公开(公告)号：US09068935B2

公开(公告)日：2015-06-30

申请号：US12756628

申请日：2010-04-08

申请人： Donald Dorman ,  Tak Ning ,  Sufi Zafar

发明人： Donald Dorman ,  Tak Ning ,  Sufi Zafar

IPC分类号： G01N27/26 ,  G01N33/487 ,  G01N27/414 ,  G01N27/333 ,  G01N27/327

CPC分类号： G01N27/4145 ,  G01N27/3271 ,  G01N27/3335 ,  G01N27/414

摘要： A sensor for biomolecules or charged ions includes a substrate; a first node, a second node, and a third node located in the substrate; a gate dielectric located over the substrate, the first node, the second node, and the third node; a first field effect transistor (FET), the first FET comprising a control gate located on the gate dielectric, and the first node and the second node; and a second FET, the second FET comprising a sensing surface located on the gate dielectric, and the second node and the third node, wherein the sensing surface is configured to specifically bind the biomolecules or charged ions that are to be detected.

摘要翻译： 用于生物分子或带电离子的传感器包括基底; 第一节点，第二节点和位于所述衬底中的第三节点; 位于所述衬底，所述第一节点，所述第二节点和所述第三节点之上的栅极电介质; 第一场效应晶体管（FET），所述第一FET包括位于所述栅极电介质上的控制栅极，以及所述第一节点和所述第二节点; 以及第二FET，所述第二FET包括位于所述栅极电介质上的感测表面以及所述第二节点和所述第三节点，其中所述感测表面被配置为特异性地结合待检测的生物分子或带电离子。

公开(公告)号：US09059314B2

公开(公告)日：2015-06-16

申请号：US13602118

申请日：2012-09-01

申请人： Hemanth Jagannathan ,  Takashi Ando ,  Lisa F. Edge ,  Sufi Zafar ,  Changhwan Choi ,  Paul C. Jamison ,  Vamsi K. Paruchuri ,  Vijay Narayanan

发明人： Hemanth Jagannathan ,  Takashi Ando ,  Lisa F. Edge ,  Sufi Zafar ,  Changhwan Choi ,  Paul C. Jamison ,  Vamsi K. Paruchuri ,  Vijay Narayanan

IPC分类号： H01L21/00 ,  H01L21/8238 ,  H01L21/28 ,  H01L29/49 ,  H01L29/51

CPC分类号： H01L29/42364 ,  H01L21/225 ,  H01L21/28088 ,  H01L21/28176 ,  H01L21/28185 ,  H01L21/324 ,  H01L21/477 ,  H01L21/823462 ,  H01L21/823835 ,  H01L21/823842 ,  H01L21/823857 ,  H01L29/1054 ,  H01L29/401 ,  H01L29/4958 ,  H01L29/4966 ,  H01L29/51 ,  H01L29/513 ,  H01L29/517

摘要： Equivalent oxide thickness (EOT) scaled high k/metal gate stacks are provided in which the capacitance bottleneck of the interfacial layer is substantially eliminated, with minimal compromise on the mobility of carriers in the channel of the device. In one embodiment, the aforementioned EOT scaled high k/metal gate stacks are achieved by increasing the dielectric constant of the interfacial layer to a value that is greater than the originally formed interfacial layer, i.e., the interfacial layer prior to diffusion of a high k material dopant element therein. In another embodiment, the aforementioned scaled high k/metal gate stacks are achieved by eliminating the interfacial layer from the structure. In yet another embodiment, the aforementioned high k/metal gate stacks are achieved by both increasing the dielectric constant of the interfacial layer and reducing/eliminating the interfacial layer.

