公开(公告)号：US20090001251A1

公开(公告)日：2009-01-01

申请号：US11819372

申请日：2007-06-27

申请人： Pak Hong Ng ,  Shou Lung Chen ,  Chen Jung Tsai

发明人： Pak Hong Ng ,  Shou Lung Chen ,  Chen Jung Tsai

IPC分类号： G01J1/32

CPC分类号： G01J1/32 ,  G01J3/50 ,  G01J3/506 ,  G02F1/1309 ,  G02F1/133603 ,  G09G3/3413 ,  G09G3/3426 ,  G09G2310/08 ,  G09G2320/0285 ,  G09G2320/064 ,  G09G2320/0666 ,  G09G2320/0693 ,  G09G2360/144 ,  G09G2360/145 ,  H05B33/0869

摘要： Methods and apparatuses for backlight calibration are described. The apparatus 100 comprises a backlight unit 102 comprising a plurality of light sources 120, at least one photo-sensor 103 adapted to measure the light emitted by the backlight unit 102, a photo-sensor controller 112 coupled to the photo-sensor 103 for controlling the photo-sensor(s) 103, a backlight driving circuit 104 coupled to the light sources 120 for providing individual driving on each light source, a signal generator 114 coupled to the photo-sensor controller 112 and the backlight driving circuit 104 for controlling the operation timing of photo-sensors 103 and each of the light source 120 such that lighting conditions from each of the light source can be acquired, and a processing unit 111 coupled to the photo-sensor 103 and the backlight driving circuit 104 for analyzing the measurement data from the photo-sensors 103 and providing an adjustment signal to the backlight driving circuit 104 to achieve uniform lighting conditions of the backlight unit 102. Also described is a method comprising the steps of providing saved settings for backlight driver, providing a modified timing sequence to backlight driver and photo sensor 202, measuring light conditions of each individual light source or each individual group of light sources in backlight unit 203, comparing measurement data with predefined light conditions 205, calculating the adjustment required on backlight drivel to achieve desired light conditions, and saving calculated adjustment as new settings for backlight driver 207.

摘要翻译： 描述用于背光校准的方法和装置。 装置100包括背光单元102，其包括多个光源120，适于测量由背光单元102发射的光的至少一个光电传感器103，耦合到光传感器103的光传感器控制器112，用于控制 光传感器103，耦合到光源120的用于在每个光源上提供单独驱动的背光驱动电路104，耦合到光传感器控制器112的信号发生器114和用于控制光电传感器的背光驱动电路104 光传感器103的操作时间和光源120中的每一个使得可以获取来自每个光源的照明条件，以及耦合到光传感器103和背光驱动电路104的处理单元111，用于分析测量 来自光传感器103的数据，并向背光驱动电路104提供调节信号，以实现背光单元102的均匀照明条件。还描述了 方法包括以下步骤：为背光驱动器提供保存的设置，向背光驱动器和光传感器202提供经修改的定时序列，测量背光单元203中的每个单独光源或每个单独的光源组的光条件，将测量数据与预定义的 光条件205，计算背光驱动所需的调节以实现期望的光条件，并将计算出的调整值保存为背光驱动器207的新设置。

公开(公告)号：US20080122832A1

公开(公告)日：2008-05-29

申请号：US11605526

申请日：2006-11-29

申请人： Shou Lung Chen ,  Chen-Jung Tsai

发明人： Shou Lung Chen ,  Chen-Jung Tsai

IPC分类号： G09G5/00 ,  G09G5/10

CPC分类号： G09G3/32 ,  G09G3/3426 ,  G09G3/3611 ,  G09G2310/0221 ,  G09G2320/0233 ,  G09G2320/0285 ,  G09G2320/041 ,  G09G2320/0633 ,  G09G2320/0666 ,  G09G2360/145

摘要： Methods and apparatuses for image display are disclosed. There is provided an image display apparatus. The apparatus includes a plurality of display modules including display elements manufactured from different bins; a plurality of driving circuits providing different driving conditions for the display modules, at least one driving circuit for each display module; and a control circuit controlling the driving circuits to compensate each display module for variation of characteristics amongst modules of bins. The driving control circuit may include a look up table storing information about one or more characteristics of each display module.

