公开(公告)号：US12046466B2

公开(公告)日：2024-07-23

申请号：US17965911

申请日：2022-10-14

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun Seo ,  Hyun Yoon ,  Jungsuk Goh ,  Byeong Geun Kim ,  Yoonki Sa ,  Doyeon Kim ,  Yerim Yeon ,  Choonghyun Lee ,  Pil Kyun Heo ,  Youngje Um ,  Jaeseong Lee ,  Dongok Ahn

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02101 ,  H01L21/6715

Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.

公开(公告)号：US20240222174A1

公开(公告)日：2024-07-04

申请号：US18395570

申请日：2023-12-24

Applicant: SEMES CO., LTD.

Inventor： Seul Gi CHOI ,  Jun Hyun LIM ,  Young Jin JANG ,  Eun Jung LEE ,  Hee Jun YOUN ,  Gui Su PARK

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67712 ,  H01L21/67057 ,  H01L21/67706

Abstract: Proposed is a substrate transferring apparatus, and a liquid processing apparatus and substrate processing equipment including the same, which prevent a pattern leaning phenomenon during a substrate processing process. The substrate transferring apparatus that transfers substrates between cleaning tanks in the batch-type liquid processing apparatus includes a rail extended on a ceiling of a first cleaning tank in which a first processing liquid is stored and a second cleaning tank in which a second processing liquid is stored, a crane moving along the rail, and a vessel configured to be moved vertically by the crane. The vessel may include a first sub vessel and a second sub vessel that combine with each other to form a space for accommodating a substrate immersed in the first processing liquid.

公开(公告)号：US20240217151A1

公开(公告)日：2024-07-04

申请号：US18191961

申请日：2023-03-29

Applicant: SEMES CO., LTD.

Inventor： Chul Jin PARK

IPC: B29C45/26

CPC classification number: B29C45/261 ,  B29C45/2673 ,  B29L2023/22

Abstract: An apparatus for manufacturing a pipe includes a mold portion having an inner surface corresponding to an outer shape of the pipe, and a core portion having an outer surface corresponding to an inner shape of the pipe, wherein the mold portion includes an upper mold, a plurality of side molds, and a lower mold, and the core portion includes a plurality of corner cores corresponding to an inner corner of the pipe, and a plurality of side cores disposed between the plurality of corner cores and corresponding to an inner side surface of the pipe, wherein the lower mold is supported to move the plurality of side molds, is installed to slide the plurality of side cores, and is configured to move in a first direction to move the plurality of side molds and the plurality of side cores in a second direction, perpendicular to the first direction.

公开(公告)号：US20240217118A1

公开(公告)日：2024-07-04

申请号：US18397123

申请日：2023-12-27

Applicant: SEMES CO., LTD.

Inventor： Jaehyun LEE ,  Hyukjae SUNG ,  Kitae NOH ,  Jonghyun KIM

IPC: B25J15/00 ,  B25J11/00 ,  B25J19/00

CPC classification number: B25J15/0061 ,  B25J11/0095 ,  B25J15/0095 ,  B25J19/0091

Abstract: The gripper module includes a base plate having a length in a first direction and a width in a second direction that is substantially perpendicular to the first direction; a driver disposed on a base plate to generate a driving power; a gripper transporter disposed on the base plate so as to be connected to the driver, and coupled to the driver and a gripper configured to grip a transport target carrier to linearly transport the gripper between a gripping position and a release position in the first direction; and a vibration absorber connected to the gripper transporter to block an external shock or an external vibration from being transmitted to the gripper.

公开(公告)号：US20240217114A1

公开(公告)日：2024-07-04

申请号：US18343774

申请日：2023-06-29

Applicant: SEMES CO., LTD.

Inventor： Hee Jun YOUN ,  Jun Young CHOI

IPC: B25J11/00 ,  B25J15/00

CPC classification number: B25J11/0095 ,  B25J11/0085 ,  B25J15/0028 ,  B25J15/009

Abstract: The inventive concept provides a substrate transfer robot. The substrate transfer robot includes a fastening body; a support body protruding to a front from the fastening body, and supporting a bottom surface of the substrate if the substrate is positioned in a first posture; a gripper member coupled to the fastening body and relatively movable with respect to the support body; and a gripper driver moving the gripper member between a first position and a second position, and wherein the gripper member includes: a first gripper positioned at a side of the support body; and a second gripper positioned at another side of the support body, and wherein an alignment pin for aligning a position of the substrate is installed at the support body, and if a position at which the substrate is aligned with the support body is referred to as a reference position, the first position is a position at which the first gripper and the second gripper contact a substrate positioned at the reference position to grip the substrate, and the second position is a position at which the first gripper and the second gripper are spaced apart from the substrate positioned at the reference position, and the first posture is a posture that a top surface of the substrate is horizontal to the ground.

