公开(公告)号：US5278422A

公开(公告)日：1994-01-11

申请号：US935413

申请日：1992-08-26

申请人： Fumio Kato ,  Sigeo Akiyama ,  Masahiro Izumi ,  Noriteru Furumoto

发明人： Fumio Kato ,  Sigeo Akiyama ,  Masahiro Izumi ,  Noriteru Furumoto

IPC分类号： H03K17/0412 ,  H03K17/16 ,  H03K17/785 ,  G02B27/00 ,  H03K3/42

CPC分类号： H03K17/163 ,  H03K17/04123 ,  H03K17/785

摘要： A solid state relay circuit includes a MOSFET receiving a photovoltaic output generated across a photovoltaic diode array responsive to a light signal from a light emitting element, a control electrode of a normally ON type driving transistor made to be at a high impedance state by a voltage generated across an impedance element connected in series to the photovoltaic diode array upon application of the photovoltaic output across the gate and source of the MOSFET and at a low impedance state upon disappearance of the photovoltaic output is connected to a connecting point between the diode array and the impedance element, and the driving transistor is connected across the gate and source of the MOSFET with a resistor interposed. A falling gradient of output signal upon being turned OFF of the relay circuit is made thereby sufficiently gentle, and relay operation upon being turned OFF can be minimized in response time.

摘要翻译： 固态继电器电路包括：MOSFET接收光电二极管阵列产生的光电输出，该光伏输出响应于来自发光元件的光信号，正常导通型驱动晶体管的控制电极被制成处于高阻抗状态的电压 在跨越MOSFET的栅极和源极施加光伏输出并且在光伏输出消失时处于低阻抗状态的阻抗元件上串联连接到光伏二极管阵列的阻抗元件连接到二极管阵列和 阻抗元件和驱动晶体管连接在MOSFET的栅极和源极之间，并插入电阻器。 使继电器电路断开时的输出信号的下降斜率足够平缓，并且在关断时的继电器动作可以在响应时间内最小化。

公开(公告)号：US5181491A

公开(公告)日：1993-01-26

申请号：US842703

申请日：1992-02-27

申请人： Masahiro Izumi ,  Toshiharu Aoshima ,  Yutaka Ide ,  Ritsuko Terawaki ,  Hideaki Hosoya

发明人： Masahiro Izumi ,  Toshiharu Aoshima ,  Yutaka Ide ,  Ritsuko Terawaki ,  Hideaki Hosoya

IPC分类号： F02B27/00 ,  F02B75/18 ,  F02D9/10 ,  F02M3/06 ,  F02M23/08 ,  F02M35/10 ,  F02M35/104 ,  F02M69/32

CPC分类号： F02M35/10183 ,  F02B27/005 ,  F02D9/1055 ,  F02D9/1095 ,  F02M23/08 ,  F02M3/06 ,  F02M35/10 ,  F02M35/10222 ,  F02M35/10255 ,  F02B2075/1812 ,  Y02T10/14 ,  Y02T10/146

摘要： An intake system in a multi-cylinder type internal combustion engine comprises throttle valves disposed in a plurality of intake passages commonly connected to an air cleaner, and fuel injection valves disposed in the intake passages downstream of the throttle valves in an intake direction. In such intake system, a plurality of funnel-shaped portions are provided in a throttle body having opposite ends directly coupled to an intake manifold and an air cleaner, respectively, and each of the throttle valves is disposed in the throttle body, so that its upstream end in the intake direction is located at least on the corresponding funnel-shaped portion, when the throttle valve is fully opened. The throttle body includes ports provided therein, which are opened into the intake passages between a coupled surface of the throttle body to the intake manifold and the throttle valves, respectively, and which communicate with one another. This provides an increase in space efficiency and an increase in intake inertial effect.

