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公开(公告)号：US09356332B2
公开(公告)日：2016-05-31
申请号：US13872718
申请日：2013-04-29
Applicant: Infineon Technologies AG
Inventor： Ernst Seler , Maciej Wojnowski , Walter Hartner
IPC: H03H5/00 , H01P5/08 , H01L21/56 , H01P1/16 , H01L23/66 , H01L23/00 , H01P3/12 , H01P5/107 , H01L23/31
CPC classification number: H01P5/08 , H01L21/56 , H01L21/568 , H01L23/3128 , H01L23/66 , H01L24/19 , H01L24/25 , H01L2223/6633 , H01L2223/6677 , H01L2224/12105 , H01L2224/13 , H01L2224/21 , H01L2224/221 , H01L2224/24195 , H01L2224/2518 , H01L2924/1421 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01P1/16 , H01P3/121 , H01P5/107 , H01L2924/00
Abstract: An integrated-circuit module includes a package molding compound layer, a radio-frequency (RF) integrated circuit embedded within the package molding compound layer and having an RF port, a waveguide transition structure embedded within the package molding compound layer, and a redistribution layer. The waveguide transition structure includes a transmission line interface section, a waveguide interface section configured for coupling to a rectangular waveguide housing, and a transformer section configured to provide a mode transition between the transmission line interface section and the waveguide interface section. The redistribution layer includes at least one insulating layer and at least one metallization layer, extending between the RF integrated circuit and the waveguide transition structure across a surface of the package molding compound layer. The first redistribution layer includes an RF transmission line conductively connected between the RF port of the RF integrated circuit and the transmission line interface section of the waveguide transition structure.
Abstract translation: 集成电路模块包括封装模塑复合层，嵌入在封装模塑复合层内的射频（RF）集成电路，并具有RF端口，嵌入封装模塑复合层内的波导过渡结构以及再分配层 。 波导过渡结构包括传输线接口部分，被配置为耦合到矩形波导壳体的波导接口部分和被配置为在传输线接口部分和波导接口部分之间提供模式转换的变压器部分。 再分配层包括至少一个绝缘层和至少一个金属化层，其跨过封装模塑复合层的表面在RF集成电路和波导过渡结构之间延伸。 第一再分配层包括导电连接在RF集成电路的RF端口和波导过渡结构的传输线接口部分之间的RF传输线。
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公开(公告)号：US20160043455A1
公开(公告)日：2016-02-11
申请号：US14453746
申请日：2014-08-07
Applicant: Infineon Technologies AG
Inventor： Ernst Seler , Maciej Wojnowski , Walter Hartner , Josef Boeck
IPC: H01P5/107
CPC classification number: H01P5/107 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2924/18162 , H01P1/042 , H01P11/002 , H01P11/003 , H04B5/00
Abstract: A microwave device includes a semiconductor package comprising a microwave semiconductor chip and a waveguide part associated with the semiconductor package. The waveguide part is configured to transfer a microwave waveguide signal. It includes one or more pieces. The microwave device further includes a transformer element configured to transform a microwave signal from the microwave semiconductor chip into the microwave waveguide signal or to transform the microwave waveguide signal into a microwave signal for the microwave semiconductor chip.
Abstract translation: 微波器件包括包括微波半导体芯片和与半导体封装件相关联的波导部件的半导体封装。 波导部分被配置为传送微波波导信号。 它包括一个或多个片段。 微波装置还包括变换元件，其被配置为将来自微波半导体芯片的微波信号转换成微波波导信号，或者将微波波导信号转换为用于微波半导体芯片的微波信号。
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公开(公告)号：US20150171033A1
公开(公告)日：2015-06-18
申请号：US14106092
申请日：2013-12-13
Applicant: Infineon Technologies AG
Inventor： Ernst Seler , Maciej Wojnowski , Walter Hartner , Josef Boeck
CPC classification number: H01L23/66 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3114 , H01L23/3128 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/96 , H01L2223/6616 , H01L2223/6627 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2924/12042 , H01L2924/19105 , H01L2924/3025 , H01Q13/08 , H01L2924/00
Abstract: A semiconductor device package includes an encapsulant and a semiconductor chip. The semiconductor chip is at least partly embedded in the encapsulant. A microwave component including at least one electrically conducting wall structure is integrated in the encapsulant. Further, the semiconductor device package includes an electrical interconnect configured to electrically couple the microwave component to the semiconductor chip.
Abstract translation: 半导体器件封装包括密封剂和半导体芯片。 半导体芯片至少部分地嵌入密封剂中。 包括至少一个导电壁结构的微波部件集成在密封剂中。 此外，半导体器件封装包括被配置为将微波部件电耦合到半导体芯片的电互连。
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公开(公告)号：US12040543B2
公开(公告)日：2024-07-16
申请号：US17648730
申请日：2022-01-24
Applicant: Infineon Technologies AG
Inventor： Walter Hartner , Tuncay Erdoel , Klaus Elian , Christian Geissler , Bernhard Rieder , Rainer Markus Schaller , Horst Theuss , Maciej Wojnowski
CPC classification number: H01Q13/06 , H01Q1/2283 , H01Q1/526 , H01Q23/00
Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.