公开(公告)号：US12027389B2

公开(公告)日：2024-07-02

申请号：US17080581

申请日：2020-10-26

Applicant: SEMES CO., LTD.

Inventor： In Hwang Park ,  Sung Pil Kim ,  Kuk Saeng Kim ,  Kyung Min Kim

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6715 ,  H01L21/68742 ,  H01L21/68764

Abstract: A substrate processing apparatus includes a rotation unit supporting and rotating a substrate, a chemical ejection unit ejecting a chemical fluid toward the rotation unit, a chemical recovery unit disposed close to the rotation unit and collecting a chemical fluid scattered from the rotation unit, a first lifting unit coupled to the chemical recovery unit and moving upward and downward the chemical recovery unit relative to the rotation unit, and a first position correction member allowing the chemical recovery unit to be elastically supported by the first lifting unit and changing a relative position of the chemical recovery unit with respect to the lifting unit.

公开(公告)号：US20240213077A1

公开(公告)日：2024-06-27

申请号：US18069478

申请日：2022-12-21

Applicant: SEMES CO, LTD.

Inventor： Jeongcheol LEE ,  Jungheum NAM ,  Kyungmo KIM ,  Woojin CHUNG ,  Myunggeun MIN

IPC: H01L21/687 ,  H01L21/67 ,  H05F3/04

CPC classification number: H01L21/68742 ,  H01L21/67051 ,  H01L21/68764 ,  H05F3/04

Abstract: There is provided a substrate processing apparatus. The substrate processing apparatus may include a substrate supporter supporting a substrate, a processing solution feeder supplying a processing solution to the substrate, first and second recovery containers configured to recover the processing solution, a first pipe connected to the first recovery container and including an insulating material, a second pipe connected to the second recovery container and including an insulating material, a first static electricity eliminator in contact with the first pipe, a second static electricity eliminator in contact with the second pipe, and a plurality of first conductive lines connected to the first and second static electricity eliminators.

公开(公告)号：US20240213059A1

公开(公告)日：2024-06-27

申请号：US18524726

申请日：2023-11-30

Applicant: SEMES CO., LTD.

Inventor： Hee Man AHN ,  Sung Hun EOM ,  Gyeong Won SONG ,  Jae Seung YU

IPC: H01L21/67 ,  G03F7/00 ,  H01L21/673

CPC classification number: H01L21/67225 ,  G03F7/70033 ,  H01L21/67023 ,  H01L21/67098 ,  H01L21/6732

Abstract: Disclosed are a substrate processing apparatus and method in which in a heat-treatment process such as a baking process, a surrounding humidity environment may be precisely controlled based on photoresist for extreme ultraviolet (EUV) applied on the substrate. The substrate processing apparatus includes a housing having a treatment space defined therein; a support unit for supporting, thereon, a substrate received in the treatment space; and a gas supply unit configured to alternately supply a first gas and a second gas into the treatment space in response to photoresist (PR) for extreme ultraviolet (EUV) applied onto the substrate.

公开(公告)号：US20240210945A1

公开(公告)日：2024-06-27

申请号：US18376124

申请日：2023-10-03

Applicant: SEMES CO., LTD.

Inventor： Seung Chan Lee ,  Ho Young Lee ,  Wang Hyeon Son ,  Woo Sang Kwon ,  Sun Oh Kim

IPC: G05D1/02 ,  B25J9/16

CPC classification number: G05D1/0214 ,  B25J9/1653 ,  G05D1/0276

Abstract: A driving system is provided. The driving system includes: a driving apparatus performing a handling operation for handling a target object; and an auxiliary driving apparatus performing an auxiliary handling operation that assists the handling operation of the driving apparatus, wherein the driving apparatus and the auxiliary driving apparatus are interlinked using a wireless communication method to operate for the transportation and loading of the target object.

公开(公告)号：US20240207903A1

公开(公告)日：2024-06-27

申请号：US18393884

申请日：2023-12-22

Applicant: SEMES CO., LTD.

Inventor： Jongdoo Lee ,  Taejong Choi ,  Juyeon Song ,  Sangmin Lee

IPC: B08B3/04 ,  H01L21/67

CPC classification number: B08B3/04 ,  H01L21/67017

Abstract: Provided is a substrate processing apparatus including a body having a substrate treatment space therein, a fluid supply unit configured to supply a treatment fluid to the substrate treatment space, a fluid exhaust line to exhaust the treatment fluid from the substrate treatment space, a clamp body configured to surround and fix the body, a friction prevention member arranged between the body and the clamp body and configured to prevent friction between the body and the clamp body, a conductor extending along at least a portion of an outer rim of the friction prevention member, and a processor configured to detect whether the conductor has been deformed, based on an output signal that is output in response to an electrical signal applied to the conductor.