公开(公告)号：US20150209899A1

公开(公告)日：2015-07-30

申请号：US14164506

申请日：2014-01-27

申请人： General Electric Company

发明人： Zhaoli Hu ,  Abe Denis Darling ,  Shamgar Elijah McDowell ,  Douglas Anthony Serieno

IPC分类号： B23K26/03 ,  B23K26/38 ,  B23K26/14 ,  B23K26/00

CPC分类号： B23K26/03 ,  B23K26/0006 ,  B23K26/146 ,  B23K26/388 ,  B23K26/389 ,  B23K2101/001 ,  B23K2103/172

摘要： A method for manufacturing an airfoil is provided, the method including drilling a hole in a near wall of the airfoil using a laser drill and activating a back strike protection in a cavity of the airfoil. The method additionally includes detecting a breakthrough of a laser from the laser drill through the near wall of the airfoil and subsequently initiating a drilling subroutine, with the drilling subroutine including a continued operation of the laser drill. Such a method may provide for an improved hole, such as a cooling passage, in the airfoil.

摘要翻译： 提供了一种用于制造翼型的方法，所述方法包括使用激光钻孔在所述翼型件的近壁处钻孔，并且激活所述翼型件的空腔中的反击保护。 该方法还包括检测来自激光钻孔机的激光穿过翼型件的近壁的突破，并随后启动钻孔子程序，其中钻孔子程序包括激光钻孔机的连续操作。 这种方法可以在翼型件中提供改进的孔，例如冷却通道。

公开(公告)号：US20150165561A1

公开(公告)日：2015-06-18

申请号：US14404513

申请日：2013-05-30

申请人： SNECMA

发明人： Yves Le Meur ,  Jean-Baptiste Mottin

IPC分类号： B23K26/38 ,  B23K26/06 ,  B23K26/14

CPC分类号： B23K26/1435 ,  B23K26/0622 ,  B23K26/382 ,  B23K26/389 ,  B23K2101/001 ,  H01S3/0407 ,  H01S3/061 ,  H01S3/093 ,  H01S3/1028 ,  H01S3/1643

摘要： A method of drilling a part, or a turbine engine part, by a pulse laser generator including a cavity in which there is mounted a solid bar for generating laser pulses, the method including determining values of a plurality of operating parameters of the laser generator for forming orifices of predetermined diameter in the part, and taking account, among the parameters, of a setpoint value for the temperature of the laser cavity, which value is determined as a function of characteristics of the orifices to be drilled.

摘要翻译： 一种通过包括空腔的脉冲激光发生器来钻出部件或涡轮发动机部件的方法，其中安装有用于产生激光脉冲的实心棒，该方法包括确定激光发生器的多个操作参数的值， 在部件中形成预定直径的孔，并且在参数之中考虑激光腔的温度的设定值，该值被确定为要钻孔的特征的函数。

公开(公告)号：US20150159821A1

公开(公告)日：2015-06-11

申请号：US14554479

申请日：2014-11-26

申请人： DISCO CORPORATION

发明人： Taro Arakawa

IPC分类号： F21K99/00

CPC分类号： H01L21/00 ,  B23K26/00 ,  B23K26/18 ,  B23K26/359 ,  B23K26/389 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/172 ,  B23K2103/50 ,  H01L21/78

摘要： A method of processing an optical device wafer which includes a laser processing step of repeating an application of one pulse of a pulsed laser beam to the optical device wafer to form one laser processed hole, thereby forming a plurality of laser processed holes along streets; an etching step of causing an etchant to enter into the laser processed holes to etch the inside of the laser processed holes; and a dividing step of exerting an external force on the optical device wafer to divide the optical device wafer along the streets, thereby forming a plurality of optical devices.

摘要翻译： 一种处理光学器件晶片的方法，包括激光处理步骤，重复将脉冲激光束的一个脉冲施加到光学器件晶片，以形成一个激光加工孔，从而沿着街道形成多个激光加工孔; 蚀刻步骤，使蚀刻剂进入激光加工孔，以蚀刻激光加工孔的内部; 以及在光学器件晶片上施加外力以沿着街道划分光学器件晶片的分割步骤，从而形成多个光学器件。

公开(公告)号：US20150158115A1

公开(公告)日：2015-06-11

申请号：US14103347

申请日：2013-12-11

申请人： Gordon Davies

发明人： Gordon Davies

IPC分类号： B23K26/00 ,  D05B37/00 ,  D05B93/00 ,  B23K26/38

CPC分类号： D05B93/00 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/172 ,  D05B37/00 ,  D05B61/00 ,  D05D2207/00 ,  D05D2209/16

摘要： In at least one implementation, a method for forming openings for a stitched seam in a composite panel having an outer layer, and a substrate behind the outer layer includes providing a laser beam onto the substrate, with the laser beam forming an opening through the substrate but not through the outer layer, and moving at least one of the laser or the substrate relative to the other so that a new opening can be formed that is spaced from the already formed opening. Successive openings can be formed in desired locations around the panel to facilitate subsequent panel stitching. In at least some implementations, the laser may form such openings while stitches are formed in the panel, wherein a stitch is provided in a previous opening while or nearly at the same time the laser forms a different opening for a subsequent stitch.

