Organic light-emitting diode display device and method of fabricating the same

    公开(公告)号:US10811478B2

    公开(公告)日:2020-10-20

    申请号:US16374706

    申请日:2019-04-03

    Abstract: An organic light-emitting diode display device includes a pixel electrode, a pixel-defining layer, an organic emission layer, and a counter electrode. The pixel-defining layer includes an opening partially exposing the pixel electrode. The organic emission layer is disposed on the pixel electrode. The organic emission layer is disposed in the opening. The counter electrode is disposed on the organic emission layer. The counter electrode opposes the pixel electrode. The pixel-defining layer includes a first pixel-defining layer and a second pixel-defining layer. The first pixel-defining layer is disposed on the pixel electrode and includes an inorganic material. The second pixel-defining layer is disposed on the first pixel-defining layer and includes an organic material. A sidewall of the first pixel-defining layer that is closest to the opening is aligned with a sidewall of the second pixel-defining layer that is closest to the opening.

    Display device, manufacturing method thereof, and electrode forming method

    公开(公告)号:US10748943B2

    公开(公告)日:2020-08-18

    申请号:US16124356

    申请日:2018-09-07

    Abstract: A display device includes: a substrate; first and second transistors provided on the substrate to be spaced apart from each other, the first and second transistors being electrically connected to each other; and a display unit electrically connected to the first transistor, wherein the first transistor includes a first semiconductor layer including crystalline silicon, a first gate electrode, a first source electrode, and a first drain electrode, wherein the second transistor includes a second semiconductor layer including an oxide semiconductor, a second gate electrode, a second source electrode, and a second drain electrode, wherein each of the second source electrode and the second drain electrode includes a first layer that includes molybdenum and is provided on the second semiconductor layer, a second layer that includes aluminum and is provided on the first layer, and a third layer that includes titanium and is provided on the second layer.

    Transistor array panel and manufacturing method thereof

    公开(公告)号:US10741589B2

    公开(公告)日:2020-08-11

    申请号:US16215520

    申请日:2018-12-10

    Abstract: A transistor array panel is manufactured by a method that reduces or obviates the need for highly selective etching agents or complex processes requiring multiple photomasks to create contact holes. The panel includes: a substrate; a buffer layer positioned on the substrate; a semiconductor layer positioned on the buffer layer; an intermediate insulating layer positioned on the semiconductor layer; and an upper conductive layer positioned on the intermediate insulating layer, wherein the semiconductor layer includes a first contact hole, the intermediate insulating layer includes a second contact hole positioned in an overlapping relationship with the first contact hole, and the upper conductive layer is in contact with a side surface of the semiconductor layer in the first contact hole.

    Thin film transistor array panel and method of manufacturing the same
    36.
    发明授权
    Thin film transistor array panel and method of manufacturing the same 有权
    薄膜晶体管阵列面板及其制造方法

    公开(公告)号:US09153603B2

    公开(公告)日:2015-10-06

    申请号:US14105048

    申请日:2013-12-12

    Abstract: A thin film transistor array panel includes a substrate; a gate line located over the substrate and including a gate pad portion; a data line located over the gate line and including a source electrode and a data pad portion; a drain electrode; a first passivation layer located over the data line and the drain electrode; an organic insulating layer located over the first passivation layer and having a contact hole; a first field generating electrode located over the organic insulating layer and having an opening; a second passivation layer located over the first field generating electrode; and a second field generating electrode located over the second passivation layer. The contact hole coincides with or is smaller than the opening, and the contact hole has a tapered structure.

    Abstract translation: 薄膜晶体管阵列面板包括基板; 栅极线,位于衬底上并包括栅极焊盘部分; 位于栅极线上方并包括源电极和数据焊盘部分的数据线; 漏电极; 位于数据线和漏电极之上的第一钝化层; 位于所述第一钝化层上并具有接触孔的有机绝缘层; 位于所述有机绝缘层上方并具有开口的第一场产生电极; 位于第一场产生电极之上的第二钝化层; 以及位于第二钝化层上方的第二场产生电极。 接触孔与开口重合或小于开口,接触孔具有锥形结构。

    Thin film transistor array panel
    37.
    发明授权
    Thin film transistor array panel 有权
    薄膜晶体管阵列面板

    公开(公告)号:US08853703B2

    公开(公告)日:2014-10-07

    申请号:US13830269

    申请日:2013-03-14

    Abstract: A thin film transistor array panel includes a substrate, gate lines, each including a gate pad, a gate insulating layer, data lines, each including a data pad connected to a source and drain electrode, a first passivation layer disposed on the data lines and the drain electrode, a first electric field generating electrode, a second passivation layer disposed on the first electric field generating electrode, and a second electric field generating electrode. The gate insulating layer and the first and second passivation layers include a first contact hole exposing a part of the gate pad, the first and second passivation layers include a second contact hole exposing a part of the data pad, and at least one of the first and second contact holes have a positive taper structure having a wider area at an upper side than at a lower side.

    Abstract translation: 薄膜晶体管阵列面板包括基板,栅极线,每个栅极线包括栅极焊盘,栅极绝缘层,数据线,每条数据线包括连接到源极和漏极的数据焊盘,设置在数据线上的第一钝化层和 漏电极,第一电场产生电极,设置在第一电场产生电极上的第二钝化层和第二电场产生电极。 栅极绝缘层和第一和第二钝化层包括暴露栅极焊盘的一部分的第一接触孔,第一和第二钝化层包括暴露数据焊盘的一部分的第二接触孔,以及第一和第二钝化层中的至少一个 并且第二接触孔具有在上侧具有比在下侧更宽的面积的正锥形结构。

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