公开(公告)号：US20060175583A1

公开(公告)日：2006-08-10

申请号：US11348542

申请日：2006-02-07

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01B1/24

CPC classification number: C08J5/121 ,  B29C65/3412 ,  B29C65/3484 ,  B29C66/54 ,  B29C66/71 ,  B29C66/731 ,  B29C66/73113 ,  B29C66/7315 ,  B29C66/7392 ,  B29C66/7394 ,  B29C66/91411 ,  B29C66/919 ,  B29K2063/00 ,  B29K2067/00 ,  B29K2071/00 ,  B29K2081/06 ,  B29K2083/00 ,  B29K2101/10 ,  B29K2101/12 ,  B29K2105/0079 ,  B29K2105/16 ,  B29K2309/08 ,  B29L2031/3061 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/00 ,  B29K2067/003 ,  B29K2081/04

Abstract: A method of joining a thermoplastic material to a thermoset material, and a resultant thermoplastic-thermoset composite formed from such method are provided. At least one of the thermoplastic material and the thermoset material includes particles that melt when the thermoplastic material and the thermoset material are heated during the joining operation. The particles further produce a solid bond between the materials after the particles have solidified in the course of cooling after the joining operation.

Abstract translation: 提供了一种将热塑性材料接合到热固性材料的方法，以及由这种方法形成的所得的热塑性热固性复合材料。 热塑性材料和热固性材料中的至少一种包括当在接合操作期间热塑性材料和热固性材料被加热时熔化的颗粒。 颗粒在接合操作后的冷却过程中固化后，颗粒进一步在材料之间产生固态结合。

公开(公告)号：US07880300B2

公开(公告)日：2011-02-01

申请号：US11692530

申请日：2007-03-28

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01L23/48

CPC classification number: H01L24/12 ,  H01L23/3142 ,  H01L23/53238 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05557 ,  H01L2224/05562 ,  H01L2224/05664 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2224/48764 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05552

Abstract: A semiconductor chip (1) has a metal coating structure (2) which has on an active upper side (3) of the semiconductor chip (1) at least one lower metal layer (8) with copper or copper alloy, on which a central metal layer (9) with nickel is arranged. The metal coating structure (2) is terminated by an upper metal layer (10) of palladium and/or a precious metal. The central metal layer (9) with nickel and/or nickel phosphide has a rough interface (11) with respect to the plastic package molding compound surrounding the metal coating structure (2).

Abstract translation: 半导体芯片（1）具有在半导体芯片（1）的有源上侧（3）上具有至少一个具有铜或铜合金的下金属层（8）的金属涂层结构（2），在其上具有中心 配置有镍的金属层（9）。 金属涂层结构（2）由钯和/或贵金属的上金属层（10）封端。 具有镍和/或镍磷化物的中心金属层（9）相对于围绕金属涂层结构（2）的塑料封装模塑料具有粗糙界面（11）。

公开(公告)号：US07795727B2

公开(公告)日：2010-09-14

申请号：US11697191

申请日：2007-04-05

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler

IPC: H01L23/34

CPC classification number: H01L25/16 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/92127 ,  H01L2224/92163 ,  H01L2224/92247 ,  H01L2924/01068 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/141 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention relates to a semiconductor module comprising stacked discrete components and a method for producing the same. In one embodiment, the semiconductor module has a semiconductor chip arranged on a wiring substrate. The discrete components are arranged and wired on an intermediate carrier, which is electrically connected to the wiring substrate and/or the semiconductor chip. The wiring substrate carries the semiconductor chip, the semiconductor chip carries the intermediate carrier and the intermediate carrier carries the discrete components.

Abstract translation: 本发明涉及一种包括堆叠分立元件的半导体模块及其制造方法。 在一个实施例中，半导体模块具有布置在布线基板上的半导体芯片。 分立元件被布置和布线在与布线基板和/或半导体芯片电连接的中间载体上。 布线基板承载半导体芯片，半导体芯片承载中间载体，中间载体承载分立元件。

公开(公告)号：US07749797B2

公开(公告)日：2010-07-06

申请号：US11574861

申请日：2005-08-18

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01L21/00 ,  H01L21/48 ,  H01L31/0203 ,  H01L23/28

CPC classification number: H01L31/0203 ,  H01L23/24 ,  H01L23/49861 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/85385 ,  H01L2224/92247 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.

Abstract translation: 公开了半导体器件和方法。 在一个实施例中，半导体器件包括空腔壳体和传感器芯片。 在一个实施例中，空腔壳体具有到周围的开口。 传感器芯片的传感器区域面向所述开口。 传感器芯片与空腔外壳机械分离。 在一个实施例中，传感器芯片被嵌入到空腔壳体的空腔中的所有侧面上的橡胶弹性组合物中。

公开(公告)号：US20090026558A1

公开(公告)日：2009-01-29

申请号：US11574861

申请日：2005-08-18

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01L23/04 ,  H01L21/56

CPC classification number: H01L31/0203 ,  H01L23/24 ,  H01L23/49861 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/85385 ,  H01L2224/92247 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor sensor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.

Abstract translation: 公开了一种半导体传感器装置和方法。 在一个实施例中，半导体器件包括空腔壳体和传感器芯片。 在一个实施例中，空腔壳体具有到周围的开口。 传感器芯片的传感器区域面向所述开口。 传感器芯片与空腔外壳机械分离。 在一个实施例中，传感器芯片被嵌入到空腔壳体的空腔中的所有侧面上的橡胶弹性组合物中。

公开(公告)号：US20080224301A1

公开(公告)日：2008-09-18

申请号：US11927239

申请日：2007-10-29

Applicant: Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

Inventor： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

IPC: H01L23/04 ,  H01L21/00

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49586 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10S977/938 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic housing composition, and a chip mounting island composed of the lead material. While leaving free contact pads of the internal leads, the top sides of the chip mounting island and the internal leads are equipped with nanotubes as an anchoring layer. The plastic housing composition is arranged in the interspaces between the nanotubes arranged on the internal leads, while an adhesive composition for the semiconductor chip is arranged in the interspaces between the nanotubes arranged on the chip mounting island. The adhesive composition and the plastic housing composition fill the interspaces in a manner free of voids.

Abstract translation: 用于半导体部件的引线结构包括：用于在塑料外壳组合物外部的外部连接的外部引线，用于塑料外壳组合物内的电连接的内部引线以及由引线材料构成的芯片安装岛。 在离开内部引线的自由接触垫的同时，芯片安装岛的顶侧和内部引线配备有作为锚定层的纳米管。 塑料外壳组合物布置在布置在内部引线上的纳米管之间的间隙中，而用于半导体芯片的粘合剂组合物布置在布置在芯片安装岛上的纳米管之间的间隙中。 粘合剂组合物和塑料外壳组合物以无空隙的方式填充空隙。