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108 条记录 (耗时 0.021 秒)

    Surface mounted 2-D diode laser array package
    32.
    发明授权
    Surface mounted 2-D diode laser array package 失效
    表面贴装二维二极管激光阵列封装

    公开(公告)号：US06327285B1

    公开(公告)日：2001-12-04

    申请号：US08853956

    申请日：1997-05-09

    申请人： Xinqiao Wang

    发明人： Xinqiao Wang

    IPC分类号： H01S304

    CPC分类号： H01S5/42 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02292 ,  H01S5/02469 ,  H01L2924/00014

    摘要： A two-dimensional surface mounted diode laser array package includes a one-piece multifunctional integral array member having a broad area heat sink, laser mounting stages, and interspersed angled deflecting mirrors, all fashioned of a common material. Diode laser bars are secured to the mounting stages between the angled deflecting mirrors. The broad area heat sink, laser mounting stages, and interspersed angled deflecting mirrors, being of the same substance, can be easily fashioned by conventional micro-machining techniques.

    摘要翻译： 二维表面安装的二极管激光器阵列封装包括具有广泛的散热器，激光安装台和散布的倾斜的偏转镜的一体式多功能整体阵列构件，其均为普通材料。 二极管激光棒固定在倾斜的偏转镜之间的安装台上。 通过传统的微加工技术可以容易地形成具有相同物质的广域散热器，激光安装级和散射角度偏转镜。

    Laser system using phase change material for thermal control
    33.
    发明授权
    Laser system using phase change material for thermal control 有权
    激光系统采用相变材料进行热控制

    公开(公告)号：US06307871B1

    公开(公告)日：2001-10-23

    申请号：US09270991

    申请日：1999-03-17

    申请人： Geoffrey O. Heberle

    发明人： Geoffrey O. Heberle

    IPC分类号： H01S304

    CPC分类号： F28F3/02 ,  F28D20/02 ,  F28D2021/0029 ,  F28F3/12 ,  H01S3/025 ,  H01S3/027 ,  H01S3/0405 ,  H01S3/0407 ,  H01S3/042 ,  H01S3/0941 ,  H01S5/02415 ,  H01S5/02438 ,  H01S5/02469 ,  H01S5/4025 ,  Y02E60/145

    摘要： A passively cooled solid-state laser system for producing high-output power is set forth. The system includes an optics bench assembly containing a laser head assembly which generates a high-power laser beam. A laser medium heat sink assembly is positioned in thermal communication with the laser medium for conductively dissipating waste heat and controlling the temperature of the laser medium. A diode array heat sink assembly is positioned in thermal communication with the laser diode array assembly for conductively dissipating waste heat and controlling the temperature of the laser diode array assembly. The heat sink assemblies include heat exchangers with extending surfaces in intimate contact with phase change material. When the laser system is operating, the phase change material transitions from solid to liquid phase. This transition of the phase change material also provides a thermal buffer for laser components such that the phase change material absorbs the energy associated with fluctuations in ambient temperature before transferring it to the laser component. Also, the heat sink assembly can contain more than one type of phase change material, each having a different melting temperature.

    摘要翻译： 阐述了一种用于产生高输出功率的被动冷却的固态激光系统。 该系统包括包含产生高功率激光束的激光头组件的光学台架组件。 激光介质散热器组件定位成与激光介质热连通，用于导电地耗散废热并控制激光介质的温度。 二极管阵列散热器组件定位成与激光二极管阵列组件热连通，用于导电地耗散余热并控制激光二极管阵列组件的温度。 散热器组件包括具有与相变材料紧密接触的延伸表面的热交换器。 当激光系统工作时，相变材料从固相转变为液相。 相变材料的这种转变还为激光组件提供热缓冲器，使得相变材料在将其转移到激光部件之前吸收与环境温度波动相关联的能量。 此外，散热器组件可以包含多于一种类型的相变材料，每种相变材料具有不同的熔化温度。

    Semiconductor laser devices
    34.
    发明授权
    Semiconductor laser devices 失效
    半导体激光器件

    公开(公告)号：US06301278B2

    公开(公告)日：2001-10-09

    申请号：US09119696

    申请日：1998-07-21

    申请人： Satoshi Uchida

    发明人： Satoshi Uchida

    IPC分类号： H01S304

    CPC分类号： H01S5/02212 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01S5/02276 ,  H01S5/024 ,  H01S5/02476 ,  H01S5/0425 ,  H01L2924/00014

    摘要： A semiconductor laser device has a semiconductor laser element placed inside a package on an electrically conductive submount such that one of the electrodes with one conduction type sandwiching its p-n junction is electrically connected to it. The submount is placed on a metallic heat sink, separated therefrom by a layer of an electrical insulator having a larger thermal conductivity than the submount. The other electrode of the laser element (of the opposite conduction type) is electrically connected to the heat sink, and one of externally extending lead pins is electrically connected to the submount. According to a preferred embodiment, the other electrode of the laser element is electrically connected instead to one of the lead pins and the submount is electrically connected instead to another of the lead pins. Thus, the capacitance of the submount and the inductance of the package will be in an electrically floating condition when the laser device is activated, and the device is adapted for high-frequency operations.

