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    Vacuum fixture and method for fabricating electronic assemblies
    5.
    发明授权
    Vacuum fixture and method for fabricating electronic assemblies 失效
    真空夹具及其制造方法

    公开(公告)号：US5546654A

    公开(公告)日：1996-08-20

    申请号：US297076

    申请日：1994-08-29

    申请人： Robert J. Wojnarowski ,  Thomas B. Gorczyca

    发明人： Robert J. Wojnarowski ,  Thomas B. Gorczyca

    IPC分类号： H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  B23P19/04 ,  H05K3/42

    CPC分类号： H05K3/284 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2924/15153 ,  H05K1/182 ,  Y10S29/044 ,  Y10T279/11 ,  Y10T29/49146 ,  Y10T29/49165 ,  Y10T29/53191

    摘要： A method for fabricating an electronic assembly comprises attaching an insulative film to a frame and positioning at least one electronic component having a face with connections pads face down on the insulative film. The insulative film is positioned on a porous sheet supported by a vacuum fixture. The porous sheet and vacuum fixture are adapted so as to be capable of creating vacuum conditions for holding the insulative film with a substantially flat surface on the porous sheet. A vacuum is created within the vacuum chamber for flatly holding the insulative film on the porous sheet. A substrate is applied to the insulative film and the at least one electronic component. In one embodiment the substrate is applied by securing the insulative film in position with a mold form having at least one opening around the electronic component and adding substrate molding material at least partially around the component through the opening. In another embodiment the substrate is applied by providing a substrate having at least one well therein and positioning the insulative film over at least a portion of the substrate and the electronic component into the well.

    摘要翻译： 一种用于制造电子组件的方法包括将绝缘膜附接到框架并且将至少一个具有面的电子部件定位在绝缘膜上，连接焊盘面向下。 绝缘膜位于由真空夹具支撑的多孔片上。 多孔片材和真空固定装置适于能够产生用于将绝缘膜保持在多孔片材上具有基本平坦的表面的真空条件。 在真空室内产生真空，以将绝缘膜平坦地保持在多孔片上。 将衬底施加到绝缘膜和至少一个电子部件。 在一个实施例中，通过用绝缘膜将电绝缘薄膜固定在适当的位置上来施加基底，该模具形式具有围绕电子部件的至少一个开口，并且通过该开口至少部分地围绕该部件添加基底模制材料。 在另一个实施例中，通过提供其中具有至少一个阱的衬底并将绝缘膜定位在衬底和电子部件的至少一部分进入阱中来施加衬底。

    Integral power and ground structure for multi-chip modules
    9.
    发明授权
    Integral power and ground structure for multi-chip modules 失效
    多芯片模块的集成电源和接地结构

    公开(公告)号：US5353195A

    公开(公告)日：1994-10-04

    申请号：US87433

    申请日：1993-07-09

    申请人： Raymond A. Fillion ,  Robert J. Wojnarowski

    发明人： Raymond A. Fillion ,  Robert J. Wojnarowski

    IPC分类号： H01L23/50 ,  H01L23/538 ,  H05K7/02

    CPC分类号： H01L24/82 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043

    摘要： A multi-chip module includes a substrate supporting a plurality of chips. A dielectric layer which overlies the chips and the substrate has a connection surface and a substrate surface with metallization planes having plane openings patterned on each surface and vias aligned with predetermined pads on the chips and predetermined portions of the metallization plane of the substrate surface. An adhesive layer is situated between the substrate and the substrate surface of the dielectric layer, and a pattern of electrical conductors extends through the vias to interconnect selected chips and selected portions of the metallization planes. In a related design, the dielectric layer may be a board having chip openings and conductive through-connections aligned with predetermined portions of the metallization plane of the substrate surface. The board can be thick enough that chip wells are not necessary for each chip, in which case, a base dielectric layer having vias aligned with chip pads, through-connections and the connection surface overlies the board and supports a pattern of electrical conductors which interconnect the chips and metallization planes.

    摘要翻译： 多芯片模块包括支撑多个芯片的基板。 覆盖芯片和衬底的电介质层具有连接表面和衬底表面，其中金属化平面具有在每个表面上图案化的平面开口，并且与衬底表面的芯片和金属化平面的预定部分上的预定焊盘对准的通孔。 粘合剂层位于基底和介电层的基底表面之间，并且电导体的图形延伸穿过通孔以互连选定的切屑和金属化平面的选定部分。 在相关设计中，电介质层可以是具有芯片开口和与衬底表面的金属化平面的预定部分对准的导电贯穿连接的板。 板可以足够厚，使得每个芯片不需要芯片阱，在这种情况下，具有与芯片焊盘，通孔连接对准的通孔的基底介电层，并且连接表面覆盖在板上并且支撑电连接的图案 芯片和金属化平面。

    High density interconnect thermoplastic die attach material and solvent die attach processing
    10.
    发明授权
    High density interconnect thermoplastic die attach material and solvent die attach processing 失效
    高密度互连热塑性管芯附着材料和溶剂管芯附着加工

    公开(公告)号：US5348607A

    公开(公告)日：1994-09-20

    申请号：US20913

    申请日：1993-02-22

    申请人： Robert J. Wojnarowski ,  Charles W. Eichelberger

    发明人： Robert J. Wojnarowski ,  Charles W. Eichelberger

    IPC分类号： H01L21/58 ,  H01L23/538 ,  B32B31/00

    CPC分类号： H01L24/83 ,  H01L23/5389 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  Y10T156/109 ,  Y10T156/1092 ,  Y10T156/1111

    摘要： A mixture for affixing dice to a substrate includes a thermoplastic polyimide, a solvent for the polyimide, and a solvent which does not dissolve the polyimide but adds thixotropicity to the mixture. The mixture is applied to the substrate, the dice are placed thereon, and the solvents are evaporated to bond the dice to the substrate. The bond is radiation hard and exhibits high shear pull strength. A poor solvent for the polyimide, sprayed over the dice and exposed portions of die attach material, causes some polyimide to precipitate out of solution in the exposed portions of die attach material to form a grid that extends between the dice and prevents the dice from "swimming together" during high temperature processing. In a solvent die-attachment method, the substrate is first coated with a mixture of die attach material, and the mixture is dried. Spraying a solvent over the die attach material causes the material to soften so that the dice applied thereto may adhere. The die attach material is then dried to form the bond.

    摘要翻译： 用于将骰子固定到基底的混合物包括热塑性聚酰亚胺，聚酰亚胺的溶剂和不溶解聚酰亚胺但对混合物具有触变性的溶剂。 将混合物施加到基底上，将骰子放置在其上，并蒸发溶剂以将骰子结合到基底。 该粘合剂是辐射硬的并且表现出高的剪切拉力。 用于聚酰亚胺的不良溶剂喷涂在芯片附着材料的骰子和暴露部分上，导致一些聚酰亚胺从裸片附着材料的暴露部分中沉淀出溶液中以形成在骰子之间延伸的网格，并防止骰子“ 在高温加工过程中一起游泳。 在溶剂模具附着方法中，首先用基片附着材料的混合物涂覆基板，并将混合物干燥。 在模具附着材料上喷涂溶剂导致材料软化，使得施加到其上的骰子可以粘附。 然后将管芯附着材料干燥以形成粘合。