公开(公告)号：US08293141B2

公开(公告)日：2012-10-23

申请号：US12032645

申请日：2008-02-16

申请人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

发明人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

IPC分类号： H01B1/06 ,  H01B1/02

CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J9/02 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4069 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24917

摘要： An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.

摘要翻译： 一种电子设备，包括由导电粘合剂（ECA）形成的电子电路结构，其具有低且稳定的接触电阻，包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，至少一种固化剂， 至少一种有机酸催化剂和铜颗粒。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。

公开(公告)号：US20080230262A1

公开(公告)日：2008-09-25

申请号：US12032645

申请日：2008-02-16

申请人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

发明人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

IPC分类号： H05K1/09 ,  B29C65/52

CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J9/02 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4069 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24917

摘要： An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.

摘要翻译： 一种电子设备，包括由导电粘合剂（ECA）形成的电子电路结构，其具有低且稳定的接触电阻，包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，至少一种固化剂， 至少一种有机酸催化剂和铜颗粒。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。

公开(公告)号：US09331029B2

公开(公告)日：2016-05-03

申请号：US14210057

申请日：2014-03-13

申请人： Michael B. Vincent ,  Zhiwei Gong ,  Jason R. Wright

发明人： Michael B. Vincent ,  Zhiwei Gong ,  Jason R. Wright

IPC分类号： H01L21/44 ,  H01L23/66 ,  H01L21/768 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L25/00 ,  H01L25/16 ,  H01L21/48 ,  H01L23/538 ,  H01L21/683 ,  H01L23/498 ,  H01L23/532

CPC分类号： H01L23/66 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/76838 ,  H01L21/76841 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49883 ,  H01L23/5328 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/24145 ,  H01L2224/24195 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/32153 ,  H01L2224/32221 ,  H01L2224/73267 ,  H01L2224/82005 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105

摘要： Methods for fabricating microelectronic packages, such as Fan-Out Wafer Level Packages, and microelectronic packages are provided. In one embodiment, the method includes placing a first semiconductor die on a temporary substrate, forming an electrically-conducive trace in contact with at least one of the first semiconductor die and the temporary substrate, and encapsulating the first semiconductor die and the electrically-conductive trace within a molded panel. The temporary substrate is removed to reveal a frontside of the molded panel through which the electrically-conducive trace is at least partially exposed. At least one redistribution layer is formed over the frontside of the molded panel, the at least one redistribution layer comprises an interconnect line in ohmic contact with the electrically-conducive trace.

摘要翻译： 提供了制造微电子封装的方法，例如扇出晶片级封装和微电子封装。 在一个实施例中，该方法包括将第一半导体管芯放置在临时衬底上，形成与第一半导体管芯和临时衬底中的至少一个接触的导电迹线，以及封装第一半导体管芯和导电 在模制面板内追踪。 去除临时衬底以露出模制面板的前侧，电导体迹线至少部分地暴露在模制面板的前侧。 在模制面板的前侧形成至少一个再分布层，所述至少一个再分配层包括与导电迹线欧姆接触的互连线。

公开(公告)号：US20160099212A1

公开(公告)日：2016-04-07

申请号：US14503962

申请日：2014-10-01

申请人： Michael B. Vincent

发明人： Michael B. Vincent

IPC分类号： H01L23/538 ,  H01L21/56 ,  H01L21/78 ,  H01L23/552 ,  H01L21/311 ,  H01L25/00 ,  H01L25/16 ,  H01L21/768 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/5389 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5382 ,  H01L23/5384 ,  H01L23/552 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/03 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025

摘要： A method and apparatus are provided for manufacturing a packaged electronic device (3) having pre-formed and placed through package circuit devices (35) which include an embedded circuit component (39) and conductor terminals (37A, 37B) extending from a molded package (38) embedding the circuit component (39). The through package circuit devices (35) are placed on end with integrated circuit die (34) and encapsulated in a molded device package (32) which leaves exposed the one or more conductor terminals (37A, 37B) positioned on first and second surfaces of the through package circuit device, where the conductor terminals (37A, 37B) and embedded circuit component (39) form a circuit path through the molded device package.