摘要翻译： 多缸型内燃机中的进气系统包括设置在共同连接到空气滤清器的多个进气通道中的节流阀，以及设置在进气通道中的进气通道在进气方向下游的燃料喷射阀。 在这种进气系统中，多个漏斗形部分分别设置在节气门体中，其相对的端部分别直接联接到进气歧管和空气滤清器，并且每个节流阀设置在节气门体中，使得其 当节流阀完全打开时，进气方向的上游端至少位于相应的漏斗形部分上。 节气门体包括设置在其中的端口，其分别在节气门本体与进气歧管的联接表面和节流阀之间的进气通道中打开并彼此连通。 这提供了空间效率的增加和摄入惯性效应的增加。

公开(公告)号：US08894254B2

公开(公告)日：2014-11-25

申请号：US13361791

申请日：2012-01-30

申请人： Ryotaro Matsuda ,  Jun Sasaki ,  Shigeru Osawa ,  Yuichiro Takahara ,  Hiromichi Nakajima ,  Kenji Takanashi ,  Keiichi Shimizu ,  Masahiro Izumi ,  Hiroshi Matsushita ,  Masahiro Toda ,  Junichi Kimiya ,  Hiroshi Takenaga ,  Takeshi Osada

发明人： Ryotaro Matsuda ,  Jun Sasaki ,  Shigeru Osawa ,  Yuichiro Takahara ,  Hiromichi Nakajima ,  Kenji Takanashi ,  Keiichi Shimizu ,  Masahiro Izumi ,  Hiroshi Matsushita ,  Masahiro Toda ,  Junichi Kimiya ,  Hiroshi Takenaga ,  Takeshi Osada

IPC分类号： F21V29/00 ,  F21V15/01 ,  F21K99/00 ,  F21V23/00 ,  F21V17/00 ,  F21S8/02 ,  F21V7/09 ,  F21V3/02 ,  F21Y101/02

CPC分类号： F21S2/005 ,  F21K9/20 ,  F21S8/026 ,  F21V3/02 ,  F21V7/09 ,  F21V15/01 ,  F21V17/002 ,  F21V23/006 ,  F21V23/009 ,  F21V29/004 ,  F21V29/713 ,  F21V29/773 ,  F21V29/85 ,  F21V29/89 ,  F21Y2115/10

摘要： According to one embodiment, a lamp apparatus includes a light-emitting module, housing, and a lighting circuit. The light-emitting module includes a light-emitting element. The housing opens in the direction of irradiation of a light beam and having a cap on a side opposite from the direction of irradiation of the light beam. The cap is provided with a light-emitting module mounting portion projecting in the direction of irradiation of the light beam and the light-emitting module is mounted on the light-emitting module mounting portion. The lighting circuit is accommodated in the housing.

摘要翻译： 根据一个实施例，灯装置包括发光模块，壳体和照明电路。 发光模块包括发光元件。 壳体在照射光束的方向上开口，并且在与光束的照射方向相反的一侧具有盖。 盖设有沿光束照射方向突出的发光模块安装部，发光模块安装在发光模块安装部上。 照明电路容纳在壳体中。

公开(公告)号：US08569786B2

公开(公告)日：2013-10-29

申请号：US13105868

申请日：2011-05-11

申请人： Haruki Takei ,  Seiko Kawashima ,  Masahiro Izumi ,  Akiko Saito ,  Yusuke Shibahara ,  Tsuyoshi Oyaizu

发明人： Haruki Takei ,  Seiko Kawashima ,  Masahiro Izumi ,  Akiko Saito ,  Yusuke Shibahara ,  Tsuyoshi Oyaizu

IPC分类号： H01L33/62

CPC分类号： F21S8/086 ,  F21K9/23 ,  F21V23/06 ,  F21W2131/103 ,  F21Y2115/10 ,  H01R12/515

摘要： According to one embodiment, a light emitting device includes a substrate, a light emitting element and connectors. The substrate has a surface and a back face, and power supply terminals are formed on the surface. The light emitting element is mounted on the surface of the substrate. The connector includes a contact portion coming into contact with the power supply terminal on the surface side of the substrate and a connector terminal having a wire connection portion projecting on the back face side of the substrate, and a power supply wire is connected to the wire connection portion of the connector terminal.

