公开(公告)号：US12246376B2

公开(公告)日：2025-03-11

申请号：US17594978

申请日：2020-05-05

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar Khaselev ,  Matthew James Siebenhuhner ,  Monnir Boureghda ,  Mike Marczi ,  Carl Bilgrien

IPC: B23K1/00 ,  B22C9/22 ,  B22D21/00 ,  B22D21/06 ,  B22D25/04 ,  B23K101/40

Abstract: A method of making a combined sinter-ready silver film and carrier comprises the steps of: a) creating a carrier comprising designed openings; b) casting a silver film layer into the designed openings, for example casting a silver paste; and c) drying the carrier and silver film layer to form the combined sinter-ready silver film and carrier. The carrier may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier may comprise a stencil layer and a backing layer. The stencil layer may define the designed openings. The backing layer may be configured for sealing a bottom of the designed openings, wherein at the start of step b), a top of the designed openings may be open for receiving the cast silver film layer.

公开(公告)号：US12122679B2

公开(公告)日：2024-10-22

申请号：US17046191

申请日：2019-04-08

Applicant: Alpha Assembly Solutions Inc.

Inventor： Nirmalya Kumar Chaki ,  Supriya Devarajan ,  Barun Das ,  Chetan Pravinchandra Shah ,  Venodh Manoharan ,  Rahul Raut ,  Bawa Singh ,  Ranjit Pandher

IPC: C01B32/194 ,  B29C51/14 ,  B29K67/00 ,  B29K69/00 ,  C08K3/04 ,  C09K5/14 ,  H01B1/04

CPC classification number: C01B32/194 ,  B29C51/14 ,  C08K3/042 ,  C09K5/14 ,  H01B1/04 ,  B29K2067/003 ,  B29K2069/00 ,  C01B2204/04 ,  C01B2204/22 ,  C01B2204/24 ,  C01B2204/32 ,  C08K2201/001 ,  C08K2201/011

Abstract: Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.

公开(公告)号：US20240021565A1

公开(公告)日：2024-01-18

申请号：US18370150

申请日：2023-09-19

Applicant: Alpha Assembly Solutions Inc.

Inventor： Angelo GULINO ,  Bogdan BANKIEWICZ ,  Oscar KHASELEV ,  Anna LIFTON ,  Michael T. MARCZI ,  Girard SIDONE ,  Paul SALERNO ,  Paul J. KOEP

IPC: H01L23/00

CPC classification number: H01L24/29 ,  H01L24/27 ,  H01L2224/29111 ,  H01L2224/29411 ,  H01L2224/29347 ,  H01L2224/29013 ,  H01L2924/20755 ,  H01L2224/27849 ,  H01L2924/351 ,  H01L2924/014

Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.

公开(公告)号：US11830640B2

公开(公告)日：2023-11-28

申请号：US17382980

申请日：2021-07-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

CPC classification number: H01B1/22 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B22F1/17 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/362 ,  B23K35/3613 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/1241 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2304/10 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0203 ,  H05K2201/0245 ,  H05K2201/10106

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US11724342B2

公开(公告)日：2023-08-15

申请号：US17462064

申请日：2021-08-31

Applicant: Kester LLC

Inventor： Md Hasnine ,  Lik Wai Kho

IPC: B23K35/26 ,  C22C13/02 ,  C22C13/00 ,  B23K35/02

CPC classification number: B23K35/262 ,  B23K35/26 ,  C22C13/00 ,  C22C13/02 ,  B23K35/025 ,  B23K35/0227 ,  B23K35/0244

Abstract: A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.

公开(公告)号：US11624000B2

公开(公告)日：2023-04-11

申请号：US16616701

申请日：2018-05-22

Applicant: Alpha Assembly Solutions Inc. ,  MacDermid Autotype Limited

Inventor： Nirmalya Kumar Chaki ,  Chetan Pravinchandra Shah ,  Barun Das ,  Supriya Devarajan ,  Siuli Sarkar ,  Rahul Raut ,  Bawa Singh ,  Anubhav Rustogi ,  Anna Jane Harris ,  Keith Paul Parsons ,  Jeffrey William Braham

IPC: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  C09D11/104 ,  H01H13/704

Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.

公开(公告)号：US20210289680A1

公开(公告)日：2021-09-16

申请号：US17153706

申请日：2021-01-20

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K13/04 ,  H01L23/00

Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

公开(公告)号：US20210283727A1

公开(公告)日：2021-09-16

申请号：US17286704

申请日：2019-10-23

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Rahul RAUT ,  Nirmalyakumar CHAKI ,  Bawa SINGH ,  Ranjit PANDHER ,  Siuli SARKAR

IPC: B23K35/26 ,  B23K35/02 ,  B23K35/362

Abstract: A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 wt. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.

公开(公告)号：US10905041B2

公开(公告)日：2021-01-26

申请号：US14027530

申请日：2013-09-16

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC: H01L23/29 ,  H05K13/04 ,  H01L23/00

Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

公开(公告)号：US20200338859A1

公开(公告)日：2020-10-29

申请号：US16927444

申请日：2020-07-13

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar Khaselev ,  Bin Mo ,  Monnir Boureghda ,  Michael T. Marczi ,  Bawa Singh

IPC: B32B15/01 ,  B22F5/00 ,  B22F7/04 ,  C22C32/00 ,  C22C49/00 ,  H01L23/00

Abstract: A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.