摘要翻译： 提供了相当于氧化物厚度（EOT）的高k /金属栅极叠层，其中基本上消除了界面层的电容瓶颈，对器件沟道中载流子的迁移率的影响最小。 在一个实施例中，通过将界面层的介电常数提高到大于原始形成的界面层的值，即高k扩散之前的界面层，可实现上述EOT缩放的高k /金属栅极堆叠 材料掺杂元素。 在另一个实施例中，通过从结构中消除界面层来实现上述缩放的高k /金属栅极堆叠。 在另一个实施方案中，上述高k /金属栅极堆叠是通过增加界面层的介电常数和减少/消除界面层来实现的。

公开(公告)号：US08940548B2

公开(公告)日：2015-01-27

申请号：US13552727

申请日：2012-07-19

申请人： Marwan H. Khater ,  Tak H. Ning ,  Lidija Sekaric ,  Sufi Zafar

发明人： Marwan H. Khater ,  Tak H. Ning ,  Lidija Sekaric ,  Sufi Zafar

IPC分类号： G01N33/552 ,  G01N33/543 ,  B82Y10/00 ,  H01L29/78

CPC分类号： G01N33/54373 ,  B82Y10/00 ,  G01N27/3276 ,  G01N27/4145 ,  G01N33/543 ,  H01L29/785 ,  Y10S977/721 ,  Y10S977/92 ,  Y10S977/953

摘要： A method for sensing biomolecules in an electrolyte includes exposing a gate dielectric surface of a sensor comprising a silicon fin to the electrolyte, wherein the gate dielectric surface comprises a dielectric material and antibodies configured to bind with the biomolecules; applying a gate voltage to an electrode immersed in the electrolyte; and measuring a change in a drain current flowing in the silicon fin; and determining an amount of the biomolecules that are present in the electrolyte based on the change in the drain current.

摘要翻译： 用于感测电解质中的生物分子的方法包括将包含硅翅片的传感器的栅极电介质表面暴露于电解质，其中所述栅极电介质表面包括电介质材料和被配置为与所述生物分子结合的抗体; 对浸在电解质中的电极施加栅极电压; 并测量在硅片中流动的漏极电流的变化; 以及基于漏极电流的变化确定存在于电解质中的生物分子的量。

公开(公告)号：US20140027871A1

公开(公告)日：2014-01-30

申请号：US13561671

申请日：2012-07-30

申请人： Jin Cai ,  Tak H. Ning ,  Jeng-Bang Yau ,  Sufi Zafar

发明人： Jin Cai ,  Tak H. Ning ,  Jeng-Bang Yau ,  Sufi Zafar

IPC分类号： H01L27/14

CPC分类号： G01T1/247 ,  G01N27/403 ,  G01T3/08 ,  H01L27/14 ,  H01L27/14681 ,  H01L31/022408 ,  H01L31/035272 ,  H01L31/1105 ,  H01L31/115 ,  H01L31/118

摘要： A sensor includes a collector, an emitter and a base-region barrier formed as an inverted bipolar junction transistor having a base substrate forming a base electrode to activate the inverted bipolar junction transistor. A level surface is formed by the collector, the emitter and the base-region barrier opposite the base substrate such that when the level surface is exposed to charge, the charge is measured during operation of the bipolar junction transistor.

摘要翻译： 传感器包括集电极，发射极和形成为反相双极结型晶体管的基极区势垒，其具有形成基极的基极以激活反相双极结型晶体管。 由集电极，发射极和基极区域与基底基板相对的方式形成电平表面，使得当电平表面暴露于电荷时，在双极结晶体管的操作期间测量电荷。

公开(公告)号：US20120298531A1

公开(公告)日：2012-11-29

申请号：US13571389

申请日：2012-08-10

申请人： Donald Dorman ,  Tak Ning ,  Sufi Zafar

发明人： Donald Dorman ,  Tak Ning ,  Sufi Zafar

IPC分类号： G01N27/414

CPC分类号： G01N27/4145 ,  G01N27/3271 ,  G01N27/3335 ,  G01N27/414

摘要： A method for operating a sensor for biomolecules or charged ions, the sensor comprising a first field effect transistor (FET) and a second FET, wherein the first FET and the second FET comprise a shared node includes placing an electrolyte containing the biomolecules or charged ions on a sensing surface of the sensor, the electrolyte comprising a gate of the second FET; applying an inversion voltage to a gate of the first FET; making a first electrical connection to an unshared node of the first FET; making a second electrical connection to unshared node of the second FET; determining a change in a drain current flowing between the unshared node of the first FET and the unshared node of the second FET; and determining an amount of biomolecules or charged ions contained in the electrolyte based on the determined change in the drain current.

