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公开(公告)号：US4495251A
公开(公告)日：1985-01-22
申请号：US466175
申请日：1983-02-14
CPC分类号： H05B6/6426 , C09D1/00 , C09D5/24 , C09D7/12 , C23C18/1641 , C23C18/1653 , C23C18/54 , Y10T428/12028 , Y10T428/12111 , Y10T428/12118
摘要： A microwave oven cabinet is constructed with plastic materials and has a low resistivity coating on the outside surfaces thereof, which coating is achieved by applying a mixture of a metallic powder and polymer on the surfaces and curing the polymer, followed by an augmentation replacement reaction being effected to replace some of the metallic powder with a more noble metal in such a way that the total volume on the surface of deposited metal exceeds that of the original metal powder replaced at the surface.
摘要翻译： 微波炉柜由塑料材料构成，外表面具有低电阻率的涂层，该涂层通过在表面上涂覆金属粉末和聚合物的混合物并使聚合物固化，然后进行增强置换反应 以更贵的金属代替一些金属粉末，使得沉积金属表面上的总体积超过在表面更换的原始金属粉末的总体积。
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公开(公告)号：US4487811A
公开(公告)日：1984-12-11
申请号：US461809
申请日：1983-01-28
CPC分类号： H05K3/246 , H05K1/095 , H05K2201/0125 , Y10T428/12014
摘要： A low-cost conductor, e.g. a printed circuit, is prepared by applying a mixture of a metallic powder and polymer on a substrate and curing the polymer, followed by an augmentation replacement reaction being effected to replace some of the metallic powder with a more noble metal in such a way that the total volume of deposited metal on the surface exceeds that of the original metal powder at that surface. This procedure produces a contiguous layer of conducting metal on the substrate. The conductors thus formed can easily be soldered without leaching using conventional tin-lead solders.
摘要翻译： 低成本导体，例如 通过将金属粉末和聚合物的混合物施加到基底上并固化聚合物来制备印刷电路，然后进行增强置换反应以用更贵金属代替一些金属粉末，使得 表面上沉积金属的总体积超过了该表面的原始金属粉末的总体积。 该过程在衬底上产生连续的导电金属层。 这样形成的导体可以容易地被焊接而不用常规的锡铅焊料浸出。
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公开(公告)号：US4481404A
公开(公告)日：1984-11-06
申请号：US452223
申请日：1982-12-22
CPC分类号： F24C14/02
摘要： In a cooking oven which is cleaned by pyrolyzation of soil within the oven cavity and has a smoke eliminator duct extending through the oven wall, with a smoke eliminator heater disposed adjacent to the duct inlet, a reducing gas sensor is mounted either adjacent to the oven end of the smoke eliminator duct or within the smoke eliminator duct near its discharge end. An electrical relay or microcomputer control is coupled between the gas sensor and the heater to initially heat the oven interior and to later deenergize the heater when the reducing gas sensor output indicates a desired oven condition. The oven heaters are temporarily deenergized when the gas sensor output indicate a smoke eliminator overload. If the gas sensor is mounted in the smoke eliminator duct, the smoke eliminator heater may be deenergized toward the end of the cleaning cycle, so that the effluent is not affected by the smoke eliminator heater before reaching the gas sensor. Plural smoke eliminator heaters are also disclosed to enable increase of heater power during the early cleaning stages and reduction of the heater power during the later cleaning stages.
摘要翻译： 在烹饪炉中，其通过在烤箱腔内的土壤热解而被清洁，并且具有延伸穿过炉壁的除烟器管道，具有邻近管道入口布置的除烟器加热器，还原气体传感器安装在烤箱附近 除烟器末端或排烟管附近的排烟管。 一个继电器或微型计算机控制器连接在气体传感器和加热器之间，以便当该还原气体传感器输出指示期望的烘箱条件时，最初加热炉内部并随后使加热器断电。 当气体传感器输出指示排烟装置过载时，烤箱加热器暂时断电。 如果气体传感器安装在除烟器管道中，则烟雾消除器加热器可能在清洁循环结束时被断电，使得排气管在到达气体传感器之前不受排烟器加热器的影响。 还公开了多个除烟加热器，以便能够在早期清洁阶段期间增加加热器功率并且在后续清洁阶段期间减少加热器功率。
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公开(公告)号：US4470883A
公开(公告)日：1984-09-11
申请号：US490280
申请日：1983-05-02
摘要： Electrical conductors having enhanced resolution/spacing and adhesion characteristics are prepared by applying a mixture of a carbonyl-processed nickel powder and a polymer to a substrate, curing the polymer, and immersing the cured polymer pattern in an augmentative-replacement/electroplating bath, to effect an augmentative replacement reaction to form a contiguous layer of conducting metal on the substrate and thereafter electroplating an additional metal layer on the contiguous layer.
摘要翻译： 通过将羰基处理的镍粉末和聚合物的混合物施加到基材上，固化聚合物，并将固化的聚合物图案浸入增塑置换电镀浴中来制备具有增强的分辨率/间距和粘附特性的电导体， 影响增量置换反应，以在衬底上形成连续的导电金属层，然后在连续层上电镀另外的金属层。
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公开(公告)号：US4438291A
公开(公告)日：1984-03-20
申请号：US355966
申请日：1982-03-08
CPC分类号： G01K7/04 , Y10S428/901
摘要： A low-cost thermocouple utilizes a substrate of a first conductor, upon a surface of which is deposited on insulative layer, supporting a screen-printed conductive ink pattern. A second conductor is electrolessly plated upon the conductive ink pattern and onto at least a portion of the first conductor, through an aperture in the insulation layer therebetween. Thermocouple action occurs along the length of the plated conductor contact with the substrate conductor.
