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    Low temperature ceramic Microelectromechanical structures
    31.
    发明授权
    Low temperature ceramic Microelectromechanical structures 有权
    低温陶瓷微机电结构

    公开(公告)号：US08975104B2

    公开(公告)日：2015-03-10

    申请号：US14185160

    申请日：2014-02-20

    Applicant: The Royal Institution for the Advancement of Learning/McGill University

    Inventor： Mourad El-Gamal ,  Frederic Nabki ,  Paul-Vahe Cicek

    IPC: H01L21/00 ,  H01L27/14 ,  B81C1/00 ,  B81B3/00 ,  B81B7/00

    CPC classification number: B81C1/00666 ,  B81B3/0021 ,  B81B7/008 ,  B81B2201/01 ,  B81B2201/0235 ,  B81B2201/0271 ,  B81B2201/03 ,  B81B2207/015 ,  B81B2207/03 ,  B81C1/00063 ,  B81C1/00246 ,  B81C1/00396 ,  B81C1/00587 ,  B81C2201/014 ,  B81C2201/0169 ,  B81C2201/0174 ,  B81C2203/0721 ,  B81C2203/0735

    Abstract: A method of providing microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is provided. The method providing for processes and manufacturing sequences limiting the maximum exposure of an integrated circuit upon which the MEMS is manufactured to below 350° C., and potentially to below 250° C., thereby allowing direct manufacturing of the MEMS devices onto electronics, such as Si CMOS circuits. The method further providing for the provisioning of MEMS devices with multiple non-conductive structural layers such as silicon carbide separated with small lateral gaps. Such silicon carbide structures offering enhanced material properties, increased environmental and chemical resilience while also allowing novel designs to be implemented taking advantage of the non-conductive material of the structural layer. The use of silicon carbide being beneficial within the formation of MEMS elements such as motors, gears, rotors, translation drives, etc where increased hardness reduces wear of such elements during operation.

    Abstract translation: 提供了一种提供与硅CMOS电子器件兼容的微机电结构（MEMS）的方法。 该方法提供了将MEMS制造的集成电路的最大曝光限制在低于350℃并可能低于250℃的工艺和制造顺序，从而允许将MEMS器件直接制造到电子器件上，例如 作为Si CMOS电路。 该方法进一步提供具有多个非导电结构层的MEMS器件，例如用小的侧向间隙分离的碳化硅。 这种碳化硅结构提供了增强的材料性能，增加了环境和化学弹性，同时还允许利用结构层的非导电材料实现新颖的设计。 在形成MEMS元件（例如马达，齿轮，转子，平移驱动器等）中使用碳化硅是有益的，其中增加的硬度降低了操作期间这些元件的磨损。

    Magnetically actuated micro-electro-mechanical capacitor switches in laminate
    33.
    发明授权
    Magnetically actuated micro-electro-mechanical capacitor switches in laminate 有权
    磁致伸缩微电机电容开关

    公开(公告)号：US08810341B2

    公开(公告)日：2014-08-19

    申请号：US13286120

    申请日：2011-10-31

    Applicant: Mark Bachman ,  Guann-Pyng Li ,  Yang Zhang ,  Minfeng Wang ,  Sung Jun Kim

    Inventor： Mark Bachman ,  Guann-Pyng Li ,  Yang Zhang ,  Minfeng Wang ,  Sung Jun Kim

    IPC: H01H51/22 ,  H01H50/00

    CPC classification number: H01H50/005 ,  B81B2201/01 ,  B81B2203/0109 ,  H01G5/18 ,  H01H59/0009 ,  H01H2050/007 ,  Y10T29/49002

    Abstract: Magnetically actuated micro-electro-mechanical capacitor switches in laminate are disclosed. According to one embodiment, an apparatus comprises a first layer comprising a coil and magnetic element, the magnetic element made from one of nickel and iron; a second layer comprising a flexible member, wherein a permanent magnet is attached to the flexible member; a conductive plate having an insulating dielectric coating, the conductive plate attached to one of the flexible member or a magnet; and a third layer comprising a transmission line and magnetic material, wherein the transmission line comprises one or more of a signal conductor and one or more ground conductors in near proximity.

    Abstract translation: 揭示了层压板中的磁致动微电机电容器开关。 根据一个实施例，一种装置包括包括线圈和磁性元件的第一层，由镍和铁之一制成的磁性元件; 第二层，包括柔性构件，其中永磁体附接到所述柔性构件; 具有绝缘电介质涂层的导电板，所述导电板附接到所述柔性构件中的一个或磁体; 以及包括传输线和磁性材料的第三层，其中传输线包括一个或多个信号导体和一个或多个靠近的接地导体。

    MEMS relay and mehtod of fabricating the same
    36.
    发明申请
    MEMS relay and mehtod of fabricating the same 有权
    MEMS继电器及其制造方法

    公开(公告)号：US20020160583A1

    公开(公告)日：2002-10-31

    申请号：US10056009

    申请日：2002-01-28

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hoon Song

    IPC: H01L021/30

    CPC classification number: B81B7/007 ,  B81B2201/01 ,  H01H59/0009

    Abstract: A MEMS relay is provided. The MEMS relay includes a first wafer, a second wafer, and a third wafer that are sequentially stacked. The first wafer includes driving electrodes positioned at the bottom surface of the first wafer, input signal electrodes and output signal electrodes formed adjacent to each other and corresponding to the driving electrodes, via holes formed through the first wafer on the driving electrodes, the input signal electrodes, and the output signal electrodes, and metal pads formed over the via holes. The second wafer includes a body including a sealing unit used to hermetically seal the first and third wafers with the second wafer interposed therebetween, a driving unit which is formed inside and isolated from the body, is an integrated body consisting of a silicon substrate, a passivation layer formed on the silicon substrate, and contact electrodes formed on the passivation layer, and is located lower than the top surface of the body by a predetermined distance, and a connection supporter which extends from two opposing sides of the driving unit to the inner surface of the body. The third wafer includes a hollow in which the driving unit can be rotated.

    Abstract translation: 提供了MEMS继电器。 MEMS继电器包括依次层叠的第一晶片，第二晶片和第三晶片。 第一晶片包括位于第一晶片的底表面处的驱动电极，输入信号电极和彼此相邻形成并对应于驱动电极的输出信号电极，通过驱动电极上的第一晶片形成的通孔，输入信号 电极和输出信号电极以及形成在通孔上方的金属焊盘。 第二晶片包括主体，其包括用于密封第一晶片和第三晶片的密封单元，其间插入有第二晶片，形成在主体内部并与主体隔离的驱动单元是由硅基板， 形成在硅衬底上的钝化层和形成在钝化层上的接触电极，并且位于比主体的顶表面低一个预定距离处;以及连接支撑件，其从驱动单元的两个相对侧延伸到内部 身体表面。 第三晶片包括可驱动驱动单元旋转的中空部。

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