摘要翻译： 一种用于操作用于生物分子或带电离子的传感器的方法，所述传感器包括第一场效应晶体管（FET）和第二FET，其中所述第一FET和所述第二FET包括共享节点，包括放置含有所述生物分子或带电离子的电解质 在所述传感器的感测表面上，所述电解质包括所述第二FET的栅极; 对第一FET的栅极施加反转电压; 与第一FET的非共享节点进行第一电连接; 与第二FET的非共享节点进行第二电连接; 确定在所述第一FET的非共享节点和所述第二FET的非共享节点之间流动的漏极电流的变化; 以及基于确定的漏极电流的变化来确定电解质中包含的生物分子或带电离子的量。

公开(公告)号：US08304836B2

公开(公告)日：2012-11-06

申请号：US12620234

申请日：2009-11-17

申请人： Hemanth Jagannathan ,  Takashi Ando ,  Lisa F. Edge ,  Sufi Zafar ,  Changhwan Choi ,  Paul C. Jamison ,  Vamsi K. Paruchuri ,  Vijay Narayanan

发明人： Hemanth Jagannathan ,  Takashi Ando ,  Lisa F. Edge ,  Sufi Zafar ,  Changhwan Choi ,  Paul C. Jamison ,  Vamsi K. Paruchuri ,  Vijay Narayanan

IPC分类号： H01L21/70

CPC分类号： H01L29/42364 ,  H01L21/225 ,  H01L21/28088 ,  H01L21/28176 ,  H01L21/28185 ,  H01L21/324 ,  H01L21/477 ,  H01L21/823462 ,  H01L21/823835 ,  H01L21/823842 ,  H01L21/823857 ,  H01L29/1054 ,  H01L29/401 ,  H01L29/4958 ,  H01L29/4966 ,  H01L29/51 ,  H01L29/513 ,  H01L29/517

摘要： Equivalent oxide thickness (EOT) scaled high k/metal gate stacks are provided in which the capacitance bottleneck of the interfacial layer is substantially eliminated, with minimal compromise on the mobility of carriers in the channel of the device. In one embodiment, the aforementioned EOT scaled high k/metal gate stacks are achieved by increasing the dielectric constant of the interfacial layer to a value that is greater than the originally formed interfacial layer, i.e., the interfacial layer prior to diffusion of a high k material dopant element therein. In another embodiment, the aforementioned scaled high k/metal gate stacks are achieved by eliminating the interfacial layer from the structure. In yet another embodiment, the aforementioned high k/metal gate stacks are achieved by both increasing the dielectric constant of the interfacial layer and reducing/eliminating the interfacial layer.

摘要翻译： 提供了相当于氧化物厚度（EOT）的高k /金属栅极叠层，其中基本上消除了界面层的电容瓶颈，对器件沟道中载流子的迁移率的影响最小。 在一个实施例中，通过将界面层的介电常数提高到大于原始形成的界面层的值，即高k扩散之前的界面层，可实现上述EOT缩放的高k /金属栅极堆叠 材料掺杂元素。 在另一个实施例中，通过从结构中消除界面层来实现上述缩放的高k /金属栅极堆叠。 在另一个实施方案中，上述高k /金属栅极堆叠是通过增加界面层的介电常数和减少/消除界面层来实现的。

公开(公告)号：US08288237B2

公开(公告)日：2012-10-16

申请号：US12541575

申请日：2009-08-14

申请人： Alessandro C. Callegari ,  Michael A. Gribelyuk ,  Dianne L. Lacey ,  Fenton R. Feeney ,  Katherine L. Saenger ,  Sufi Zafar

发明人： Alessandro C. Callegari ,  Michael A. Gribelyuk ,  Dianne L. Lacey ,  Fenton R. Feeney ,  Katherine L. Saenger ,  Sufi Zafar

