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公开(公告)号：US10583641B2
公开(公告)日：2020-03-10
申请号：US15804319
申请日：2017-11-06
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Masakatsu Ohno , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo , Hisao Ikeda , Kohei Yokoyama , Hiroki Adachi , Satoru Idojiri
Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.
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公开(公告)号：US10367014B2
公开(公告)日：2019-07-30
申请号：US14922658
申请日：2015-10-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Yoshiharu Hirakata , Takashi Hamada , Kohei Yokoyama , Yasuhiro Jinbo , Tetsuji Ishitani , Daisuke Kubota
IPC: G02F1/1333 , H01L27/12 , H01L51/52 , G02F1/1368 , G02F1/1362 , G02F1/1335 , G02F1/1339 , H01L29/786 , H01L27/32 , H01L51/00
Abstract: A display device in which a peripheral circuit portion has high operation stability is provided. The display device includes a first substrate and a second substrate. A first insulating layer is provided over a first surface of the first substrate. A second insulating layer is provided over a first surface of the second substrate. The first surface of the first substrate and the first surface of the second substrate face each other. An adhesive layer is provided between the first insulating layer and the second insulating layer. A protective film in contact with the first substrate, the first insulating layer, the adhesive layer, the second insulating layer, and the second substrate is formed in the vicinity of a peripheral portion of the first substrate and the second substrate.
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公开(公告)号：US10155368B2
公开(公告)日：2018-12-18
申请号：US14270676
申请日：2014-05-06
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yoshiharu Hirakata , Akihiro Chida , Kohei Yokoyama
Abstract: A method and an apparatus for manufacturing an object which involve a separation technique are provided. A first substrate provided with an object is attached to a second substrate and is then suction-fixed by using a suction chuck (also referred to as a suction stage or a vacuum chuck) including portions with different suction capabilities or by using its functional equivalent, and the second substrate is separated from the first substrate. Accordingly, the object is separated from the first substrate and transferred to the second substrate. An apparatus for achieving this is also provided. A substrate fixture surface of the suction chuck or its functional equivalent includes a plurality of portions provided with suction micro-holes and a portion provided with no holes. Owing to the plurality of portions provided with suction micro-holes, a plurality of objects can be transferred from the first substrate to the second substrate.
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公开(公告)号：US09925749B2
公开(公告)日：2018-03-27
申请号：US14468818
申请日：2014-08-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Masakatsu Ohno , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo , Hisao Ikeda , Kohei Yokoyama , Hiroki Adachi , Satoru Idojiri
CPC classification number: B32B37/0046 , B32B17/10431 , B32B27/08 , B32B27/20 , B32B27/36 , B32B37/0015 , B32B37/003 , B32B37/1284 , B32B38/0008 , B32B38/18 , B32B38/1841 , B32B38/1858 , B32B2264/102 , B32B2264/105 , B32B2309/68 , B32B2457/14 , B32B2457/20 , H01L2224/01 , Y10T156/15 , Y10T156/1798
Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.
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35.发明授权公开(公告)号：US09728737B2
公开(公告)日：2017-08-08
申请号：US14297004
申请日：2014-06-05
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Hisao Ikeda , Kohei Yokoyama , Satoshi Seo
CPC classification number: H01L51/5203 , H01L51/5212 , H01L51/5228 , H01L2251/5361 , H05B33/22 , H05B33/26
Abstract: The manufacturing method of the light-emitting device is provided in which an auxiliary electrode in contact with an electrode formed using a transparent conductive film of a light-emitting element is formed using a mask, and direct contact between the auxiliary electrode and an EL layer is prevented by oxidizing the auxiliary electrode. Further, the light-emitting device manufactured according to the method and the lighting device including the light-emitting device are provided.
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Patent Agency Ranking
公开(公告)号：US09455418B2
公开(公告)日：2016-09-27
申请号：US14468808
申请日：2014-08-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Masakatsu Ohno , Kohei Yokoyama , Satoru Idojiri , Hisao Ikeda , Yasuhiro Jinbo , Hiroki Adachi , Yoshiharu Hirakata , Shingo Eguchi
CPC classification number: B65G49/068 , B32B17/06 , B32B37/025 , B32B38/10 , B32B43/006 , B32B2457/00 , B32B2457/14 , B32B2457/20 , B65G49/069 , B65G2249/04 , B65H3/0816 , B65H3/48 , B65H16/00 , B65H35/0006 , H01L21/673 , H01L21/67333 , H01L21/67715 , H01L21/68 , H01L27/3244 , H01L51/5237 , H01L51/56 , H01L2221/68318 , H01L2227/323 , Y10T29/53091 , Y10T29/5317 , Y10T156/1121 , Y10T156/1137 , Y10T156/1158 , Y10T156/1184 , Y10T156/1917 , Y10T156/1922 , Y10T156/1939 , Y10T156/1967
Abstract: An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.