摘要翻译： 根据一个实施例，发光器件包括衬底，发光元件和连接器。 基板具有表面和背面，并且在表面上形成电源端子。 发光元件安装在基板的表面上。 连接器包括与基板的表面侧上的电源端子接触的接触部分和具有在基板的背面侧突出的导线连接部分的连接器端子，并且电源线连接到电线 连接器端子的连接部分。

公开(公告)号：US20110278632A1

公开(公告)日：2011-11-17

申请号：US13105868

申请日：2011-05-11

申请人： Haruki Takei ,  Seiko Kawashima ,  Masahiro Izumi ,  Akiko Saito ,  Yusuke Shibahara ,  Tsuyoshi Oyaizu

发明人： Haruki Takei ,  Seiko Kawashima ,  Masahiro Izumi ,  Akiko Saito ,  Yusuke Shibahara ,  Tsuyoshi Oyaizu

IPC分类号： H01L33/62

CPC分类号： F21S8/086 ,  F21K9/23 ,  F21V23/06 ,  F21W2131/103 ,  F21Y2115/10 ,  H01R12/515

摘要： According to one embodiment, a light emitting device includes a substrate, a light emitting element and connectors. The substrate has a surface and a back face, and power supply terminals are formed on the surface. The light emitting element is mounted on the surface of the substrate. The connector includes a contact portion coming into contact with, the power supply terminal on the surface side of the substrate and a connector terminal having a wire connection portion projecting on the back face side of the substrate, and a power supply wire is connected to the wire connection portion of the connector terminal.

摘要翻译： 根据一个实施例，发光器件包括衬底，发光元件和连接器。 基板具有表面和背面，并且在表面上形成电源端子。 发光元件安装在基板的表面上。 连接器包括与基板表面侧的电源端子接触的接触部分和在基板的背面侧突出的导线连接部分的连接器端子，并且电源线连接到 连接器端子的导线连接部分。

公开(公告)号：US20090253813A1

公开(公告)日：2009-10-08

申请号：US12322296

申请日：2009-01-30

申请人： Yuko Ishiguri ,  Kunio Ohkubo ,  Yukiyo Saito ,  Masahiro Izumi ,  Masaru Nakajo ,  Kuniaki Maejima ,  Hiroaki Tanaka

发明人： Yuko Ishiguri ,  Kunio Ohkubo ,  Yukiyo Saito ,  Masahiro Izumi ,  Masaru Nakajo ,  Kuniaki Maejima ,  Hiroaki Tanaka

IPC分类号： B01F17/54 ,  B01F3/12

CPC分类号： B01F17/0007 ,  B01J13/0008 ,  C01B33/1435 ,  C01B33/146 ,  C01B33/149

摘要： A colloidal silica comprising, silica particles inside of which or on the surface of which a nitrogen containing alkaline compound is fixed, wherein said silica particles are prepared by forming and growing colloid particles using the nitrogen containing alkaline compound. Said colloidal silica can be prepared by preparing active silicic acid aqueous solution contacting silicate alkali aqueous solution with cation exchange resin, adding the nitrogen containing alkaline compound and heating, and then growing up particles by build-up method.

摘要翻译： 一种胶体二氧化硅，其包含二氧化硅颗粒，其内部或其表面上含有氮的碱性化合物被固定，其中所述二氧化硅颗粒通过使用含氮碱性化合物形成和生长胶体颗粒来制备。 所述胶体二氧化硅可以通过将阳离子交换树脂与硅酸碱水溶液接触的活性硅酸水溶液制备，加入含氮碱性化合物并加热，然后通过堆积法生长颗粒。

公开(公告)号：US20090223136A1

公开(公告)日：2009-09-10

申请号：US12230353

申请日：2008-08-28

申请人： Masaru Nakajo ,  Masahiro Izumi ,  Shinsuke Miyabe ,  Kuniaki Maejima ,  Hiroaki Tanaka

发明人： Masaru Nakajo ,  Masahiro Izumi ,  Shinsuke Miyabe ,  Kuniaki Maejima ,  Hiroaki Tanaka

IPC分类号： C09K3/14

CPC分类号： H01L21/30625 ,  C09G1/02 ,  C09K3/1463

摘要： The polishing compound for semiconductor wafer of the present invention contains colloidal silica composed of silica particles to which tetraethylammonium is fixed, and concentration of silica particles dispersed in water is between 0.5 to 50 weight %. Concentration of tetraethylammonium contained in silica particles to which tetraethylammonium is fixed is desirable to be in the range from 5×10−4 to 2.5×10−2 as indicated by molar ratio of tetraethylammonium/silica.

