Abstract:
A laser includes an active region surrounded by first and second waveguide layers. Two or more mask openings are formed within a dielectric layer on a surface parallel to the active region. A refractive grating is formed on the dielectric mask openings and includes three-dimensional grating features spaced apart in the light-propagation direction of the laser. The refractive grating provides modulation of a real part of the effective refractive index of the laser and modulation of the imaginary part is provided by modulation of the current flow through the mask openings.
Abstract:
An edge emitting structure includes an active region configured to generate radiation in response to excitation by a pumping beam incident on the structure. A front facet of the edge emitting structure is configured to emit the radiation generated by the active region. A metallic reflective coating disposed on at least one of the front and rear facets of the edge emitting structure. The metallic reflective coating is configured to reflect the radiation generated by the active region.
Abstract:
An ultraviolet (UV) radiation emitting device includes an epitaxial heterostructure comprising an AlGaInN active region. The AlGaInN active region includes one or more quantum well structures with Al content greater than about 50% and having a non-c-plane crystallographic growth orientation. The AlGaInN active region is configured to generate UV radiation in response to excitation by an electron beam generated by an electron beam pump source.
Abstract:
A thin film device described herein includes a first thin film layer, a second film layer and a heterostructure within the second film layer. The first thin film layer is atop a substrate. The second thin film layer is grown from the first thin film layer through a patterned mask, having openings, under selective area growth (SAG) conditions. The second thin film layer is configured to be released from the first thin film layer by etching a trench. The etched trench may provide access to the patterned mask and the patterned mask may be eliminated with a wet etchant.
Abstract:
Disclosed herein are embodiments of a vertical external cavity surface emitting laser (VECSEL) device that utilizes an external micromirror array, and methods of fabricating and using the same. In one embodiment, a VECSEL device includes a gain chip, a mirror, and a micromirror array. The gain chip includes a gain medium. The micromirror array includes a plurality of curved micromirrors. The micromirror array and the mirror define an optical cavity, and the micromirror array is oriented such that at least one of the curved micromirrors is to reflect light generated by the gain medium back toward the gain medium along a length of the optical cavity.
Abstract:
Diode includes light emitting region, first metal layer, dielectric layer, and second metal layer. Light emitting diode includes n-type group III-nitride portion, p-type group III-nitride layer, and light emitting region sandwiched between n- and p-type layers. First metal layer may be coupled to p-type III-N portion and plurality of first terminals. First metal layer and p-type III-N portion may have substantially similar lateral size that is smaller than 200 micrometers. A portion of light emitting region and first metal layer may include a single via. Electrically-insulating layer may be coupled to first metal layer and sides of the single via. First terminals may be exposed from electrically-insulating layer. Second metal layer may include second terminal and may be coupled to electrically-insulating layer and to n-type III-N portion through the single via. The thickness of the diode excluding second terminal may be between 2 and 20 micrometers. Other embodiments are described.
Abstract:
A device includes one or more reflector components. Each reflector component comprises layer pairs of epitaxially grown reflective layers and layers of a non-epitaxial material, such as air. Vias extend through at least some of the layers of the reflector components. The device may include a light emitting layer.
Abstract:
A thin film device described herein includes a first thin film layer, a second film layer and a heterostructure within the second film layer. The first thin film layer is atop a substrate. The second thin film layer is grown from the first thin film layer through a patterned mask, having openings, under selective area growth (SAG) conditions. The second thin film layer is configured to be released from the first thin film layer by etching a trench. The etched trench may provide access to the patterned mask and the patterned mask may be eliminated with a wet etchant.
Abstract:
Diode includes light emitting region, first metal layer, dielectric layer, and second metal layer. Light emitting diode includes n-type group III-nitride portion, p-type group III-nitride layer, and light emitting region sandwiched between n- and p-type layers. First metal layer may be coupled to p-type III-N portion and plurality of first terminals. First metal layer and p-type III-N portion may have substantially similar lateral size that is smaller than 200 micrometers. A portion of light emitting region and first metal layer may include a single via. Electrically-insulating layer may be coupled to first metal layer and sides of the single via. First terminals may be exposed from electrically-insulating layer. Second metal layer may include second terminal and may be coupled to electrically-insulating layer and to n-type III-N portion through the single via. The thickness of the diode excluding second terminal may be between 2 and 20 micrometers. Other embodiments are described.
Abstract:
A sensor includes a light emitter capable of producing stimulated emission. The sensor includes an optical fiber comprising at least one fiber Bragg grating. A first end of the optical fiber is optically coupled to a first emitting end of the light emitter. The fiber Bragg grating is located at a measurement region of the optical fiber away from the first end. A change in wavelength of the laser emission in the optical fiber is induced by a change in peak reflectivity of the fiber Bragg grating. The change in the peak reflectivity occurs in response to an environmental change at the measurement region, e.g., which changes a physical periodicity and/or the refractive index of the grating. The sensor includes an optical detector coupled to the optical fiber or the light emitter that detects the change in the wavelength.