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公开(公告)号：US20100140764A1
公开(公告)日：2010-06-10
申请号：US12328764
申请日：2008-12-04
IPC分类号： H01L21/60 , H01L23/495
CPC分类号： H01L23/4951 , H01L23/49503 , H01L23/49541 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/05554 , H01L2224/2919 , H01L2224/32057 , H01L2224/32245 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/4847 , H01L2224/4911 , H01L2224/49171 , H01L2224/49175 , H01L2224/4945 , H01L2224/73265 , H01L2224/83385 , H01L2224/83856 , H01L2224/85191 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A method of manufacture of a wire-on-lead package system includes: providing a die attach paddle with paddle extensions distributed along the periphery of the die attach paddle, providing leadfingers surrounding the die attach paddle, attaching a semiconductor die to the die attach paddle wherein the semiconductor die is larger than the die attach paddle, and connecting bond wires between the semiconductor die and the leadfingers and between the semiconductor die and the paddle extensions.
摘要翻译： 一种线引线封装系统的制造方法包括：提供具有沿芯片附接板周边分布的焊盘延伸部的管芯附接焊盘，提供围绕管芯附接焊盘的引线管，将半导体管芯附接到管芯附着焊盘 其中所述半导体管芯大于所述管芯附接焊盘，以及在所述半导体管芯和引线管之间以及所述半导体管芯和所述焊盘延伸部之间连接接合线。
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公开(公告)号：US07723840B2
公开(公告)日：2010-05-25
申请号：US11759227
申请日：2007-06-07
IPC分类号： H01L23/12
CPC分类号： H01L23/49548 , H01L21/6835 , H01L23/3107 , H01L24/48 , H01L29/0657 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014 , H01L2924/10158 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming an external interconnect, providing a contoured integrated circuit die having both an extension and a base portion with the extension extending beyond the base portion, placing the contoured integrated circuit die with the base portion coplanar with the external interconnect and the extension overhanging the external interconnect, connecting the contoured integrated circuit die and the external interconnect, and forming a package encapsulation over the contoured integrated circuit die and the external interconnect with both partially exposed.
摘要翻译： 提供了一种集成电路封装系统，包括形成外部互连，提供具有延伸部和基部部分的成型集成电路管芯，延伸部延伸超出基部部分，将成形的集成电路管芯与底部共面与外部 互连和伸出外部互连的延伸部分，连接轮廓化的集成电路管芯和外部互连，以及在轮廓化的集成电路管芯和外部互连部分暴露部分之间形成封装封装。
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公开(公告)号：US20100052131A1
公开(公告)日：2010-03-04
申请号：US12198491
申请日：2008-08-26
CPC分类号： H01L25/03 , H01L23/3128 , H01L24/24 , H01L24/73 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/24247 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/73267 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： An integrated circuit package system includes forming a first external interconnect having both a first side and a second side that is an opposing side to the first side; forming a first encapsulation around a first integrated circuit and the first external interconnect with the first side, the second side, and the first active side of the first integrated circuit exposed; forming a planar interconnect between the first active side and the second side; forming a second encapsulation covering the planar interconnect and the first active side; connecting a second integrated circuit over the first integrated circuit and the first side; and forming a top encapsulation over the second integrated circuit.
摘要翻译： 一种集成电路封装系统，包括形成第一外部互连，其具有与第一侧相对的第一侧和第二侧; 在第一集成电路周围形成第一封装，并且暴露第一集成电路的第一侧，第二侧和第一有源侧的第一外部互连; 在所述第一主动侧和所述第二侧之间形成平面互连; 形成覆盖所述平面互连和所述第一有源侧的第二封装; 连接第一集成电路和第一侧上的第二集成电路; 以及在第二集成电路上形成顶部封装。
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公开(公告)号：US20090289335A1
公开(公告)日：2009-11-26
申请号：US12124793
申请日：2008-05-21
申请人： Zigmund Ramirez Camacho , Lionel Chien Hui Tay , Henry Descalzo Bathan , Guruprasad Badakere Govindaiah
发明人： Zigmund Ramirez Camacho , Lionel Chien Hui Tay , Henry Descalzo Bathan , Guruprasad Badakere Govindaiah
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L23/3107 , H01L23/4334 , H01L23/49541 , H01L23/49551 , H01L23/552 , H01L24/29 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4911 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package system includes: providing a tie bar and a lead adjacent thereto; connecting an integrated circuit and the lead; mounting a shield over the integrated circuit with the shield connected to the tie bar; and encapsulating the integrated circuit and the shield. An integrated circuit package system also includes: forming a lead and a support structure with substantially the same material as the lead and elevated above the lead; connecting an integrated circuit and the lead; mounting a shield over the integrated circuit with the shield on the support structure; and encapsulating the integrated circuit and the shield.
摘要翻译： 集成电路封装系统包括：提供与其相邻的连接杆和引线; 连接集成电路和引线; 将屏蔽件安装在集成电路上，屏蔽层连接到连接杆上; 并封装集成电路和屏蔽。 集成电路封装系统还包括：形成具有与引线基本上相同的材料并在引线上方升高的引线和支撑结构; 连接集成电路和引线; 将集成电路上的屏蔽件与屏蔽件安装在支撑结构上; 并封装集成电路和屏蔽。
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公开(公告)号：US20090230517A1
公开(公告)日：2009-09-17
申请号：US12046430
申请日：2008-03-11
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/3135 , H01L23/49531 , H01L23/49548 , H01L23/49551 , H01L24/48 , H01L25/03 , H01L25/105 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system comprising: fabricating a package base including: forming a lead frame, coupling a first integrated circuit device under the lead frame, coupling a second integrated circuit device over the first integrated circuit device, and molding an enclosure on the lead frame, the first integrated circuit device, and the second integrated circuit device for forming an integration port; and coupling a third integrated circuit device on the integration port.