摘要翻译： 提供了一种用于制造包装电子器件（3）的方法和装置，该电子器件（3）具有预先形成并通过封装电路器件（35）放置，该器件包括嵌入电路部件（39）和从模制封装延伸的导体端子（37A，37B） （38）嵌入电路部件（39）。 通过封装电路器件（35）放置在具有集成电路管芯（34）的端部上，并封装在模制器件封装（32）中，该封装件使得一个或多个导体端子（37A，37B）位于第一和第二表面 通过封装电路器件，其中导体端子（37A，37B）和嵌入电路部件（39）形成通过模制器件封装的电路。

公开(公告)号：US09025340B2

公开(公告)日：2015-05-05

申请号：US14042628

申请日：2013-09-30

申请人： Jason R. Wright ,  Michael B. Vincent ,  Weng F. Yap

发明人： Jason R. Wright ,  Michael B. Vincent ,  Weng F. Yap

IPC分类号： H05K7/10 ,  H05K7/12 ,  H05K1/11 ,  H05K1/09 ,  H05K3/12 ,  H05K3/14 ,  H05K3/26 ,  H05K3/04 ,  H05K3/06 ,  H05K3/08

CPC分类号： H05K3/403 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/49805 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/04105 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/1076 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/1815 ,  H05K3/045 ,  H05K3/101 ,  H05K3/107 ,  H05K3/1258 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/4916 ,  H01L2924/00

摘要： Embodiments of methods for forming microelectronic device packages include forming a trench on a surface of a package body between exposed ends of first and second device-to-edge conductors, and forming a package surface conductor in the trench to electrically couple the first and second device-to-edge conductors. In one embodiment, the package surface conductor is formed by first forming a conductive material layer over the package surface, where the conductive material layer substantially fills the trench, and subsequently removing portions of the conductive material layer from the package surface adjacent to the trench. In another embodiment, the package surface conductor is formed by dispensing one or more conductive materials in the trench between the first and second exposed ends (e.g., using a technique such as spraying, inkjet printing, aerosol jet printing, stencil printing, or needle dispense). Excess conductive material may then be removed from the package surface adjacent to the trench.

摘要翻译： 用于形成微电子器件封装的方法的实施例包括在第一和第二器件对边缘导体的暴露端之间的封装主体的表面上形成沟槽，以及在沟槽中形成封装表面导体以电耦合第一和第二器件 到边缘导体。 在一个实施例中，封装表面导体通过首先在封装表面上形成导电材料层而形成，其中导电材料层基本上填充沟槽，并且随后将导电材料层的部分从与沟槽相邻的封装表面移除。 在另一个实施例中，通过在第一和第二暴露端之间的沟槽中分配一个或多个导电材料来形成封装表面导体（例如，使用诸如喷涂，喷墨印刷，气溶胶喷射印刷，模板印刷或针分配的技术 ）。 然后可以从邻近沟槽的封装表面移除过量的导电材料。

公开(公告)号：US20150092377A1

公开(公告)日：2015-04-02

申请号：US14042628

申请日：2013-09-30

申请人： JASON R. WRIGHT ,  Michael B. Vincent ,  Weng F. Yap

发明人： JASON R. WRIGHT ,  Michael B. Vincent ,  Weng F. Yap

IPC分类号： H05K1/11 ,  H05K3/12 ,  H05K3/08 ,  H05K3/26 ,  H05K3/04 ,  H05K3/06 ,  H05K1/09 ,  H05K3/14

CPC分类号： H05K3/403 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/49805 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/04105 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/1076 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/1815 ,  H05K3/045 ,  H05K3/101 ,  H05K3/107 ,  H05K3/1258 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/4916 ,  H01L2924/00

摘要： Embodiments of methods for forming microelectronic device packages include forming a trench on a surface of a package body between exposed ends of first and second device-to-edge conductors, and forming a package surface conductor in the trench to electrically couple the first and second device-to-edge conductors. In one embodiment, the package surface conductor is formed by first forming a conductive material layer over the package surface, where the conductive material layer substantially fills the trench, and subsequently removing portions of the conductive material layer from the package surface adjacent to the trench. In another embodiment, the package surface conductor is formed by dispensing one or more conductive materials in the trench between the first and second exposed ends (e.g., using a technique such as spraying, inkjet printing, aerosol jet printing, stencil printing, or needle dispense). Excess conductive material may then be removed from the package surface adjacent to the trench.

摘要翻译： 用于形成微电子器件封装的方法的实施例包括在第一和第二器件对边缘导体的暴露端之间的封装主体的表面上形成沟槽，以及在沟槽中形成封装表面导体以电耦合第一和第二器件 到边缘导体。 在一个实施例中，封装表面导体通过首先在封装表面上形成导电材料层而形成，其中导电材料层基本上填充沟槽，并且随后将导电材料层的部分从与沟槽相邻的封装表面移除。 在另一个实施例中，通过在第一和第二暴露端之间的沟槽中分配一个或多个导电材料来形成封装表面导体（例如，使用诸如喷涂，喷墨印刷，气溶胶喷射印刷，模板印刷或针分配的技术 ）。 然后可以从邻近沟槽的封装表面移除过量的导电材料。