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52 条记录 (耗时 0.079 秒)

    Power supply apparatus with current-sharing function
    33.
    发明授权
    Power supply apparatus with current-sharing function 有权
    具有分流功能的电源装置

    公开(公告)号：US08064228B2

    公开(公告)日：2011-11-22

    申请号：US12509814

    申请日：2009-07-27

    申请人： Shih-Chang Lee ,  Chung-Shu Lee

    发明人： Shih-Chang Lee ,  Chung-Shu Lee

    IPC分类号： H02M3/335

    CPC分类号： H02M3/33569 ,  Y02B70/1433

    摘要： A power supply apparatus with a current-sharing function includes a conversion circuit, a square-wave generating circuit, a resonant circuit, and a rectifier-filter circuit. The conversion circuit has two transformers, and each of the transformers has a primary winding and two secondary windings. More particularly, two secondary windings of the different transformers are electrically connected in series and then the two in-series secondary windings are electrically connected in parallel. The square-wave generating circuit is used to switch a DC voltage into a pulsating voltage. The resonant circuit is electrically connected to the square-wave generating circuit, and having a first capacitor and the primary windings of the transformers. The rectifier-filter circuit has at least two switch components and a second capacitor, and electrically connected to the secondary windings of the transformers to rectify an AC output voltage into a DC output voltage, and the DC output voltage is outputted to at least one output terminal.

    摘要翻译： 具有电流共享功能的电源装置包括转换电路，方波发生电路，谐振电路和整流滤波电路。 转换电路具有两个变压器，并且每个变压器具有初级绕组和两个次级绕组。 更具体地，不同变压器的两个次级绕组串联电连接，然后两个串联的次级绕组并联电连接。 方波发生电路用于将直流电压切换为脉动电压。 谐振电路电连接到方波发生电路，并且具有第一电容器和变压器的初级绕组。 整流滤波电路具有至少两个开关部件和第二电容器，并且电连接到变压器的次级绕组以将AC输出电压整流为DC输出电压，并且将DC输出电压输出至少一个输出 终奌站。

    Method for fabricating a flexible substrate based ball grid array (BGA) package
    35.
    发明授权
    Method for fabricating a flexible substrate based ball grid array (BGA) package 有权
    用于制造基于柔性基板的球栅阵列（BGA）封装的方法

    公开(公告)号：US06380002B2

    公开(公告)日：2002-04-30

    申请号：US09839212

    申请日：2001-04-23

    申请人： Kao-Yu Hsu ,  Shih-Chang Lee

    发明人： Kao-Yu Hsu ,  Shih-Chang Lee

    IPC分类号： H01L2148

    CPC分类号： H05K1/0271 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K2201/0394 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2203/0315 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

    摘要： A flexible substrate based BGA package mainly comprises a semiconductor chip securely attached onto a flexible film substrate through a nonconductive adhesive. The flexible film substrate is formed from a flexible film having a chip attaching area for carrying the semiconductor chip. The upper surface of the flexible film is provided with a plurality of chip connection pads, a plurality of solder pads, and at least a dummy pad which is disposed centrally on the chip attaching area. The purpose of the dummy pad is to increase the rigidity and strength of the central part of the chip attaching area. The chip connection pads are arranged about the periphery of the chip attaching area for electrically connected to the semiconductor chip. The solder pads are disposed about the dummy pad(s) and electrically connected to the corresponding chip connection pads. The flexible film has a plurality of through-holes formed corresponding to the solder pads such that each solder pad has a portion exposed within the corresponding through-hole for mounting a solder ball. A package body is formed over the semiconductor chip and the upper surface of the flexible film substrate.

    摘要翻译： 基于柔性基板的BGA封装主要包括通过非导电粘合剂牢固地附接到柔性膜基底上的半导体芯片。 柔性膜基板由具有用于承载半导体芯片的芯片附着区域的柔性膜形成。 柔性膜的上表面设置有多个芯片连接焊盘，多个焊盘和至少设置在芯片安装区域中央的虚拟焊盘。 虚拟焊盘的目的是增加芯片安装区域的中心部分的刚度和强度。 芯片连接焊盘围绕芯片安装区域的周边布置以电连接到半导体芯片。 焊盘围绕虚拟焊盘设置并电连接到相应的芯片连接焊盘。 柔性膜具有与焊料焊盘相对形成的多个通孔，使得每个焊盘具有暴露在相应通孔内的部分，用于安装焊球。 在半导体芯片和柔性膜基板的上表面上形成封装体。

    Molding apparatus for flexible substrate based package
    36.
    发明授权
    Molding apparatus for flexible substrate based package 有权
    用于基于柔性基板的包装的成型装置

    公开(公告)号：US06257857B1

    公开(公告)日：2001-07-10

    申请号：US09494649

    申请日：2000-01-31

    申请人： Shih-Chang Lee ,  Gwo Liang Weng

    发明人： Shih-Chang Lee ,  Gwo Liang Weng

    IPC分类号： B29C4514

    CPC分类号： B29C45/14655 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  Y10T428/234 ,  Y10T428/24612 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A molding apparatus for use in forming a flexible substrate based package comprises a plurality of pots. Two flexible substrates are installed at two sides of the pots. A plurality of sets of chips mounted on the upper surface of the substrate wherein each set of chips is in an array arrangement. The molding apparatus further comprises a plurality of runners. Each runner independently extends from one side of the pot to one side of the substrate, and connects to a cavity of a upper part of a mold disposed on the substrate through a gate. The present invention characterized in that, the molding apparatus is provided with a first communication channel formed corresponding to one side of the substrate and a second communication channel formed corresponding to the other side of the substrate. The first and the second communication channels interconnect the cavities at two opposite sides thereof. Therefore, the molded product removed from the mold has a first and a second connection bar, which form interconnection at two opposite sides of each unit package body thereby integrating all unit package bodies, and thereby enhancing the mechanical strength of the molded product.

