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31.发明申请公开(公告)号：US20180148321A1
公开(公告)日：2018-05-31
申请号：US15880332
申请日：2018-01-25
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Sebastiano CONTI
CPC classification number: B81B7/0054 , B81B3/0051 , B81B7/0048 , B81B7/008 , B81B2201/0264 , B81C1/00325 , H01L2224/48091 , H01L2924/00014
Abstract: A MEMS device is provided with: a supporting base, having a bottom surface in contact with an external environment; a sensor die, which is of semiconductor material and integrates a micromechanical detection structure; a sensor frame, which is arranged around the sensor die and is mechanically coupled to a top surface of the supporting base; and a cap, which is arranged above the sensor die and is mechanically coupled to a top surface of the sensor frame, a top surface of the cap being in contact with an external environment. The sensor die is mechanically decoupled from the sensor frame.
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32.发明申请公开(公告)号：US20180148316A1
公开(公告)日：2018-05-31
申请号：US15884624
申请日：2018-01-31
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Bruno MURARI , Sebastiano CONTI
CPC classification number: B81B3/0021 , B81B3/0094 , B81B7/0041 , B81B2201/0264
Abstract: A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.
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公开(公告)号：US20180118558A1
公开(公告)日：2018-05-03
申请号：US15636380
申请日：2017-06-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Mikel AZPEITIA URQUIA , Lorenzo BALDO
CPC classification number: B81B3/0021 , B81B7/0077 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2207/012 , B81C1/00158 , B81C1/00269 , H04R19/005 , H04R19/04
Abstract: Method of manufacturing a transducer module, comprising the steps of: forming, on a substrate, a first MEMS transducer, in particular a gyroscope, and a second MEMS transducer, in particular an accelerometer, having a suspended membrane; forming, on the substrate, a conductive layer and defining the conductive layer in order to provide, simultaneously, at least one conductive strip electrically coupled to the first MEMS transducer and the membrane of the second MEMS transducer.
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34.发明公开公开(公告)号：US20230348258A1
公开(公告)日：2023-11-02
申请号：US18302610
申请日：2023-04-18
Applicant: STMicroelectronics S.r.l.
Inventor： Mikel AZPEITIA URQUIA , Enri DUQI , Silvia NICOLI , Roberto CAMPEDELLI , Igor VARISCO , Lorenzo TENTORI
CPC classification number: B81B3/001 , B81C1/00158 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/033 , B81B2203/0361 , B81B2207/11 , B81C2201/014 , B81C2201/0156 , B81C2201/0177 , B81C2201/0169
Abstract: MEMS structure, comprising: a semiconductor body; a cavity buried in the semiconductor body; a membrane suspended on the cavity; and at least one antistiction bump completely contained in the cavity with the function of preventing the side of the membrane internal to the cavity from sticking to the opposite side, which delimits the cavity downwardly.
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公开(公告)号：US20230064114A1
公开(公告)日：2023-03-02
申请号：US17821717
申请日：2022-08-23
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Paolo FERRARI , Flavio Francesco VILLA , Roberto CAMPEDELLI , Luca LAMAGNA , Enri DUQI , Mikel AZPEITIA URQUIA , Silvia NICOLI , Maria Carolina TURI
Abstract: The present disclosure is directed to a method for manufacturing a micro-electro-mechanical device. The method includes the steps of forming, on a substrate, a first protection layer of crystallized aluminum oxide, impermeable to HF; forming, on the first protection layer, a sacrificial layer of silicon oxide removable with HF; forming, on the sacrificial layer, a second protection layer of crystallized aluminum oxide; exposing a sacrificial portion of the sacrificial layer; forming, on the sacrificial portion, a first membrane layer of a porous material, permeable to HF; forming a cavity by removing the sacrificial portion through the first membrane layer; and sealing pores of the first membrane layer by forming a second membrane layer on the first membrane layer.
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Patent Agency Ranking
公开(公告)号：US20220373785A1
公开(公告)日：2022-11-24
申请号：US17745186
申请日：2022-05-16
Applicant: STMicroelectronics S.r.l.