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公开(公告)号：US11879966B2
公开(公告)日：2024-01-23
申请号：US17248003
申请日：2021-01-05
Applicant: Infineon Technologies AG
Inventor： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Walter Hartner
CPC classification number: G01S13/86 , G01S7/006 , G01S7/02 , G01S13/003 , H04B1/40 , G01S7/032 , G01S13/878 , G01S13/931 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105
Abstract: A semiconductor package having an antenna; and a semiconductor die which is coupled to the antenna and comprises a transmitter configured to transmit wirelessly via the antenna a wireless signal having information on a local oscillator signal to a further semiconductor package comprising a further semiconductor die.
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Patent Agency Ranking
公开(公告)号：US20210247510A1
公开(公告)日：2021-08-12
申请号：US17248003
申请日：2021-01-05
Applicant: Infineon Technologies AG
Inventor： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Walter Hartner
Abstract: A semiconductor package having an antenna; and a semiconductor die which is coupled to the antenna and comprises a transmitter configured to transmit wirelessly via the antenna a wireless signal having information on a local oscillator signal to a further semiconductor package comprising a further semiconductor die.
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公开(公告)号：US20200021002A1
公开(公告)日：2020-01-16
申请号：US16032589
申请日：2018-07-11
Applicant: Infineon Technologies AG
Inventor： Maciej Wojnowski , Dirk Hammerschmidt , Walter Hartner , Johannes Lodermeyer , Chiara Mariotti , Thorsten Meyer
Abstract: A semiconductor device including an Integrated Circuit (IC) package and a plastic waveguide. The IC package includes a semiconductor chip; and an embedded antenna formed within a Redistribution Layer (RDL) coupled to the semiconductor chip, wherein the RDL is configured to transport a Radio Frequency (RF) signal between the semiconductor chip and the embedded antenna. The plastic waveguide is attached to the IC package and configured to transport the RF signal between the embedded antenna and outside of the IC package.
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公开(公告)号：US20190221531A1
公开(公告)日：2019-07-18
申请号：US16360387
申请日：2019-03-21
Applicant: Infineon Technologies AG
Inventor： Thorsten Meyer , Walter Hartner , Maciej Wojnowski
CPC classification number: H01L23/66 , H01L23/3114 , H01L23/3128 , H01L23/5226 , H01L23/5227 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L29/0657 , H01L2223/6677 , H01L2224/12105 , H01L2224/13024 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/73267 , H01L2224/81203 , H01L2224/81815 , H01L2224/83102 , H01L2224/83825 , H01L2224/8384 , H01L2224/8385 , H01L2924/10158 , H01L2924/15311 , H01L2924/18162 , H01Q1/2283 , H01L2924/00014
Abstract: A semiconductor device includes a semiconductor die having an active main surface and an opposite main surface opposite the active main surface. The semiconductor device further includes an antenna arranged on the active main surface of the semiconductor die and a recess arranged on the opposite main surface of the semiconductor die. The recess is arranged over the antenna.
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公开(公告)号：US09910145B2
公开(公告)日：2018-03-06
申请号：US14135069
申请日：2013-12-19
Applicant: Infineon Technologies AG
Inventor： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Walter Hartner
CPC classification number: G01S13/86 , G01S7/006 , G01S7/02 , G01S7/032 , G01S13/003 , G01S13/878 , G01S13/931 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H04B1/40
Abstract: A wireless communication system includes a first semiconductor module and a second semiconductor module. The first semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the first semiconductor module and the antenna structure of the first semiconductor module are arranged within a common package. The semiconductor die of the first semiconductor module includes a transmitter module configured to transmit the wireless communication signal through the antenna structure of the first semiconductor module. The second semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the second semiconductor module includes a receiver module configured to receive the wireless communication signal through the antenna structure of the second semiconductor module from the first semiconductor module.
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公开(公告)号：US09337159B2
公开(公告)日：2016-05-10
申请号：US14106092
申请日：2013-12-13
Applicant: Infineon Technologies AG
Inventor： Ernst Seler , Maciej Wojnowski , Walter Hartner , Josef Boeck
CPC classification number: H01L23/66 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3114 , H01L23/3128 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/96 , H01L2223/6616 , H01L2223/6627 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2924/12042 , H01L2924/19105 , H01L2924/3025 , H01Q13/08 , H01L2924/00
Abstract: A semiconductor device package includes an encapsulant and a semiconductor chip. The semiconductor chip is at least partly embedded in the encapsulant. A microwave component including at least one electrically conducting wall structure is integrated in the encapsulant. Further, the semiconductor device package includes an electrical interconnect configured to electrically couple the microwave component to the semiconductor chip.
Abstract translation: 半导体器件封装包括密封剂和半导体芯片。 半导体芯片至少部分地嵌入密封剂中。 包括至少一个导电壁结构的微波部件集成在密封剂中。 此外，半导体器件封装包括被配置为将微波部件电耦合到半导体芯片的电互连。
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