公开(公告)号：US20060211234A1

公开(公告)日：2006-09-21

申请号：US11420403

申请日：2006-05-25

Applicant: Benjamin Eldridge ,  Gaetan Mathieu

Inventor： Benjamin Eldridge ,  Gaetan Mathieu

IPC: H01L21/44

CPC classification number: B81C1/00214 ,  B81B7/04 ,  B81C3/002 ,  B81C2203/051 ,  G01R1/06711 ,  G01R1/06744 ,  G01R1/07314 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15174 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49204 ,  H01L2924/00

Abstract: Methods of fabricating an array of aligned microstructures on a substrate are disclosed. The microstructures may be spring contacts or other microelements. The methods disclosed include construction of an alignment substrate, alignment of die elements with the alignment substrate, and fixation of the aligned die elements to a backing substrate.

Abstract translation: 公开了在衬底上制造排列的微结构阵列的方法。 微结构可以是弹簧触点或其他微量元件。 所公开的方法包括对准基板的构造，模具元件与对准基板的对准以及将对准的模具元件固定到背衬基板上。

公开(公告)号：US20050148214A1

公开(公告)日：2005-07-07

申请号：US10933063

申请日：2004-09-02

Applicant: Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

Inventor： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

IPC: G01R1/067 ,  G01R3/00 ,  H05K3/32 ,  H05K3/40 ,  H01R12/00

CPC classification number: G01R3/00 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06744 ,  G01R1/06761 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13012 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H05K3/326 ,  H05K3/4092 ,  Y10S438/977 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

Abstract translation: 通过光刻技术形成包括弹簧接触元件的互连的方法。 在一个实施例中，该方法包括在衬底的第一部分上施加掩模材料，掩模材料具有将限定弹簧结构的第一部分的开口，在开口中沉积结构材料（例如导电材料） 并用结构材料过度填充开口，去除结构材料的一部分，以及去除掩模材料的第一部分。 在该实施例中，弹簧结构的第一部分的至少一部分没有掩蔽材料。 在本发明的一个方面，该方法包括平坦化掩模材料层和结构材料以去除结构材料的一部分。 另一方面，形成的弹簧结构包括柱部分，梁部分和尖端结构部分中的一个。

公开(公告)号：US20080020227A1

公开(公告)日：2008-01-24

申请号：US11835136

申请日：2007-08-07

Applicant: Gary Grube ,  Gaetan Mathieu ,  Benjamin Eldridge ,  Chadwick Sofield

Inventor： Gary Grube ,  Gaetan Mathieu ,  Benjamin Eldridge ,  Chadwick Sofield

IPC: B32B15/092

CPC classification number: G01R3/00 ,  G01R1/06716 ,  G01R1/06744 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T156/10 ,  Y10T428/12347 ,  Y10T428/12375 ,  Y10T428/12535 ,  Y10T428/12542 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.

Abstract translation: 提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。 强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。 然后可以在镀覆的基础上构造诸如弹簧探针的组件。 粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。

公开(公告)号：US20070229102A1

公开(公告)日：2007-10-04

申请号：US11761912

申请日：2007-06-12

Applicant: Benjamin Eldridge ,  Barbara Vasquez ,  Makarand Shinde ,  Gaetan Mathieu ,  A. Sporck

Inventor： Benjamin Eldridge ,  Barbara Vasquez ,  Makarand Shinde ,  Gaetan Mathieu ,  A. Sporck

IPC: G01R31/02

CPC classification number: G01R31/2889 ,  G01R1/0416 ,  G01R1/07307

Abstract: A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.

Abstract translation: 晶片测试组件包括多个探针头基底，其布置成瓦片，其中连接器连接到一侧，探针支撑在相对侧上。 在一个实施例中，柔性电缆连接器将探头头瓦片上的连接器直接连接到测试头，而在另一个实施例中，柔性电缆将探头头瓦片连接到PCB，从而向测试头连接器提供水平布线。 在一个实施例中，调平销提供连接到附接到瓦片的保持元件以提供施加推挽平整力的简化支撑结构。 测试头连接器接口框架能够重新布置测试头和探针卡之间的连接器，以提供完整的晶片接触或部分晶片接触。 测试头连接器通过在轨道上滑动来重新布置，或者可插拔和可拔出，使得能够在一定范围的位置上移动。

公开(公告)号：US20070126435A1

公开(公告)日：2007-06-07

申请号：US11164737

申请日：2005-12-02

Applicant: Benjamin Eldridge ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum

Inventor： Benjamin Eldridge ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R31/31905

Abstract: Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.