摘要翻译： 本发明的半导体晶片用抛光剂含有固定有四乙基铵的二氧化硅粒子，分散在水中的二氧化硅粒子浓度为0.5〜50重量％的胶体二氧化硅。 固定四乙基铵的二氧化硅颗粒中所含的四乙基铵的浓度优选为5×10-4至2.5×10-2的范围，如四乙基铵/二氧化硅的摩尔比所示。

公开(公告)号：US06797367B2

公开(公告)日：2004-09-28

申请号：US10357183

申请日：2003-02-03

申请人： Minoru Ogawa ,  Masahiro Izumi ,  Shigeyasu Itoh ,  Shingetsu Yamada ,  Shuuji Suzuki ,  Hiroo Kurosaki

发明人： Minoru Ogawa ,  Masahiro Izumi ,  Shigeyasu Itoh ,  Shingetsu Yamada ,  Shuuji Suzuki ,  Hiroo Kurosaki

IPC分类号： B32B300

CPC分类号： H05K3/4632 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/09701 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/095 ,  H05K3/041 ,  H05K3/045 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2203/0108 ,  H05K2203/065 ,  Y02P20/582 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T428/24917 ,  Y10T428/249994

摘要： A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.

摘要翻译： 具有耐热性高的多层布线基板，其能够低温熔融而不发生树脂流动，能够实现高精度，细致的导电布线，理想地应用于低体积高混合物制造配置，并且还具有 与使用这种多层布线板的半导体装置安装板一起提供对环境的影响很小，以及制造这种多层布线板的方法。 在多层布线板中，形成布线电路和通孔的槽形成在由包含结晶熔融峰值温度至少为260℃的聚芳基酮树脂的热塑性树脂组合物形成的绝缘基板和无定形聚醚酰亚胺树脂中 主要成分，金属箔被嵌入槽内，使得箔的表面突出到绝缘基板的表面，并且通过固化导电膏形成的导电材料用于填充通孔。

公开(公告)号：US4605917A

公开(公告)日：1986-08-12

申请号：US532189

申请日：1983-09-14

申请人： Tatsumi Ide ,  Toshifumi Sakurai ,  Masahiro Izumi ,  Kimio Sugimura

发明人： Tatsumi Ide ,  Toshifumi Sakurai ,  Masahiro Izumi ,  Kimio Sugimura

IPC分类号： H01B3/20 ,  H01B3/30 ,  H01H50/44 ,  H01H51/08

CPC分类号： H01B3/20 ,  H01B3/30 ,  H01H50/44 ,  Y10T428/2947

摘要： A coil wire has a lubricant film formed on an outer surface of an insulation film covering a conductor. The lubricant film is made of polypropylene glycol or a material obtained by substituting a hydrogen atom at at least one end of polypropylene glycol with another reactive group so as to provide a coil wire wherein generation of organic gases can be suppressed.

摘要翻译： 线圈线具有形成在覆盖导体的绝缘膜的外表面上的润滑膜。 润滑剂膜由聚丙二醇或通过用聚丙二醇的至少一端的氢原子替代另外的反应性基团而获得的材料制成，从而提供能够抑制有机气体产生的线圈线。

公开(公告)号：USD658599S1

公开(公告)日：2012-05-01

申请号：US29369474

申请日：2010-09-09

申请人： Akimichi Takahashi ,  Kiyoshi Nishimura ,  Akiko Saito ,  Masahiro Izumi ,  Soichi Shibusawa ,  Nobuhiko Betsuda

设计人： Akimichi Takahashi ,  Kiyoshi Nishimura ,  Akiko Saito ,  Masahiro Izumi ,  Soichi Shibusawa ,  Nobuhiko Betsuda