-
公开(公告)号：US11424539B2
公开(公告)日：2022-08-23
申请号：US16472830
申请日：2017-12-20
Applicant: Intel Corporation
Inventor： Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q5/47 , H01Q9/04 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
-
公开(公告)号：US20210344116A1
公开(公告)日：2021-11-04
申请号：US17373926
申请日：2021-07-13
Applicant: Intel Corporation
Inventor： Sidharth Dalmia , Trang Thai , William James Lambert , Zhichao Zhang , Jiwei Sun
Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.
-
公开(公告)号：US20190027432A1
公开(公告)日：2019-01-24
申请号：US16077732
申请日：2016-03-15
Applicant: INTEL CORPORATION
Inventor： Sidharth Dalmia
IPC: H01L23/522 , H01L23/00
Abstract: Described is an apparatus which comprises: a die with a first side; a first set of solder balls coupled to the die along the first side; a laminate based substrate adjacent to the first set of solder balls, the laminate based substrate having at least one balun, at least one bandpass filter (BPF), and at least one diplexer embedded in the laminate, wherein the at least one balun is communicatively coupled to the first die via at least one of the solder balls of the first set.
-
公开(公告)号：US12255382B2
公开(公告)日：2025-03-18
申请号：US18504376
申请日：2023-11-08
Applicant: Intel Corporation
Inventor： Sidharth Dalmia , Jonathan Jensen , Ozgur Inac , Trang Thai , William J. Lambert , Benjamin Jann
Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.
-
公开(公告)号：US11729902B2
公开(公告)日：2023-08-15
申请号：US16268318
申请日：2019-02-05
Applicant: Intel Corporation
Inventor： Sidharth Dalmia , Zhenguo Jiang , William James Lambert , Kirthika Nahalingam , Swathi Vijayakumar
CPC classification number: H05K1/0243 , G06F1/1613 , H01F5/04 , H05K1/028 , H05K1/181 , H05K1/189 , G06F1/163 , G06F1/1626 , G06F2200/1631 , H01L25/16 , H04B1/40 , H05K2201/1006 , H05K2201/10098
Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
-
Patent Agency Ranking
公开(公告)号：US11664596B2
公开(公告)日：2023-05-30
申请号：US17373926
申请日：2021-07-13
Applicant: Intel Corporation
Inventor： Sidharth Dalmia , Trang Thai , William James Lambert , Zhichao Zhang , Jiwei Sun
CPC classification number: H01Q9/0407 , H01Q1/085 , H01Q1/2283 , H01Q11/14
Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.
-
公开(公告)号：US11616283B2
公开(公告)日：2023-03-28
申请号：US16122609
申请日：2018-09-05
Applicant: Intel Corporation
Inventor： Omkar Karhade , William J. Lambert , Xiaoqian Li , Sidharth Dalmia
Abstract: Embodiments include an electronic package that includes a radio frequency (RF) front end. In an embodiment, the RF front end may comprise a package substrate and a first die attached to a first surface of the package substrate. In an embodiment, the first die may include CMOS components. In an embodiment, the RF front end may further comprise a second die attached to the first surface of the package substrate. In an embodiment, the second die may comprise amplification circuitry. In an embodiment, the RF front end may further comprise an antenna attached to a second surface of the package substrate. In an embodiment, the second surface is opposite from the first surface.
-
公开(公告)号：US11374322B2
公开(公告)日：2022-06-28
申请号：US16643722
申请日：2017-09-30
Applicant: INTEL CORPORATION
Inventor： Omer Asaf , Sidharth Dalmia , Trang Thai , Josef Hagn , Richard S. Perry , Jonathan C. Jensen , Raanan Sover
Abstract: Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.
-
39.发明申请公开(公告)号：US20210210442A1
公开(公告)日：2021-07-08
申请号：US16078001
申请日：2016-03-15
Applicant: Intel Corporation
Inventor： Sidharth Dalmia
Abstract: Described is an apparatus which comprises: a first transmission path for a first frequency band; a second transmission path for a second frequency band different from the first frequency band; a node common to the first and second transmission paths, the node to be coupled to an antenna; and a transmission-zero circuit coupled to the common node.
-
公开(公告)号：US11024574B2
公开(公告)日：2021-06-01
申请号：US16077732
申请日：2016-03-15
Applicant: INTEL CORPORATION
Inventor： Sidharth Dalmia
IPC: H01L23/522 , H01L23/00
Abstract: Described is an apparatus which comprises: a die with a first side; a first set of solder balls coupled to the die along the first side; a laminate based substrate adjacent to the first set of solder balls, the laminate based substrate having at least one balun, at least one bandpass filter (BPF), and at least one diplexer embedded in the laminate, wherein the at least one balun is communicatively coupled to the first die via at least one of the solder balls of the first set.
-
-
-
-
-
-
-
-
-
Search Results
43
records
(took 0.016 seconds)