摘要翻译： 一种集成电路封装系统，包括：制造封装基座，包括：形成引线框架，将引线框架下方的第一集成电路器件耦合到第一集成电路器件上的第二集成电路器件，以及将引线框架上的外壳模制成型 ，第一集成电路器件和用于形成集成端口的第二集成电路器件; 并在集成端口上耦合第三集成电路器件。
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公开(公告)号：US20090166845A1
公开(公告)日：2009-07-02
申请号：US11965550
申请日：2007-12-27
申请人： Zigmund Ramirez Camacho , Lionel Chien Hui Tay , Jairus Legaspi Pisigan , Henry Descalzo Bathan
发明人： Zigmund Ramirez Camacho , Lionel Chien Hui Tay , Jairus Legaspi Pisigan , Henry Descalzo Bathan
CPC分类号： H01L23/495 , H01L23/552 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit package system including: forming a die pad, wherein the die pad has a tiebar at a corner; forming a lead wherein the lead is connected to the tiebar; connecting an integrated circuit die to the die pad; and forming an encapsulation, having an edge, over the integrated circuit die with the lead extending from and beyond the edge.
摘要翻译： 一种集成电路封装系统，包括：形成管芯焊盘，其中所述管芯焊盘在拐角处具有连接杆; 形成引线，其中引线连接到连接杆; 将集成电路管芯连接到管芯焊盘; 以及在所述集成电路裸片上形成具有边缘的封装，所述引线从所述边缘延伸出并超过所述边缘。
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公开(公告)号：US20090032918A1
公开(公告)日：2009-02-05
申请号：US11833898
申请日：2007-08-03
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49548 , H01L21/563 , H01L23/3107 , H01L23/49575 , H01L24/48 , H01L24/97 , H01L2224/16245 , H01L2224/32245 , H01L2224/32257 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： An integrated circuit package system includes: forming a die-attach paddle, an outer interconnect, and an inner interconnect toward the die-attach paddle beyond the outer interconnect; mounting an integrated circuit device over the die-attach paddle; connecting the integrated circuit device to the inner interconnect and the outer interconnect; encapsulating the integrated circuit device over the die-attach paddle; attaching an external interconnect under the outer interconnect; and attaching a circuit device under the die-attach paddle and extended laterally beyond opposite sides of the die-attach paddle.
摘要翻译： 集成电路封装系统包括：形成管芯附接焊盘，外部互连和内部互连，使芯片附着焊盘超出外部互连; 将集成电路装置安装在芯片附接板上; 将集成电路装置连接到内部互连和外部互连; 将所述集成电路器件封装在所述管芯附接焊盘上; 在外部互连下方附加外部互连; 以及将电路装置附接在所述管芯附接桨下方并且横向延伸超过所述管芯附着桨的相对侧。
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公开(公告)号：US20090001539A1
公开(公告)日：2009-01-01
申请号：US11768730
申请日：2007-06-26
CPC分类号： H01L23/3128 , H01L21/56 , H01L23/49575 , H01L24/48 , H01L25/105 , H01L2224/48091 , H01L2224/48471 , H01L2224/73265 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes a die pad with leads; attaching an integrated circuit over the die pad; attaching a connector to the integrated circuit and the leads; and forming an encapsulant, over the integrated circuit, having a connection cavity over the leads leaving an exposed portion of the leads.
摘要翻译： 集成电路封装系统包括具有引线的管芯焊盘; 在芯片焊盘上附加集成电路; 将连接器连接到集成电路和引线; 以及在所述集成电路上形成密封剂，所述密封剂在所述引线上具有连接空腔，留下所述引线的暴露部分。
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公开(公告)号：US20080303122A1
公开(公告)日：2008-12-11
申请号：US12132121
申请日：2008-06-03
申请人： Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Henry Descalzo Bathan , Lionel Chien Hui Tay
发明人： Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Henry Descalzo Bathan , Lionel Chien Hui Tay
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/13 , H01L23/3128 , H01L23/3135 , H01L23/4952 , H01L24/48 , H01L24/73 , H01L24/85 , H01L25/03 , H01L25/105 , H01L2224/04042 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/484 , H01L2224/73265 , H01L2224/85 , H01L2225/1029 , H01L2225/1035 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded package having the leads partially exposed opposite the frame.
摘要翻译： 集成电路封装系统包括：提供框架; 附接具有邻近框架的引线的引线封装，其中引线朝向与框架相对的一侧延伸; 以及在所述引线封装上施加封装密封剂，所述引线封装具有与所述框架相对部分地露出的引线。
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公开(公告)号：US20080284002A1
公开(公告)日：2008-11-20
申请号：US11750218
申请日：2007-05-17
申请人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Abelardo Hadap Advincula , Lionel Chien Hui Tay
发明人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Abelardo Hadap Advincula , Lionel Chien Hui Tay
IPC分类号： H01L23/28
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L23/49575 , H01L24/48 , H01L2224/32145 , H01L2224/45014 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/85001 , H01L2924/00014 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/4554
摘要： An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an integrated circuit die with the backside element, the backside element is on a first passive side of the integrated circuit die; connecting a first active side of the integrated circuit die and the external interconnect; and forming a first encapsulation over the integrated circuit die with the backside element exposed.
摘要翻译： 提供了一种集成电路封装系统，包括将外部互连件附接在磁带上; 将背面元件附接在与外部互连件相邻的带上; 将集成电路裸片与后侧元件连接，后侧元件位于集成电路管芯的第一被动侧; 连接集成电路管芯的第一有源侧和外部互连; 以及在所述背面元件暴露的情况下在所述集成电路裸片上形成第一封装。
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