摘要翻译： 低成本热电偶利用第一导体的衬底，其表面沉积在绝缘层上，支撑丝网印刷的导电油墨图案。 第二导体通过导电油墨图案之间的绝缘层中的孔无电镀在第一导体的至少一部分上。 热电偶的作用是沿着与衬底导体的电镀导体接触的长度发生。
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公开(公告)号：US4377505A
公开(公告)日：1983-03-22
申请号：US220937
申请日：1980-12-29
IPC分类号： H01C17/065 , H01B1/02
CPC分类号： H01C17/06533
摘要： An electrical resistor family based on oxides of tungsten and/or molybdenum is prepared by combining a polymeric binder with such oxides in an appropriate amount to realize the desired bulk properties. The resistance of the composite can be varied by varying the metal content of the oxides and/or by appropriate combination of the various oxides. Inert fillers are not required and the bulk properties are more stable.
摘要翻译： 基于钨和/或钼的氧化物的电阻器系列通过将聚合物粘合剂与这种氧化物合适的量合并来实现所需的体积特性来制备。 可以通过改变氧化物的金属含量和/或通过各种氧化物的适当组合来改变复合材料的电阻。 不需要惰性填料，体积性能更稳定。
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37.发明授权Oven having a cavity heated by at least one monolithic integrated heat source 失效具有由至少一个整体集成热源加热的空腔的炉
公开(公告)号：US4298789A
公开(公告)日：1981-11-03
申请号：US132812
申请日：1980-03-24
摘要： A cavity, such as an oven cavity, is heated by at least one monolithic integrated heat source, each fabricated by depositing a layer of resistive material on a substrate of non-conducting, or insulating, material. A pair of spaced-apart conductive elements contact opposite ends of the resistance sheet to enable a flow of current through the sheet thereby producing substantially uniform heating over the entire area covered by the resistive sheet.
摘要翻译： 通过至少一个整体式集成热源来加热空腔，例如烘箱腔，每个通过在非导电或绝缘材料的衬底上沉积一层电阻材料制成。 一对间隔开的导电元件接触电阻片的相对端，以使电流流过片材，从而在由电阻片覆盖的整个区域上产生基本均匀的加热。
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公开(公告)号：US06890234B2
公开(公告)日：2005-05-10
申请号：US10837735
申请日：2004-05-03
CPC分类号： H01L33/508 , H01L2224/48463 , H01L2224/8592 , H01S5/028
摘要： A light source (10) includes a light emitting component (32), such as a UV/blue light emitting diode or laser diode coated with a layer (60) of a phosphor material (64). The phosphor material converts a portion of the light emitted by the light emitting component to light of a longer wavelength, such as yellow light. The thickness d of the layer varies across the light emitting component in relation to the intensity of light emitted by the light emitting component. This maintains a uniform color of the emission from the light source while minimizing the loss in light intensity (brightness) due to the presence of the phosphor.
摘要翻译： 光源（10）包括诸如UV /蓝色发光二极管的发光部件（32）或涂覆有磷光体材料（64）的层（60）的激光二极管。 荧光体材料将由发光部件发射的光的一部分转换为较长波长的光，例如黄色光。 该层的厚度d相对于由发光部件发出的光的强度而在发光部件上变化。 这保持了来自光源的发射的均匀颜色，同时由于荧光体的存在而使光强度（亮度）的损失最小化。
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39.发明授权High power white LED lamp structure using unique phosphor application for LED lighting products 有权大功率白光LED灯结构采用独特的荧光粉应用于LED照明产品公开(公告)号：US06635987B1
公开(公告)日：2003-10-21
申请号：US09670240
申请日：2000-09-26
IPC分类号： H01J162
CPC分类号： H01L25/0753 , H01L25/0756 , H01L33/50 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： Phosphor application for high power LED lamps for use in lighting products includes a lensing structure and a phosphor layer applied to at least one side of the lensing structure. The lensing structure is positioned in the LED lamp so that emitted light from the LED die excites the phosphor layer. The lensing structure ensures both uniform color and light output as it eliminates the necessity of applying the phosphor layer directly to the LED die surface.
摘要翻译： 用于照明产品的大功率LED灯的荧光体应用包括透镜结构和施加到透镜结构的至少一侧的荧光体层。 透镜结构位于LED灯中，使得来自LED管芯的发射光激发荧光体层。 透镜结构确保均匀的颜色和光输出，因为它消除了将荧光体层直接施加到LED管芯表面的必要性。
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公开(公告)号：US06483196B1
公开(公告)日：2002-11-19
申请号：US09542037
申请日：2000-04-03
IPC分类号： H01L2940
CPC分类号： H01L33/20 , H01L33/54 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/13 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/05669 , H01L2224/05671 , H01L2224/05684
摘要： A flip chip structure of a light-emitting device comprising a UV/blue light emitting diode (LED) is disclosed. The flip chip structure is optimized to produce unique light focusing and phosphor illumination out the bottom of the structure. The flip chip structure includes a substrate, a gallium nitride layer epitaxially grown on a top surface of the substrate, and one or more layers of lensing material deposited on a bottom surface of the substrate. The lensing material is preferably a polymer lensing material, an index matching material, or a mixture thereof. The gallium nitride layer is deposited in the form of one or more odd-sided polygons, for enhanced light extraction.
摘要翻译： 公开了一种包括UV /蓝色发光二极管（LED）的发光器件的倒装芯片结构。 优化了倒装芯片结构，从而在结构底部产生独特的聚光和荧光体照明。 倒装芯片结构包括衬底，外延生长在衬底的顶表面上的氮化镓层和沉积在衬底的底表面上的一层或多层透镜材料。 透镜材料优选为聚合物透镜材料，折射率匹配材料或其混合物。 氮化镓层以一个或多个奇数多边形的形式沉积，用于增强光提取。
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