a phosphor layer formed on the first transparent conductive layer covering the LED chip, and a transparent passivation layer formed on the phosphor layer and over the transparent conductive layer.

摘要翻译： 提供了一种发光二极管装置，包括安装在基座上的基座，发光二极管（LED）芯片，形成在基座上的第一透明绝缘层和LED芯片，形成在第一透明 绝缘层，形成在覆盖LED芯片的第一透明导电层上的荧光体层，以及形成在荧光体层上并在透明导电层之上的透明钝化层。

公开(公告)号：US20120025387A1

公开(公告)日：2012-02-02

申请号：US12844590

申请日：2010-07-27

申请人： Kuo-Ching CHANG ,  Wu-Cheng Kuo ,  Tzu-Han Lin

发明人： Kuo-Ching CHANG ,  Wu-Cheng Kuo ,  Tzu-Han Lin

IPC分类号： H01L23/492 ,  H01L21/50

CPC分类号： H01L24/33 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/04042 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/32238 ,  H01L2224/32506 ,  H01L2224/335 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package and a fabrication method thereof are provided. The chip package includes a substrate and a chip disposed over the substrate. A solder layer is disposed between the chip and the substrate. A conductive pad is disposed between the solder layer and the substrate, wherein the conductive pad includes a first portion disposed under the solder layer, a second portion disposed away from the first portion and a connective portion disposed between the first portion and the second portion. The connective portion has a width which is narrower than a width of the first portion along a first direction perpendicular to a second direction extending from the first portion to the connective portion.

摘要翻译： 提供了芯片封装及其制造方法。 芯片封装包括衬底和布置在衬底上的芯片。 焊料层设置在芯片和衬底之间。 导电焊盘设置在焊料层和衬底之间，其中导电焊盘包括布置在焊料层下方的第一部分，远离第一部分设置的第二部分和设置在第一部分和第二部分之间的连接部分。 连接部分的宽度比沿着从第一部分延伸到连接部分的第二方向垂直的第一方向的第一部分的宽度窄。