RESIN COMPOSITION
    34.
    发明申请
    RESIN COMPOSITION 失效
    树脂组合物

    公开(公告)号:US20090005475A1

    公开(公告)日:2009-01-01

    申请号:US11830276

    申请日:2007-07-30

    IPC分类号: C08K5/3417

    摘要: Moldings made with a polyester resin which comprises a cyclic compound represented by a following formula A1-B-A2 (In the formula, A1 and A2 are the same or different and show groups represented by a below-described formula, P shows a benzene ring which may be replaced by a material, and B shows a bivalent hydrocarbon group which may be replaced by a material) and polyester capable of having a crystal structure.

    摘要翻译: 使用包含由下式表示的环状化合物的聚酯树脂制成的模制品:在线式描述=“In-line formula”end =“lead”→> A1-B-A2 <βin-line-formula (式中,A 1和A 2相同或不同,表示由下述式表示的基团,P表示苯环,可以被 材料,B表示可被材料代替的二价烃基)和能够具有晶体结构的聚酯。

    Lens barrel and image capturing apparatus
    37.
    发明申请
    Lens barrel and image capturing apparatus 失效
    镜筒和摄像装置

    公开(公告)号:US20080024888A1

    公开(公告)日:2008-01-31

    申请号:US11825127

    申请日:2007-07-03

    IPC分类号: G02B7/04

    CPC分类号: G02B7/102

    摘要: The present invention may provide a lens barrel which may include a guide shaft, and a movable lens frame. The barrel may be with an image capturing optical system disposed therein. The guide shaft may be disposed in the barrel and may extend parallel to the optical axis of the image capturing optical system. The movable lens frame may be reciprocally movable along the guide shaft in the barrel and holding lenses of the image capturing optical system. The barrel may include a wall supporting the guide shaft. The wall may include a light shield member projecting therefrom along the guide shaft in covering relation to a surface of the guide shaft which faces the optical axis.

    摘要翻译: 本发明可以提供一种镜筒,其可以包括导向轴和可移动透镜框。 枪管可以具有设置在其中的摄像光学系统。 引导轴可以设置在镜筒中并且可以平行于图像拍摄光学系统的光轴延伸。 可移动透镜框架可以沿着镜筒中的引导轴和摄像光学系统的保持透镜往复移动。 枪管可以包括支撑引导轴的壁。 壁可以包括沿着导向轴从其突出的遮光构件,该遮光构件与导向轴的面向光轴的表面相关。

    Systems and methods for manipulating liquid films on semiconductor substrates
    39.
    发明申请
    Systems and methods for manipulating liquid films on semiconductor substrates 失效
    用于操纵半导体衬底上的液膜的系统和方法

    公开(公告)号:US20070197050A1

    公开(公告)日:2007-08-23

    申请号:US11359730

    申请日:2006-02-22

    IPC分类号: H01L21/00

    CPC分类号: H01L21/6715

    摘要: A semiconductor substrate undergoing processing to fabricate integrated circuit devices thereon is spun about a rotational axis while introducing liquid onto a surface of the substrate. An annular-shaped sheet of liquid is formed on the surface, the sheet of liquid having an inner diameter defining a liquid-free void. The size of a diameter of the void is reduced by manipulation of the annular-shaped sheet of liquid. The void may then be enlarged until the surface is substantially dry. The annular-shaped sheet of liquid may be formed and altered by selectively moving a contact area on the surface of the substrate on which the liquid is introduced. Systems for processing a substrate and configured to deposit and manipulate a sheet of liquid thereon are also disclosed.

    摘要翻译: 在其上制造集成电路器件的处理的半导体衬底围绕旋转轴旋转,同时将液体引入到衬底的表面上。 在表面上形成环状的液体片,该液体片具有限定无液体空隙的内径。 通过操作环形片状液体来减小空隙直径的大小。 然后可以扩大空隙,直到表面基本上干燥。 可以通过选择性地移动在其上引入液体的基板的表面上的接触区域来形成和改变环形片状液体。 还公开了用于处理基板并且被配置为在其上沉积和操纵一片液体的系统。

    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    40.
    发明申请
    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    固态成像装置及其制造方法

    公开(公告)号:US20070164384A1

    公开(公告)日:2007-07-19

    申请号:US11466523

    申请日:2006-08-23

    IPC分类号: H01L27/14

    摘要: A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be manufactured with a high yield ratio are provided. The solid-state imaging device includes at least a silicon layer formed with a photo sensor portion and a wiring layer formed on the front-surface side of the silicon layer, and in which light L is made to enter from the rear-surface side opposite to the front-surface side of the silicon layer and the thickness of the silicon layer 4 is 10 μm or less. Also, the method for manufacturing the solid-state imaging device at least includes the steps of: forming a semiconductor region of a photo sensor portion in a silicon layer of a layered substrate in which a silicon substrate, an intermediate layer and a silicon layer are laminated; bonding a first supporting substrate onto the silicon layer; removing the silicon substrate and the intermediate layer; forming thereafter a wiring portion above the silicon layer; bonding a second supporting substrate onto the wiring portion, and removing the first supporting substrate to make the silicon layer exposed.

    摘要翻译: 具有高灵敏度的固态成像装置和获得小型化像素的结构,以及其中界面稳定的固态成像装置的制造方法,光谱特性优异并且可以用 提供高产率。 固态成像装置至少包括形成有光传感器部分的硅层和形成在硅层的表面侧的布线层,并且使光L从相对的背面侧进入 到硅层的表面侧,硅层4的厚度为10μm以下。 此外,制造固态成像装置的方法至少包括以下步骤:在硅衬底,中间层和硅层的层叠衬底的硅层中形成光电传感器部分的半导体区域 层压; 将第一支撑衬底接合到所述硅层上; 去除硅衬底和中间层; 然后形成硅层上方的布线部分; 将第二支撑基板接合到布线部分上,并且移除第一支撑基板以使硅层暴露。