摘要翻译： 在至少一个实施方案中，用于在具有外层的复合面板中形成用于缝合缝的开口的方法和在外层后面的衬底包括在激光束上形成穿过衬底的开口 而不是通过外层，并且相对于另一个移动至少一个激光器或基板，使得可以形成与已经形成的开口间隔开的新的开口。 可以在面板周围的期望位置形成连续的开口，以便于随后的面板拼接。 在至少一些实施方案中，激光器可以形成这样的开口，同时在面板中形成线迹，其中在先前的开口中设置线圈，或者几乎同时激光形成用于随后的针迹的不同的开口。

公开(公告)号：US09039485B2

公开(公告)日：2015-05-26

申请号：US14132647

申请日：2013-12-18

申请人： Micromachining AG

发明人： Walter Maurer

IPC分类号： B24C1/04 ,  B24B49/02 ,  B26D5/00 ,  B26F3/00 ,  B24C3/02 ,  B24C3/04 ,  B23K37/02 ,  B23K26/03 ,  B23K26/08 ,  B23K26/38

CPC分类号： B24B49/02 ,  B23K26/03 ,  B23K26/032 ,  B23K26/0884 ,  B23K26/38 ,  B23K26/389 ,  B23K37/0235 ,  B23K2101/001 ,  B24C1/045 ,  B24C3/04 ,  B26D5/00 ,  B26D5/005 ,  B26F3/004

摘要： The method for machining a series of workpieces (21) via at least one machining jet includes the following steps: each workpiece (21) is associated with an identifier for uniquely identifying the workpiece, during the machining of a respective workpiece, the temporal characteristic of the machining jet is detected by at least one sensor (30), the detected temporal characteristic is evaluated so as to obtain at least one comparative value, and for detecting incorrect machining, the at least one comparative value is compared with at least one threshold value.

摘要翻译： 用于通过至少一个加工喷嘴加工一系列工件（21）的方法包括以下步骤：每个工件（21）与用于唯一地识别工件的标识符相关联，在加工相应工件期间的时间特性 通过至少一个传感器（30）检测加工喷嘴，评估所检测的时间特性以获得至少一个比较值，并且为了检测不正确的加工，将所述至少一个比较值与至少一个阈值 。

公开(公告)号：US20150129688A1

公开(公告)日：2015-05-14

申请号：US14490326

申请日：2014-09-18

申请人： CYTONOME/ST, LLC

发明人： Kristopher Scott Buchanan ,  Johnathan Charles Sharpe

IPC分类号： B23K26/38 ,  B05B1/02 ,  B23K26/40

CPC分类号： B23K26/388 ,  B05B1/02 ,  B23K26/389

摘要： Microfluidic flow-through elements and methods for forming and using the same, particularly, low cost, easily sterilized, disposable microfluidic flow-through elements may include an orifice region suitable, for example, for fluid jet formation (such as in a droplet sorter or flow cell) or sample injection or hydrodynamic focusing (such as in a non-droplet flow cytometer). Laser drilling, for example laser ablation, may be used to form an orifice region extending through an orifice wall section of a base substrate. The base substrate may be unitarily-formed by injection molding a polymeric material. The orifice region may be advantageously configured to form a predetermined geometry by controlling the characteristics of the ablating beam.

摘要翻译： 用于形成和使用它们，特别是低成本，容易灭菌的一次性微流体流过元件的微流体流通元件和方法可以包括适合于例如用于流体射流形成的孔口区域（例如在液滴分选器或 流动池）或样品注射或流体动力学聚焦（例如在非液滴流式细胞仪中）。 可以使用激光钻孔，例如激光烧蚀来形成延伸穿过基底基板的孔壁部分的孔口区域。 基底可以通过注塑成型聚合物材料而整体形成。 孔口区域可以有利地构造成通过控制消融梁的特性来形成预定几何形状。

公开(公告)号：US20150108691A1

公开(公告)日：2015-04-23

申请号：US13992284

申请日：2010-01-27

申请人： Decoma (Germany) GmbH

发明人： Anton Tomaj

IPC分类号： B23K26/40 ,  B23K26/38 ,  B23K26/36

CPC分类号： B23K26/359 ,  B23K26/364 ,  B23K26/386 ,  B23K26/389 ,  B23K26/402 ,  B23K26/53 ,  B23K2101/006 ,  B23K2101/18 ,  B23K2103/34 ,  B23K2103/42 ,  B23K2103/50 ,  F16D13/04 ,  F16D13/54

摘要： A method for producing a linear weakening in a flat decorative material having a point-like or spot-like area of action progressing along a machining direction of a laser light beam on the decorative material. The decorative material is set transversely with respect to the machining direction in the area of action in order to obtain a different weakening depth profile on the left and right of the weakening line predefined by the machining direction.

