METHOD FOR FORMING A SPLIT GATE MEMORY DEVICE
    32.
    发明申请
    METHOD FOR FORMING A SPLIT GATE MEMORY DEVICE 有权
    形成分离栅存储器件的方法

    公开(公告)号:US20080199996A1

    公开(公告)日:2008-08-21

    申请号:US11676403

    申请日:2007-02-19

    IPC分类号: H01L21/336

    摘要: A method forms a split gate memory device. A layer of select gate material over a substrate is patterned to form a first sidewall. A sacrificial spacer is formed adjacent to the first sidewall. Nanoclusters are formed over the substrate including on the sacrificial spacer. The sacrificial spacer is removed after the forming the layer of nanoclusters, wherein nanoclusters formed on the sacrificial spacer are removed and other nanoclusters remain. A layer of control gate material is formed over the substrate after the sacrificial spacer is removed. A control gate of a split gate memory device is formed from the layer of control gate material, wherein the control gate is located over remaining nanoclusters.

    摘要翻译: 一种方法形成分离栅极存储器件。 将衬底上的选择栅极材料层图案化以形成第一侧壁。 邻近第一侧壁形成牺牲隔离物。 纳米团簇形成在包括在牺牲间隔物上的衬底上。 在形成纳米团簇层之后去除牺牲隔离物,其中在牺牲隔离物上形成的纳米团簇被去除并且其它纳米团簇保留。 在除去牺牲间隔物之后,在衬底上形成一层控制栅极材料。 分离栅极存储器件的控制栅极由控制栅极材料层形成,其中控制栅极位于剩余的纳米簇上。

    METHOD OF FORMING A MULTI-BIT NONVOLATILE MEMORY DEVICE
    35.
    发明申请
    METHOD OF FORMING A MULTI-BIT NONVOLATILE MEMORY DEVICE 有权
    形成多位非易失性存储器件的方法

    公开(公告)号:US20080182377A1

    公开(公告)日:2008-07-31

    申请号:US11668210

    申请日:2007-01-29

    IPC分类号: H01L21/336

    摘要: In making a multi-bit memory cell, a first insulating layer is formed over a semiconductor substrate. A second insulating layer is formed over the first insulating layer. A layer of gate material is formed over the second insulating layer and patterned to leave a gate portion. The second insulating layer is etched to undercut the gate portion and leave a portion of the second insulating layer between the first insulating layer and the gate portion. Nanocrystals are formed on the first insulating layer. A first portion of the nanocrystals is under the gate portion on a first side of the portion of the second insulating layer and a second portion of the nanocrystals is under the gate portion on a second side of the portion of the second insulating layer. The first and second portions of the nanocrystals are for storing logic states of first and second bits, respectively.

    摘要翻译: 在制造多位存储单元时,在半导体衬底上形成第一绝缘层。 在第一绝缘层上形成第二绝缘层。 一层栅极材料形成在第二绝缘层之上并图案化以留下栅极部分。 蚀刻第二绝缘层以切割栅极部分,并将第二绝缘层的一部分留在第一绝缘层和栅极部分之间。 在第一绝缘层上形成纳米晶体。 纳米晶体的第一部分在第二绝缘层部分的第一侧上的栅极部分下方,并且纳米晶体的第二部分在第二绝缘层部分的第二侧上的栅极部分下方。 纳米晶体的第一和第二部分分别用于存储第一和第二位的逻辑状态。

    Nanocrystal non-volatile memory cell and method therefor
    36.
    发明申请
    Nanocrystal non-volatile memory cell and method therefor 有权
    纳米晶体非挥发性记忆体及其方法

    公开(公告)号:US20080121966A1

    公开(公告)日:2008-05-29

    申请号:US11530053

    申请日:2006-09-08

    IPC分类号: H01L29/78 H01L21/3205

    摘要: A method of forming a semiconductor device includes forming a first dielectric layer over a semiconductor substrate, forming a plurality of discrete storage elements over the first dielectric layer, thermally oxidizing the plurality of discrete storage elements to form a second dielectrics over the plurality of discrete storage elements, and forming a gate electrode over the second dielectric layer, wherein a significant portion of the gate electrode is between pairs of the plurality of discrete storage elements. In one embodiment, portions of the gate electrode is in the spaces between the discrete storage elements and extends to more than half of the depth of the spaces.