    摘要翻译： 用于形成基于柔性基底的包装的成型装置包括多个盆。 两个柔性基板安装在锅的两侧。 安装在基板的上表面上的多组芯片，其中每组芯片是阵列布置。 成型装置还包括多个流道。 每个流道独立地从罐的一侧延伸到基板的一侧，并且通过浇口连接到设置在基板上的模具的上部的空腔。 本发明的特征在于，所述成型装置设置有与所述基板的一侧对应地形成的第一连通流路和与所述基板的另一侧对应地形成的第二连通流路。 第一和第二通信通道将空腔的两个相对侧互连。 因此，从模具中取出的模制产品具有第一和第二连接杆，其在每个单元封装主体的两个相对侧形成互连，从而整合所有单元封装主体，从而增强模制产品的机械强度。

    Cooling system for an electronic rack
    37.
    发明授权
    Cooling system for an electronic rack 有权
    电子机架的冷却系统

    公开(公告)号：US08879268B2

    公开(公告)日：2014-11-04

    申请号：US13371497

    申请日：2012-02-13

    申请人： Shih-Chang Lee ,  Chi-Hao Jin ,  Ming-Lee Chu ,  Chih-Hsun Lin

    发明人： Shih-Chang Lee ,  Chi-Hao Jin ,  Ming-Lee Chu ,  Chih-Hsun Lin

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20709 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/20445 ,  H05K7/20545

    摘要： The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.

    摘要翻译： 本发明公开了一种电子机架的冷却系统，包括：电子机架，包括至少一个侧壁; 至少一个电子底盘，其包括顶壁和至少一个侧壁并且设置在所述电子机架内部，用于容纳包括多个电子部件和布置在所述多个电子部件上方的至少一个固定热接口的至少一个模块化电子设备; 布置在所述至少一个电子底盘的顶壁和所述至少一个模块化电子设备之间的第一可拆卸热接口; 以及布置在所述电子机架的所述至少一个侧壁与所述至少一个电子底盘的所述至少一个侧壁之间的至少一个第二可拆卸热接口。

    COOLING SYSTEM FOR AN ELECTRONIC RACK
    39.
    发明申请
    COOLING SYSTEM FOR AN ELECTRONIC RACK 有权
    电子机架冷却系统

    公开(公告)号：US20120250259A1

    公开(公告)日：2012-10-04

    申请号：US13371497

    申请日：2012-02-13

    申请人： Shih-Chang Lee ,  Chi-Hao Jin ,  Ming-Lee Chu ,  Chih-Hsun Lin

    发明人： Shih-Chang Lee ,  Chi-Hao Jin ,  Ming-Lee Chu ,  Chih-Hsun Lin

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20709 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/20445 ,  H05K7/20545

    摘要： The present creation discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.

    摘要翻译： 本发明公开了一种用于电子机架的冷却系统，包括：包括至少一个侧壁的电子机架; 至少一个电子底盘，其包括顶壁和至少一个侧壁并且设置在所述电子机架内部，用于容纳包括多个电子部件和布置在所述多个电子部件上方的至少一个固定热接口的至少一个模块化电子设备; 布置在所述至少一个电子底盘的顶壁和所述至少一个模块化电子设备之间的第一可拆卸热接口; 以及布置在所述电子机架的所述至少一个侧壁与所述至少一个电子底盘的所述至少一个侧壁之间的至少一个第二可拆卸热接口。

    HIGH EFFICIENCY SOLAR CELL
    40.
    发明申请
    HIGH EFFICIENCY SOLAR CELL 审中-公开
    高效太阳能电池

    公开(公告)号：US20110114164A1

    公开(公告)日：2011-05-19

    申请号：US12948279

    申请日：2010-11-17

    申请人： Yi-Chieh Lin ,  Shih-Chang Lee

    发明人： Yi-Chieh Lin ,  Shih-Chang Lee

    IPC分类号： H01L31/06

    CPC分类号： H01L31/0735 ,  Y02E10/544

    摘要： Disclosed is a solar cell including a first base layer, a second base layer on the first base layer, and an emitter layer on the second base layer. Furthermore, a window layer may be disposed on the emitter, and/or a back surface field (BSF) layer may be disposed under the first base layer.

    摘要翻译： 公开了一种太阳能电池，其包括第一基底层，第一基底层上的第二基底层和第二基底层上的发射极层。 此外，窗口层可以设置在发射器上，和/或背面场（BSF）层可以设置在第一基底层下方。