Inventor： Nicolo' BONI , Gianluca MENDICINO , Enri DUQI , Roberto CARMINATI , Massimiliano MERLI
Abstract: A microelectromechanical mirror device has, in a die of semiconductor material: a fixed structure defining a cavity; a tiltable structure carrying a reflecting region elastically suspended above the cavity; at least a first pair of driving arms coupled to the tiltable structure and carrying respective piezoelectric material regions which may be biased to cause a rotation thereof around at least one rotation axis; elastic suspension elements coupling the tiltable structure elastically to the fixed structure and which are stiff with respect to movements out of the horizontal plane and yielding with respect to torsion; and a piezoresistive sensor configured to provide a detection signal indicative of the rotation of the tiltable structure. At least one test structure is integrated in the die to provide a calibration signal indicative of a sensitivity variation of the piezoresistive sensor in order to calibrate the detection signal.
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公开(公告)号：US20220301789A1
公开(公告)日：2022-09-22
申请号：US17690869
申请日：2022-03-09
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Enri DUQI , Gabriele GATTERE , Carlo VALZASINA
IPC: H01H13/14 , G01L1/16 , H01H13/06 , H01L41/113 , B81B3/00
Abstract: Button device comprising: a fixed support structure; a movable structure, laterally surrounded by said support structure and configured to deform at least in part under the action of an external force; and a fluid-tight protection cap. The movable structure includes a piston element, deformable elements having piezoelectric transducers arranged thereon, and anchor elements that couple the piston element to the deformable elements. When an external force acts on the piston element, the anchor elements transfer this force to the deformable elements and to the piezoelectric transducers, so as to sense the extent of this force.
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38.发明申请公开(公告)号：US20220011567A1
公开(公告)日：2022-01-13
申请号：US17369145
申请日：2021-07-07
Applicant: STMicroelectronics S.r.l.
Inventor： Roberto CARMINATI , Nicolo' BONI , Massimiliano MERLI , Enri DUQI
Abstract: A MEMS micromirror device is formed in a package including a containment body and a lid transparent to a light radiation. The package forms a cavity housing a tiltable platform having a reflecting surface. A metastructure is formed on the lid and/or on the reflecting surface and includes a plurality of diffractive optical elements.
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39.发明申请公开(公告)号：US20210229984A1
公开(公告)日：2021-07-29
申请号：US17155429
申请日：2021-01-22
Applicant: STMicroelectronics S.r.l.
Inventor： Enri DUQI , Nicolo' BONI , Lorenzo BALDO , Massimiliano MERLI , Roberto CARMINATI
Abstract: To manufacture an oscillating structure, a wafer is processed by: forming torsional elastic elements; forming a mobile element connected to the torsional elastic elements; processing the first side of the wafer to form a mechanical reinforcement structure; and processing the second side of said wafer by steps of chemical etching, deposition of metal material, and/or deposition of piezoelectric material. Processing of the first side of the wafer is carried out prior to processing of the second side of the wafer so as not to damage possible sensitive structures formed on the first side of the wafer.
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40.发明申请公开(公告)号：US20200326530A1
公开(公告)日：2020-10-15
申请号：US16847514
申请日：2020-04-13
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Dario PACI , Lorenzo BALDO , Domenico GIUSTI
IPC: G02B26/08 , B81B3/00 , H01L27/146
Abstract: A MEMS optical device including: a semiconductor body; a main cavity, which extends within the semiconductor body; a membrane suspended over the main cavity; a piezoelectric actuator, which is mechanically coupled to the membrane and can be electronically controlled so as to deform the membrane; a micro-lens, mechanically coupled to the membrane so as to undergo deformation following the deformation of the membrane; and a rigid optical element, which contacts the micro-lens and is arranged so that the micro-lens is interposed between the rigid optical element and the membrane. The micro-lens and the main cavity are arranged on opposite sides of the membrane.
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