IPC分类号： H01L21/336

CPC分类号： H01L29/4966 ,  C23C14/0036 ,  C23C14/0635 ,  H01L21/28088 ,  H01L29/513 ,  H01L29/517 ,  H01L29/665

摘要： A compound metal comprising TiC which is a p-type metal having a workfunction of about 4.75 to about 5.3, preferably about 5, eV that is thermally stable on a gate stack comprising a high k dielectric and an interfacial layer is provided as well as a method of fabricating the TiC compound metal. Furthermore, the TiC metal compound of the present invention is a very efficient oxygen diffusion barrier at 1000° C. allowing very aggressive equivalent oxide thickness (EOT) and inversion layer thickness scaling below 14 Å in a p-metal oxide semiconductor (pMOS) device.

摘要翻译： 提供了包含TiC的复合金属，其是在包括高k电介质和界面层的栅极堆叠上具有约4.75至约5.3，优选约5e的功函数的功函数的热电稳定的p型金属，以及 制造TiC复合金属的方法。 此外，本发明的TiC金属化合物在1000℃下是非常有效的氧扩散阻挡层，允许在p金属氧化物半导体（pMOS）器件中非常有侵蚀性的等效氧化物厚度（EOT）和反型层厚度缩小至低于Å 。

公开(公告)号：US20110115027A1

公开(公告)日：2011-05-19

申请号：US12620234

申请日：2009-11-17

申请人： Hemanth Jagannathan ,  Takashi Ando ,  Lisa F. Edge ,  Sufi Zafar ,  Changhwan Choi ,  Paul C. Jamison ,  Vamsi K. Paruchuri ,  Vijay Narayanan

发明人： Hemanth Jagannathan ,  Takashi Ando ,  Lisa F. Edge ,  Sufi Zafar ,  Changhwan Choi ,  Paul C. Jamison ,  Vamsi K. Paruchuri ,  Vijay Narayanan

IPC分类号： H01L27/092 ,  H01L29/78 ,  H01L21/8238 ,  H01L21/263

CPC分类号： H01L29/42364 ,  H01L21/225 ,  H01L21/28088 ,  H01L21/28176 ,  H01L21/28185 ,  H01L21/324 ,  H01L21/477 ,  H01L21/823462 ,  H01L21/823835 ,  H01L21/823842 ,  H01L21/823857 ,  H01L29/1054 ,  H01L29/401 ,  H01L29/4958 ,  H01L29/4966 ,  H01L29/51 ,  H01L29/513 ,  H01L29/517

摘要： Equivalent oxide thickness (EOT) scaled high k/metal gate stacks are provided in which the capacitance bottleneck of the interfacial layer is substantially eliminated, with minimal compromise on the mobility of carriers in the channel of the device. In one embodiment, the aforementioned EOT scaled high k/metal gate stacks are achieved by increasing the dielectric constant of the interfacial layer to a value that is greater than the originally formed interfacial layer, i.e., the interfacial layer prior to diffusion of a high k material dopant element therein. In another embodiment, the aforementioned scaled high k/metal gate stacks are achieved by eliminating the interfacial layer from the structure. In yet another embodiment, the aforementioned high k/metal gate stacks are achieved by both increasing the dielectric constant of the interfacial layer and reducing/eliminating the interfacial layer.

摘要翻译： 提供了相当于氧化物厚度（EOT）的高k /金属栅极叠层，其中基本上消除了界面层的电容瓶颈，对器件沟道中载流子的迁移率的影响最小。 在一个实施例中，通过将界面层的介电常数提高到大于原始形成的界面层的值，即高k扩散之前的界面层，可实现上述EOT缩放的高k /金属栅极堆叠 材料掺杂元素。 在另一个实施例中，通过从结构中消除界面层来实现上述缩放的高k /金属栅极堆叠。 在另一个实施方案中，上述高k /金属栅极堆叠是通过增加界面层的介电常数和减少/消除界面层来实现的。

