摘要:
An imaging device such as a silicon vidicon has a wafer of single crystal semiconductor material having an input sensing region and a charge storage region. A potential barrier is included within the input sensing region for controlling blooming. A passivation region is also included within the input sensing region to stabilize the atomic energy level along a first surface of the wafer. An anti-reflection layer of zinc sulfide and an anti-reflection layer of magnesium fluoride or Cryolite are sequentially deposited on the first surface of the wafer. The two anti-reflection layers form an anti-reflection region which enhances the quantum efficiency of the device in the wavelength range of 400 to 500 nanometers. Each of the layers has an optical thickness substantially equal to a quarter of the wavelength of light incident on the device. A method of forming the anti-reflection region is also disclosed.
摘要:
An image sensing device includes a wafer having a first input sensing surface region and a second charge storage surface region. A recombination layer extends along the first surface and is spaced therefrom. The method for forming the recombination layer is also disclosed.
摘要:
An imaging device such as silicon vidicon has a wafer of single crystal semiconductor material having an input sensing region and a charge storage region. A potential barrier is included for controlling the blooming within the sensing region, and a passivation layer is provided for stabilizing the blooming characteristics. A coating, preferably zirconium oxide, is deposited on the passivation layer to combine with the passivation layer to form an anti-reflection region for enhancing the quantum efficiency of the device. The anti-reflection region has an optical thickness substantially equal to an odd multiple of a quarter of a wavelength of light incident on the device.
摘要:
A camera employing a semi-conductor target positioned to be scanned by an electron beam. The target comprises a wafer of semi-conductive material of a particular conductivity type, e.g. n-type silicon. A plurality of islands separated by grooves project from the wafer on the side exposed to the electron beam. These islands are of opposite conductivity and form with the wafer rectifying junctions. On the exposed surface of each island is a metal layer which is separated from the semi-conductive material of the island by an insulating layer having an aperture therein.
摘要:
A vidicon tube target structure wherein a n-conductive signal plate has a target surface thereof provided with a p-conductive layer and an array of fine grooves extend from this layer downwardly beyond the p-conductive layer into the signal plate to define an array of mesa-like p-conducitve land areas. The peripheral groove walls are coated with an insulator material while the land areas are coated with a conductive metal. The grooves and lands are configured to provide an increased amount of utilizable effective target surface area for a scanning electron beam.
摘要:
THE SPECIFICATION DESCRIBES A TECHNIQUE FOR IMPROVING THE DIODE-ARRAY IMGAGE STORAGE TUBE DESCRIBED IN APPLICATION SER. NO. 605,715 AND NOW PAT. NO. 3,403,284. CONDUCTIVE ISLAND ARE DEPOSITED EACH DIODE TO MINIMIZE ADVERSE CHARGE STORAGE EFFECTS ON THE INSULATOR ISOLATING THE DIODES. PRECIDE REGISTRATION OF THE ISLAND ON THE DIODE REGIONS IS OBTAINED BY SELECTIVE PREFERRENTIAL DEPOSITION ON THE REALTIVELY CONDUCTIVE DIODE REGIONS. THIS CAN BE DONE BY ELECTRODEPOSITON OR ELECTROLESS PLATING.
摘要:
A semiconductor target for use in a pickup tube includes a semiconductor substrate, on one side of which is formed arrays of a plurality of depressions and which has a corresponding number of PN junctions formed along the depressions.