    摘要翻译: 一种形成半导体器件的方法包括在半导体衬底上形成第一电介质层,在第一介电层上形成多个离散存储元件,热氧化多个离散的存储元件,以在多个离散存储器上形成第二电介质 元件,并且在所述第二介电层上形成栅电极,其中所述栅电极的重要部分位于所述多个离散存储元件的对之间。 在一个实施例中,栅电极的部分位于离散存储元件之间的空间中并且延伸到空间深度的一半以上。

    Method for forming a memory structure using a modified surface topography and structure thereof
    37.
    发明授权
    Method for forming a memory structure using a modified surface topography and structure thereof 有权
    使用改性表面形貌及其结构形成记忆结构的方法

    公开(公告)号:US06991984B2

    公开(公告)日:2006-01-31

    申请号:US10765804

    申请日:2004-01-27

    IPC分类号: H01L21/336

    摘要: To increase the gate coupling ratio of a semiconductor device 10, discrete elements 22, such as nanocrystals, are deposited over a floating gate 16. In one embodiment, the discrete elements 22 are pre-formed in a vapor phase and are attached to the semiconductor device 10 by electrostatic force. In one embodiment, the discrete elements 22 are pre-formed in a different chamber than that where they are attached. In another embodiment, the same chamber is used for the entire deposition process. An optional, interfacial layer 17 may be formed between the floating gate 16 and the discrete elements 22.

    摘要翻译: 为了增加半导体器件10的栅极耦合比,离散元件22(例如纳米晶体)沉积在浮动栅极16上。 在一个实施例中,分立元件22预先形成为气相并且通过静电力附着到半导体器件10。 在一个实施例中,分立元件22预先形成在不同于它们附接的腔室的腔室中。 在另一个实施例中,相同的室用于整个沉积工艺。 可选的界面层17可以形成在浮动栅极16和离散元件22之间。

    Memory device that includes passivated nanoclusters and method for manufacture
    39.
    发明授权
    Memory device that includes passivated nanoclusters and method for manufacture 有权
    包含钝化纳米簇的记忆体装置及其制造方法

    公开(公告)号:US06297095B1

    公开(公告)日:2001-10-02

    申请号:US09596399

    申请日:2000-06-16

    IPC分类号: H01L21336

    摘要: A semiconductor memory device with a floating gate that includes a plurality of nanoclusters (21) and techniques useful in the manufacturing of such a device are presented. The device is formed by first providing a semiconductor substrate (12) upon which a tunnel dielectric layer (14) is formed. A plurality of nanoclusters (19) is then grown on the tunnel dielectric layer (14). After growth of the nanoclusters (21), a control dielectric layer (20) is formed over the nanoclusters (21). In order to prevent oxidation of the formed nanoclusters (21), the nanoclusters (21) may be encapsulated using various techniques prior to formation of the control dielectric layer (20). A gate electrode (24) is then formed over the control dielectric (20), and portions of the control dielectric, the plurality of nanoclusters, and the gate dielectric that do not underlie the gate electrode are selectively removed. After formation of spacers (35), source and drain regions (32, 34) are then formed by implantation in the semiconductor layer (12) such that a channel region is formed between the source and drain regions (32, 34) underlying the gate electrode (24).

    摘要翻译: 提出了一种具有浮动栅极的半导体存储器件,其包括多个纳米团簇(21)和用于制造这种器件的技术。 该器件通过首先提供其上形成有隧道介电层(14)的半导体衬底(12)形成。 然后在隧道介电层(14)上生长多个纳米团簇(19)。 在纳米团簇(21)生长之后,在纳米团簇(21)上形成控制电介质层(20)。 为了防止形成的纳米团簇(21)的氧化,可以在形成控制电介质层(20)之前使用各种技术将纳米团簇(21)进行封装。 然后在控制电介质(20)上形成栅极(24),并且选择性地去除不在栅电极下面的控制电介质,多个纳米团簇和栅极电介质的部分。 在形成间隔物(35)之后,然后通过注入在半导体层(12)中形成源极和漏极区域(32,34),使得沟道区域形成在栅极下面的源极和漏极区域(32,34)之间 电极(24)。

    Gate structures and methods of manufacture
    40.
    发明授权
    Gate structures and methods of manufacture 有权
    门结构和制造方法

    公开(公告)号:US08895384B2

    公开(公告)日:2014-11-25

    申请号:US13293210

    申请日:2011-11-10

    IPC分类号: H01L21/8238 H01L21/8234

    摘要: A metal gate structure with a channel material and methods of manufacture such structure is provided. The method includes forming dummy gate structures on a substrate. The method further includes forming sidewall structures on sidewalls of the dummy gate structures. The method further includes removing the dummy gate structures to form a first trench and a second trench, defined by the sidewall structures. The method further includes forming a channel material on the substrate in the first trench and in the second trench. The method further includes removing the channel material from the second trench while the first trench is masked. The method further includes filling remaining portions of the first trench and the second trench with gate material.

    摘要翻译: 提供了具有通道材料的金属栅极结构及其制造方法。 该方法包括在衬底上形成虚拟栅极结构。 该方法还包括在虚拟栅极结构的侧壁上形成侧壁结构。 该方法还包括去除伪栅极结构以形成由侧壁结构限定的第一沟槽和第二沟槽。 该方法还包括在第一沟槽和第二沟槽中的衬底上形成沟道材料。 该方法还包括在第一沟槽被掩蔽的同时从第二沟槽去除沟道材料。 该方法还包括用栅极材料填充第一沟槽和第二沟槽的剩余部分。