公开(公告)号：US10794783B2

公开(公告)日：2020-10-06

申请号：US15914832

申请日：2018-03-07

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Federico Giovanni Ziglioli ,  Bruno Murari

IPC: G01L5/00 ,  G01L1/18 ,  G01L1/20 ,  F16B31/02

Abstract: A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.

公开(公告)号：US10457545B2

公开(公告)日：2019-10-29

申请号：US16361739

申请日：2019-03-22

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01C19/5776 ,  B81B3/00

Abstract: A magnetic energy harvesting and scavenging circuit includes a first substrate having first and second surfaces and at least one energy harvesting and scavenging coil formed adjacent the first surface. An electromechanical systems device includes a moveable mass extending over the first surface and is displaced relative to the first substrate in three dimensions responsive to an external force applied to the moveable mass. The movable mass includes a magnet support layer and a number of permanent magnet segments attached to the magnet support layer. The permanent magnet segments are magnetically coupled to the at least one energy harvesting and scavenging coil. Energy harvesting and scavenging circuitry is electrically coupled to the at least one energy harvesting and scavenging coil and generates electrical energy due to magnetic flux variation through the at least one energy harvesting and scavenging coil responsive to movement of the moveable mass.

公开(公告)号：US10366969B2

公开(公告)日：2019-07-30

申请号：US15783710

申请日：2017-10-13

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Giovanni Girlando

IPC: H01L25/065 ,  H01L29/82 ,  H01L23/48 ,  H01L23/522 ,  H01L23/64 ,  H01L23/66 ,  H01L23/00 ,  H01L25/10 ,  H01Q1/22 ,  H01Q1/36 ,  H01Q7/00 ,  H01L49/02 ,  H01Q1/38 ,  H01L25/16 ,  G01R1/073 ,  G01R31/302

Abstract: An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.

公开(公告)号：US10288682B2

公开(公告)日：2019-05-14

申请号：US15813000

申请日：2017-11-14

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani

IPC: G01R31/317 ,  G01R31/3177 ,  G01R31/3185

Abstract: An electronic device having a functional portion and a test portion. The test portion includes a boundary scan register formed by a plurality of test cells arranged in the body according to a register sequence, where first test cells are configured to form a serial-to-parallel converter and second test cells are configured to form a parallel-to-serial converter. The test cells are each coupled to a respective data access pin of the device and to a respective input/output point of the functional part and have a first test input and a test output. The boundary scan register defines two test half-paths formed, respectively, by the first test cells and by the second test cells. The first test cells are directly coupled according to a first sub-sequence, and the second test cells are directly coupled according to a second sub-sequence.

公开(公告)号：US20180342574A1

公开(公告)日：2018-11-29

申请号：US16052777

申请日：2018-08-02

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Alessandro Finocchiaro

IPC: H01L49/02 ,  H01L23/00 ,  G01R31/28 ,  H01L23/66 ,  H01L23/58 ,  H01L23/528 ,  H01L29/06 ,  H01L23/544 ,  H01L25/065 ,  G01R31/302 ,  H01L21/66

CPC classification number: H01L28/10 ,  G01R31/2834 ,  G01R31/2889 ,  G01R31/3025 ,  H01L22/32 ,  H01L22/34 ,  H01L23/528 ,  H01L23/544 ,  H01L23/564 ,  H01L23/585 ,  H01L23/66 ,  H01L24/05 ,  H01L25/0657 ,  H01L29/0642 ,  H01L2223/6677 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A probe card for integrated circuit testing includes a printed circuit support and a probe head having a first surface mounted to a surface of the printed circuit support. A flexible substrate is positioned adjacent to a second surface of the probe head and includes at least one flexible extension which extends beyond an edge of the probe head and includes a bend to make contact with the surface of the printed circuit support. The flexible substrate further includes a test antenna configured to support a wireless communications channel with an integrated circuit under test. The integrated circuit under test includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations to form an integrated antenna that is coupled for communication and/or power transfer to the test antenna.

公开(公告)号：US09939338B2

公开(公告)日：2018-04-10

申请号：US14626153

申请日：2015-02-19

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto Pagani ,  Federico Giovanni Ziglioli ,  Bruno Murari

IPC: G01L1/20 ,  G01L5/00 ,  G01L1/18 ,  F16B31/02

CPC classification number: G01L5/0038 ,  F16B31/028 ,  G01L1/18 ,  G01L1/20

Abstract: A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.

公开(公告)号：US20180067009A1

公开(公告)日：2018-03-08

申请号：US15797773

申请日：2017-10-30

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01L25/00 ,  G01L1/26 ,  G01L1/16 ,  G01L1/22

Abstract: A pressure sensor is for positioning within a structure. The pressure sensor may include a pressure sensor integrated circuit (IC) having a pressure sensor circuit responsive to bending, and a transceiver circuit coupled to the pressure sensor circuit. The pressure sensor may include a support body having a recess therein coupled to the pressure sensor IC so that the pressure sensor IC bends into the recess when the pressure sensor IC is subjected to external pressure.

公开(公告)号：US20180045775A1

公开(公告)日：2018-02-15

申请号：US15782962

申请日：2017-10-13

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01R31/28 ,  G01R31/302 ,  G01R31/303

CPC classification number: G01R31/2851 ,  G01R31/2886 ,  G01R31/3025 ,  G01R31/303 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit is fabricated on a semiconductor material die and adapted to be at least partly tested wirelessly. Circuitry for setting a selected radio communication frequency to be used for the wireless test of the integrated circuit is integrated on the semiconductor material die.

公开(公告)号：US20180040591A1

公开(公告)日：2018-02-08

申请号：US15783710

申请日：2017-10-13

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Giovanni Girlando

IPC: H01L25/065 ,  H01L29/82 ,  H01L23/48 ,  H01L23/522 ,  H01L23/64 ,  H01L23/66 ,  H01Q1/36 ,  H01L23/00 ,  H01Q1/38 ,  H01L25/10 ,  H01Q7/00 ,  H01L49/02 ,  H01Q1/22 ,  G01R1/073 ,  H01L25/16 ,  G01R31/302

CPC classification number: H01L25/0657 ,  G01R1/07314 ,  G01R31/3025 ,  H01L23/48 ,  H01L23/481 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L28/10 ,  H01L29/82 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29199 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/207 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q7/00 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05552

Abstract: An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.

公开(公告)号：US09799630B2

公开(公告)日：2017-10-24

申请号：US15376485

申请日：2016-12-12

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Giovanni Girlando

IPC: H01L25/065 ,  H01L23/66 ,  H01L23/48 ,  H01L23/522 ,  H01Q1/38 ,  H01L23/00 ,  H01Q1/22 ,  H01Q1/36 ,  H01L23/64 ,  H01L49/02

CPC classification number: H01L25/0657 ,  G01R1/07314 ,  G01R31/3025 ,  H01L23/48 ,  H01L23/481 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L28/10 ,  H01L29/82 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29199 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/207 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q7/00 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05552

Abstract: An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.