Abstract translation: 可以相对于探针卡组件的元件调整探针卡组件的探针，探针卡组件可以是探针卡组件的元件，其有助于将探针卡组件安装到测试装置。 然后可以将探针卡组件安装在测试装置中，并且可以相对于测试装置（例如测试装置的结构部分或连接到测试装置的结构元件）来调整探针卡组件的取向。

公开(公告)号：US20050277323A1

公开(公告)日：2005-12-15

申请号：US10868425

申请日：2004-06-15

Applicant: Benjamin Eldridge ,  Barbara Vasquez ,  Makarand Shinde ,  Gaetan Mathieu ,  A. Sporck

Inventor： Benjamin Eldridge ,  Barbara Vasquez ,  Makarand Shinde ,  Gaetan Mathieu ,  A. Sporck

IPC: G01R1/04 ,  G01R1/073 ,  G01R31/28 ,  H01R11/18

CPC classification number: G01R31/2889 ,  G01R1/0416 ,  G01R1/07307

Abstract: A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.

Abstract translation: 晶片测试组件包括多个探针头基底，其布置成瓦片，其中连接器连接到一侧，探针支撑在相对侧上。 在一个实施例中，柔性电缆连接器将探头头瓦片上的连接器直接连接到测试头，而在另一个实施例中，柔性电缆将探头头瓦片连接到PCB，从而向测试头连接器提供水平布线。 在一个实施例中，调平销提供连接到附接到瓦片的保持元件以提供施加推挽平整力的简化支撑结构。 测试头连接器接口框架能够重新布置测试头和探针卡之间的连接器，以提供完整的晶片接触或部分晶片接触。 测试头连接器通过在轨道上滑动来重新布置，或者可插拔和可拔出，使得能够在一定范围的位置上移动。

公开(公告)号：US20050255408A1

公开(公告)日：2005-11-17

申请号：US10831870

申请日：2004-04-26

Applicant: Gary Grube ,  Gaetan Mathieu ,  Benjamin Eldridge ,  Chadwick Sofield

Inventor： Gary Grube ,  Gaetan Mathieu ,  Benjamin Eldridge ,  Chadwick Sofield

IPC: B32B9/00 ,  B32B15/04

CPC classification number: G01R3/00 ,  G01R1/06716 ,  G01R1/06744 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T156/10 ,  Y10T428/12347 ,  Y10T428/12375 ,  Y10T428/12535 ,  Y10T428/12542 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.

Abstract translation: 提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。 强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。 然后可以在镀覆的基础上构造诸如弹簧探针的组件。 粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。

公开(公告)号：US06713374B2

公开(公告)日：2004-03-30

申请号：US09752640

申请日：2000-12-29

Applicant: Benjamin N. Eldridge ,  Gaetan Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan Mathieu

IPC: H01L2144

CPC classification number: H01L23/4822 ,  H01L24/01 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: An interconnect assembly and methods for making and using the assembly. An exemplary embodiment of an aspect of the invention includes a contact element which includes a base portion adapted to be adhered to a substrate and a beam portion connected to and extending from the base portion. The beam portion is designed to have a geometry which substantially optimizes stress across the beam portion when deflected (e.g. it is triangular in shape) and is adapted to be freestanding. An exemplary embodiment of another aspect of the invention involves a method for forming a contact element. This method includes forming a base portion to adhere to a substrate of an electrical assembly and forming a beam portion connected to the base portion. The beam portion extends from the base portion and is designed to have a geometry which substantially evenly distributes stress across the beam portion when deflected and is adapted to be freestanding. It will be appreciated that in certain embodiments of the invention, a plurality of contact elements are used together to create an interconnect assembly. Various other assemblies and methods are also described below in conjunction with the following figures.

Abstract translation: 互连组件和用于制造和使用组件的方法。 本发明的一个方面的示例性实施例包括接触元件，其包括适于粘附到基底的基部和连接到基部并从基部延伸的梁部。 梁部分被设计成具有几何形状，当偏转（例如，其形状为三角形）时，几何形状基本上优化横梁部分上的应力，并且适于独立。 本发明的另一方面的示例性实施例涉及形成接触元件的方法。 该方法包括形成基部以粘附到电气组件的基板并形成连接到基部的梁部分。 梁部分从基部延伸并且被设计成具有几何形状，当几何形状偏转时基本上均匀地分布横梁部分的应力，并适于独立。 应当理解，在本发明的某些实施例中，多个接触元件一起用于产生互连组件。 下面结合以下附图描述各种其它组件和方法。

公开(公告)号：US20080094088A1

公开(公告)日：2008-04-24

申请号：US11963575

申请日：2007-12-21

Applicant: Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

Inventor： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

IPC: G01R31/26

CPC classification number: G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

Abstract translation: 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

公开(公告)号：US20080088010A1

公开(公告)日：2008-04-17

申请号：US11548668

申请日：2006-10-11

Applicant: Eric D. Hobbs ,  Gaetan Mathieu

Inventor： Eric D. Hobbs ,  Gaetan Mathieu

IPC: H01L23/34

CPC classification number: H01L23/34 ,  B81B7/0006 ,  B81B7/0093 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00

Abstract: An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals of the semiconductor die. The micromechanical system can also comprise a cooling structure disposed on the semiconductor die.

Abstract translation: 电子设备可以包括其上可以形成微机械系统的半导体管芯。 微机械系统可以包括多个导电细长的接触结构，其可以设置在半导体管芯的输入和/或输出端子上。 微机械系统还可以包括设置在半导体管芯上的冷却结构。