摘要翻译： 一种在具有点状或点状作用的平面装饰材料中产生线性弱化的方法，其沿装饰材料上的激光束的加工方向进行。 装饰材料在作用区域相对于加工方向横向设置，以便获得由加工方向预定的弱化线的左右两侧的不同的弱化深度分布。

公开(公告)号：US20150056743A1

公开(公告)日：2015-02-26

申请号：US14379851

申请日：2012-03-12

申请人： Shoichi Karakida

发明人： Shoichi Karakida

IPC分类号： H01L31/18 ,  H01L31/0236

CPC分类号： H01L31/18 ,  B23K26/0661 ,  B23K26/18 ,  B23K26/388 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/38 ,  B23K2101/40 ,  B23K2103/50 ,  H01L31/02363 ,  Y02E10/50

摘要： A manufacturing method of a solar cell includes a protection-film forming step of forming a protection film on one surface side of a semiconductor substrate, a first processing step of forming a plurality of first openings having a shape close to a desired opening shape and a size smaller than a target opening size in the protection film by a method having relatively high processing efficiency, a second processing step of forming second openings in the protection film by expanding the first openings up to the target opening size by a method having relatively high processing accuracy, and an etching step of forming an asperity structure having the a concave portion in an inverted pyramid shape on the one surface side of the semiconductor substrate by performing anisotropic wet etching on the semiconductor substrate in a region under the second openings via the second openings.

摘要翻译： 太阳能电池的制造方法包括在半导体衬底的一个表面侧形成保护膜的保护膜形成步骤，形成多个第一开口的第一处理步骤，所述第一开口具有接近期望的开口形状的形状，以及 通过具有较高处理效率的方法在保护膜中小于目标开口尺寸的尺寸;第二处理步骤，通过用相对较高处理的方法将第一开口扩大到目标开口尺寸，从而在保护膜中形成第二开口 精度和蚀刻步骤，通过经由第二开口在第二开口下方的区域中的半导体衬底上进行各向异性湿法蚀刻，在半导体衬底的一个表面侧上形成具有倒金字塔形状的凹部的凹凸结构 。

公开(公告)号：US20140339712A1

公开(公告)日：2014-11-20

申请号：US13898427

申请日：2013-05-20

申请人： QUALCOMM Incorporated

发明人： Reynante Tamunan Alvarado ,  Lizabeth Ann Keser ,  Jianwen Xu

IPC分类号： H01L23/00

CPC分类号： H01L21/561 ,  B23K26/364 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/172 ,  H01L21/31127 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/3185 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2224/03 ,  H01L2924/00

摘要： Some implementations provide a semiconductor device that includes a substrate, several metal and dielectric layers coupled to the substrate, and a pad coupled to one of the several metal layers. The semiconductor device also includes a first metal layer coupled to the pad and an under bump metallization layer coupled to the first metal redistribution layer. The semiconductor device further includes a mold layer covering a first surface of the semiconductor device and at least a side portion of the semiconductor device. In some implementations, the mold layer is an epoxy layer. In some implementations, the first surface of the semiconductor device is the top side of the semiconductor device. In some implementations, the mold layer covers the at least side portion of the semiconductor device such that a side portion of at least one of the several metal layers and dielectric layers is covered with the mold layer.

摘要翻译： 一些实施方案提供了一种半导体器件，其包括衬底，耦合到衬底的几个金属和电介质层，以及耦合到几个金属层之一的焊盘。 半导体器件还包括耦合到焊盘的第一金属层和耦合到第一金属再分配层的凸块下金属化层。 半导体器件还包括覆盖半导体器件的第一表面和至少半导体器件的侧部的模层。 在一些实施方案中，模制层是环氧树脂层。 在一些实施方案中，半导体器件的第一表面是半导体器件的顶侧。 在一些实施方案中，模具层覆盖半导体器件的至少侧面部分，使得多个金属层和电介质层中的至少一个的侧部被模具层覆盖。

公开(公告)号：US20140332512A1

公开(公告)日：2014-11-13

申请号：US14444373

申请日：2014-07-28

申请人： SIEMENS AKTIENGESELLSCHAFT

发明人： Andrea Massa ,  Andreas Oppert

IPC分类号： B23K26/38

CPC分类号： B23K26/386 ,  B23K26/388 ,  B23K26/389 ,  B23K2101/001

摘要： A process for making a hole into a substrate by at least one laser includes a first step which involves producing at least one intermediate hole with a diameter which is smaller than a final diameter of a final hole to be produced. The intermediate hole with the smaller diameter is a through-hole. The intermediate hole is produced by percussion process. The process further includes a second step which involves producing the final hole having the final diameter. The final hole is produced by machining the intermediate through-hole by a trepanning process so that the final diameter of the final hole is achieved.

摘要翻译： 通过至少一个激光器将孔制成衬底的方法包括第一步骤，其包括产生至少一个直径小于待生产的最终孔的最终直径的中间孔。 具有较小直径的中间孔是通孔。 中间孔由冲击过程产生。 该方法还包括第二步骤，其涉及生产具有最终直径的最终孔。 最终的孔是通过加工中间通孔而进行的，通过加工过程制成的，以便达到最终孔的最终直径。