公开(公告)号：US20080299730A1

公开(公告)日：2008-12-04

申请号：US12190129

申请日：2008-08-12

申请人： Alessandro C. Callegari ,  Michael A. Gribelyuk ,  Vijay Narayanan ,  Vamsi K. Paruchuri ,  Sufi Zafar

发明人： Alessandro C. Callegari ,  Michael A. Gribelyuk ,  Vijay Narayanan ,  Vamsi K. Paruchuri ,  Sufi Zafar

IPC分类号： H01L21/336 ,  C23C14/34

CPC分类号： H01L21/28088 ,  H01L21/823828 ,  H01L29/4908 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518

摘要： A compound metal comprising MOxNy which is a p-type metal having a workfunction of about 4.75 to about 5.3, preferably about 5, eV that is thermally stable on a gate stack comprising a high k dielectric and an interfacial layer is provided as well as a method of fabricating the MOxNy compound metal. Furthermore, the MOxNy metal compound of the present invention is a very efficient oxygen diffusion barrier at 1000° C. allowing very aggressive equivalent oxide thickness (EOT) and inversion layer thickness scaling below 14 Å in a p-metal oxide semiconductor (pMOS) device. In the above formula, M is a metal selected from Group IVB, VB, VIB or VIIB of the Periodic Table of Elements, x is from about 5 to about 40 atomic % and y is from about 5 to about 40 atomic %.

摘要翻译： 包含MoxNy的复合金属是具有在包括高k电介质和界面层的栅叠层上热稳定的功函数为约4.75至约5.3，优选约5e的功函数的p型金属，以及 制造MOxNy复合金属的方法。 此外，本发明的MOxNy金属化合物在1000℃下是非常有效的氧扩散阻挡层，允许在p金属氧化物半导体（pMOS）器件中非常有侵蚀性的等效氧化物厚度（EOT）和低于14的反型层厚度标度 。 在上式中，M是选自元素周期表第IVB，VB，VIB或VIIB族的金属，x为约5至约40原子％，y为约5至约40原子％。

公开(公告)号：US07436034B2

公开(公告)日：2008-10-14

申请号：US11311455

申请日：2005-12-19

申请人： Alessandro C. Callegari ,  Michael A. Gribelyuk ,  Vijay Narayanan ,  Vamsi K. Paruchuri ,  Sufi Zafar

发明人： Alessandro C. Callegari ,  Michael A. Gribelyuk ,  Vijay Narayanan ,  Vamsi K. Paruchuri ,  Sufi Zafar

IPC分类号： H01L21/00

CPC分类号： H01L21/28088 ,  H01L21/823828 ,  H01L29/4908 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518

摘要： A compound metal comprising MOxNy which is a p-type metal having a workfunction of about 4.75 to about 5.3, preferably about 5, eV that is thermally stable on a gate stack comprising a high k dielectric and an interfacial layer is provided as well as a method of fabricating the MOxNy compound metal. Furthermore, the MOxNy metal compound of the present invention is a very efficient oxygen diffusion barrier at 1000° C. allowing very aggressive equivalent oxide thickness (EOT) and inversion layer thickness scaling below 14 Å in a p-metal oxide semiconductor (PMOS) device. In the above formula, M is a metal selected from Group IVB, VB, VIB or VIIB of the Periodic Table of Elements, x is from about 5 to about 40 atomic % and y is from about 5 to about 40 atomic %.

摘要翻译： 一种复合金属，其包含具有约4.75至约5.3，优选约5eV的功函数的p型金属，其在一个或多个金属上是热稳定的 提供了包括高k电介质和界面层的栅极叠层以及制造复合金属的方法。 此外，本发明的金属氧化物金属化合物在1000℃下是非常有效的氧扩散阻挡层，允许非常有效的等效氧化物厚度（EOT）和反演 在p-金属氧化物半导体（PMOS）器件中的层厚度缩小到14埃以下。 在上式中，M是选自元素周期表第IVB，VB，VIB或VIIB族的金属，x为约5至约40原子％，y为约5至约40原子％。