    摘要翻译： 半导体激光器件具有放置在导电基座上的封装内的半导体激光元件，使得夹着其p-n结的一个导电类型的电极中的一个电连接到其上。 底座放置在金属散热器上，与金属散热器隔开，通过一层具有比底座更大导热系数的电绝缘体。 激光元件（相反导电型）的另一个电极电连接到散热器，而外部延伸的引脚之一电连接到底座。 根据优选实施例，激光元件的另一个电极代替引导引脚中的一个电连接，并且该底座电连接到另一个引脚。 因此，当激光装置被激活时，底座的电容和封装的电感将处于电浮动状态，并且该装置适用于高频操作。

    High-power external-cavity optically-pumped semiconductor lasers
    35.
    发明授权
    High-power external-cavity optically-pumped semiconductor lasers 有权
    大功率外腔光泵浦半导体激光器

    公开(公告)号：US06298076B1

    公开(公告)日：2001-10-02

    申请号：US09264159

    申请日：1999-03-05

    申请人： Andrea Caprara ,  Juan L. Chilla ,  Luis A. Spinelli

    发明人： Andrea Caprara ,  Juan L. Chilla ,  Luis A. Spinelli

    IPC分类号： H01S304

    CPC分类号： H01S5/141 ,  H01S3/109 ,  H01S5/02484 ,  H01S5/041 ,  H01S5/183

    摘要： External-cavity optically-pumped semiconductor lasers (OPS-lasers) including an OPS-structure having a mirror-structure surmounted by a surface-emitting, semiconductor multilayer (periodic) gain-structure are disclosed. The gain-structure is pumped by light from diode-lasers. The OPS-lasers can provide fundamental laser output-power of about two Watts (2.0 W) or greater. Intracavity frequency-converted arrangements of the OPS-lasers can provide harmonic laser output-power of about one-hundred milliwatts (100 mW) or greater, even at wavelengths in the ultraviolet region of the electromagnetic spectrum. These high output powers can be provided even in single axial-mode operation. Particular features of the OPS-lasers include a heat sink-assembly for cooling the OPS-structure, a folded resonator concept for providing optimum beam size at optically-nonlinear crystals used for frequency conversion, preferred selection of optically-nonlinear materials for frequency-conversion, and compound resonator designs for amplifying second harmonic-radiation for subsequent conversion to third or fourth harmonic radiation.

    摘要翻译： 公开了包括具有由表面发射的半导体多层（周期）增益结构所覆盖的镜面结构的OPS结构的外腔光泵浦半导体激光器（OPS-激光器）。 增益结构由二极管激光器的光泵浦。 OPS激光器可以提供约2瓦（2.0瓦）或更大的基本激光输出功率。 OPS激光器的腔内频率转换装置即使在电磁波谱的紫外区域的波长下也能提供约百毫瓦（100mW）或更大的谐波激光输出功率。 即使在单轴向模式操作中也可以提供这些高输出功率。 OPS激光器的特征包括用于冷却OPS结构的散热器组件，用于在用于频率转换的光学非线性晶体处提供最佳光束尺寸的折叠谐振器概念，用于频率转换的光学非线性材料的优选选择 以及用于放大二次谐波辐射以用于随后转换成第三或第四谐波辐射的复合谐振器设计。

    Laser diode package with slotted lead
    36.
    发明授权
    Laser diode package with slotted lead 失效
    带开槽导线的激光二极管封装

    公开(公告)号：US06272159B1

    公开(公告)日：2001-08-07

    申请号：US09218887

    申请日：1998-12-22

    申请人： Juan Alfonso Garcia

    发明人： Juan Alfonso Garcia

    IPC分类号： H01S304

    CPC分类号： B23K20/023

    摘要： A laser diode or laser diode bar mounted on a heat sink and having an insulating layer of greater thickness also mounted on the heat sink requires a lead overlying both the insulating layer and the diode to bend downward for making electrical contact. Failures have been found to occur at the bend. The provision of a pattern of slots at the bend alleviates the problem by reducing stress there. The use of such slotted leads is disclosed for diodes or diode bars individually or in a stack arrangement.

    摘要翻译： 安装在散热器上并且具有也安装在散热器上的具有更大厚度的绝缘层的激光二极管或激光二极管条需要覆盖绝缘层和二极管的引线以向下弯曲以进行电接触。 发现故障发生在弯道处。 在弯曲处提供槽形图案通过减轻压力来缓解问题。 公开了这种开槽引线的使用，其分别或以堆叠布置用于二极管或二极管条。

    Component interconnect apparatus
    38.
    发明授权
    Component interconnect apparatus 有权
    组件互连设备

    公开(公告)号：US06826213B1

    公开(公告)日：2004-11-30

    申请号：US10044653

    申请日：2002-01-11

    申请人： Phillip J. Edwards ,  Joseph John Vandenberg

    发明人： Phillip J. Edwards ,  Joseph John Vandenberg

    IPC分类号： H01S304

    CPC分类号： G02B6/4214 ,  G02B6/4204

    摘要： Optical component mounting and interconnect apparatus includes a base formed of at least one layer of insulating material defining first and second opposed major surfaces. A plurality of vias extend through the base. The vias include a signal via and two spaced apart ground vias parallel with and on opposite sides of the signal via. The two ground vias are connected to ground to form a transmission line with the signal via. An optical component is mounted on the first major surface of the base with an electrical terminal affixed to one end of the signal via and a flex circuit is affixed to the second major surface of the base with an electrical connection to the opposite end of the signal via.

    摘要翻译： 光学部件安装和互连装置包括由限定第一和第二相对主表面的至少一层绝缘材料形成的基座。 多个通孔延伸通过基座。 通孔包括与信号通孔平行并相对侧的信号通孔和两个间隔开的接地通路。 两个接地通孔连接到地，以形成具有信号通孔的传输线。 光学部件安装在基座的第一主表面上，电端子固定在信号通孔的一端，并且柔性电路被固定到基座的第二主表面，电连接到信号的相对端 通过。