Abstract translation: 提供了一种用于提供具有干净表面的支撑件的装置。 或者，提供一种用于制造包括支撑体的堆叠的装置和其一个表面层被分离的被处理构件的剩余部分。 包括定位部分，狭缝形成部分和剥离部分。 定位部设置有包括支撑体和隔板的层叠膜的第一传送机构和用于固定层叠膜的台。 狭缝形成部设置有能够形成不通过隔板的狭缝的切割器。 剥离部设置有第二传送机构和剥离机构，其使隔板延伸，然后剥离隔膜。 此外，包括激活支撑表面的预处理部分。
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公开(公告)号：US11881489B2
公开(公告)日：2024-01-23
申请号：US17991893
申请日：2022-11-22
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Hisao Ikeda , Kouhei Toyotaka , Hideaki Shishido , Hiroyuki Miyake , Kohei Yokoyama , Yasuhiro Jinbo , Yoshitaka Dozen , Takaaki Nagata , Shinichi Hirasa
IPC: H01L27/02 , H10K59/35 , G09G3/20 , G09G3/3233 , H01L27/12 , H01L29/786 , H10K59/131 , G09G3/36 , G09G5/391
CPC classification number: H01L27/124 , G09G3/2003 , G09G3/3233 , H01L27/1225 , H01L27/1266 , H01L29/78648 , H10K59/131 , H10K59/352 , H10K59/353 , G09G3/3648 , G09G5/391 , G09G2300/0426 , G09G2300/0443 , G09G2300/0452 , G09G2300/0465 , G09G2300/0809 , G09G2300/0842 , G09G2320/0295 , G09G2320/043 , G09G2320/0693
Abstract: Provided is a display device with extremely high resolution, a display device with higher display quality, a display device with improved viewing angle characteristics, or a flexible display device. Same-color subpixels are arranged in a zigzag pattern in a predetermined direction. In other words, when attention is paid to a subpixel, another two subpixels exhibiting the same color as the subpixel are preferably located upper right and lower right or upper left and lower left. Each pixel includes three subpixels arranged in an L shape. In addition, two pixels are combined so that pixel units including subpixel are arranged in matrix of 3×2.
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公开(公告)号：US11824068B2
公开(公告)日：2023-11-21
申请号：US17246788
申请日：2021-05-03
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shunpei Yamazaki , Yoshiharu Hirakata , Takashi Hamada , Kohei Yokoyama , Yasuhiro Jinbo , Tetsuji Ishitani , Daisuke Kubota
IPC: H01L27/12 , G02F1/1368 , G02F1/1362 , G02F1/1333 , G02F1/1335 , G02F1/1339 , H01L29/786 , H10K50/842 , H10K50/844 , H10K59/38 , H10K59/40 , H10K71/50 , H10K102/00
CPC classification number: H01L27/1262 , G02F1/1339 , G02F1/1368 , G02F1/133345 , G02F1/133512 , G02F1/136213 , H01L27/1218 , H01L27/1225 , H01L27/1255 , H01L29/78648 , H10K50/8426 , H10K50/8428 , H10K50/844 , H10K59/38 , H10K59/40 , H10K71/50 , H10K2102/00
Abstract: A display device in which a peripheral circuit portion has high operation stability is provided. The display device includes a first substrate and a second substrate. A first insulating layer is provided over a first surface of the first substrate. A second insulating layer is provided over a first surface of the second substrate. The first surface of the first substrate and the first surface of the second substrate face each other. An adhesive layer is provided between the first insulating layer and the second insulating layer. A protective film in contact with the first substrate, the first insulating layer, the adhesive layer, the second insulating layer, and the second substrate is formed in the vicinity of a peripheral portion of the first substrate and the second substrate.
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公开(公告)号：US10522574B2
公开(公告)日：2019-12-31
申请号：US15591156
申请日：2017-05-10
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida , Tatsuya Sakuishi , Daiki Nakamura , Tomoya Aoyama , Kohei Yokoyama , Daisuke Kubota
IPC: H01L27/12 , H01L27/32 , H01L51/00 , H01L29/786
Abstract: A method for manufacturing a display device is provided. The method includes a step of forming a first layer over a first substrate, a terminal electrode over the first layer, a display element over the first layer, and a peeling layer overlapping with the terminal electrode, a step of forming a second layer over a second substrate, a step of attaching the first substrate to the second substrate with a bonding layer therebetween, a step of separating the first substrate from the first layer, a step of attaching a third substrate to the first layer, a step of separating the second substrate from the second layer together with part of the bonding layer, and a step of attaching a fourth substrate to the second layer. At least one of the first layer and the second layer includes an organic film.
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公开(公告)号：US10343191B2
公开(公告)日：2019-07-09
申请号：US15302260
申请日：2015-04-13
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Masakatsu Ohno , Kayo Kumakura , Satoru Idojiri , Yoshiharu Hirakata , Kohei Yokoyama
IPC: B08B1/00 , H01L21/304 , H01L21/02 , H01L27/12 , B25J11/00 , B32B37/00 , B32B38/18 , H01L21/67 , H01L21/78 , B25J15/02 , B08B11/00
Abstract: An object is to eliminate a harmful effect when a film is bonded by wiping an adhering sealant (30a). Characterized is a wiping device (200) including a stage (230) that supports a sheet-like member (220), a wiping means (210) that wipes an adhering object (30a) adhering on a peripheral portion of the sheet-like member (220), a wiping cloth (241) that is attachably and detachably provided for the wiping means (210), and a solvent (261) that adheres to the wiping cloth (241), in which the wiping means (210) is provided with the wiping cloth (241), makes the solvent (261) adhere to the wiping cloth (241), and wipes the adhering object (30a), or a stack manufacturing apparatus (1000) including such a wiping device (200).
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