摘要翻译： 公开了用于图像显示的方法和装置。 提供了一种图像显示装置。 该装置包括多个显示模块，包括由不同的箱体制造的显示元件; 为显示模块提供不同驱动条件的多个驱动电路，每个显示模块的至少一个驱动电路; 以及控制电路，控制驱动电路以补偿每个显示模块用于箱的模块之间的特性的变化。 驱动控制电路可以包括存储关于每个显示模块的一个或多个特性的信息的查找表。

公开(公告)号：US20070018333A1

公开(公告)日：2007-01-25

申请号：US11470870

申请日：2006-09-07

申请人： Chen-Jung TSAI ,  Jui-Chung LEE ,  Chih-Wen LIN

发明人： Chen-Jung TSAI ,  Jui-Chung LEE ,  Chih-Wen LIN

IPC分类号： H01L23/52

CPC分类号： H01L23/5389 ,  H01L23/49816 ,  H01L24/19 ,  H01L25/0652 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/18162 ,  H01L2924/00

摘要： A semiconductor packaging device comprises a carrier having at least a cavity/a slot thereon, at least a chip has a back surface and an active surface with a plurality of first bonding pads. The chip is affixed to the cavity to expose the active surface. A first insulating layer is on the active surface and the carrier comprises first plating through holes connected to first bonding pads and via the first insulating layer. A multi-layer structure on the first insulating layer comprises a plurality of conductive layout lines, second plating through holes therein, and a second insulating layer, exposed ball pads, and flip-chip pads thereon. The first plating through holes are electrically connected with the conductive layout lines, the second plating through holes, the exposed ball pads, and the flip-chip pads. The first solder balls are affixed to the ball pads.

摘要翻译： 半导体封装装置包括至少具有空腔/槽的载体，至少芯片具有后表面和具有多个第一接合焊盘的活性表面。 芯片固定在腔体上以露出活性表面。 第一绝缘层位于有源表面上，并且载体包括通过连接到第一接合焊盘并经由第一绝缘层的孔的第一电镀。 第一绝缘层上的多层结构包括多个导电布线，其中第二电镀通孔，第二绝缘层，暴露的球垫和倒装垫片。 第一电镀通孔与导电布线，第二电镀通孔，暴露的球垫和倒装芯片电连接。 第一个焊球固定在球垫上。

公开(公告)号：US20050263311A1

公开(公告)日：2005-12-01

申请号：US10856452

申请日：2004-05-28

申请人： Chen-Jung Tsai ,  Chih-Wen Lin

发明人： Chen-Jung Tsai ,  Chih-Wen Lin

IPC分类号： H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L25/10 ,  H05K5/06

CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacking structure is described that permits stacking of electrical components with no requirement for an ancillary stacking framework. Electrical components are fabricated with inner and outer lead portions that provide connection to a substrate and to other electrical components in a stack.

摘要翻译： 描述了堆叠结构，其允许电气部件的堆叠，而不需要辅助堆叠框架。 制造电气部件的内部和外部引线部分提供与基板和堆叠中的其他电气部件的连接。

公开(公告)号：US07828472B2

公开(公告)日：2010-11-09

申请号：US11901122

申请日：2007-09-14

申请人： Ying Liu ,  Danding Huang ,  Chen-Jung Tsai

发明人： Ying Liu ,  Danding Huang ,  Chen-Jung Tsai

IPC分类号： G02B5/02

CPC分类号： G02B6/001

摘要： A light guiding strip and a backlight module and display using the same are provided. The light guiding strip of the present invention includes a plurality of light reflecting surfaces and a plurality of light emergent surfaces. Each of the light reflecting surfaces has a light diffusion pattern. The light guiding strip of the present invention has the advantages of light weight, wide LED pitch, low cost, thickness and so on.

摘要翻译： 提供了一种导光条和背光模块以及使用其的显示器。 本发明的导光条包括多个光反射表面和多个光出射表面。 每个光反射表面都具有光漫射图案。 本发明的导光条具有重量轻，LED间距宽，成本低，厚度等优点。

公开(公告)号：US07462925B2

公开(公告)日：2008-12-09

申请号：US10987468

申请日：2004-11-12

申请人： Chen Jung Tsai ,  Chih Wen Lin

发明人： Chen Jung Tsai ,  Chih Wen Lin

IPC分类号： H01L23/495 ,  H01L23/02

CPC分类号： H01L23/49575 ,  H01L23/481 ,  H01L2224/16 ,  H01L2924/01057

摘要： An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

摘要翻译： 描述了一种有效的芯片堆叠结构，其包括具有两个表面的引线框架，其中每一个可以附接芯片堆叠。 可以通过将芯片有源表面放置在另一芯片的背表面上来形成芯片堆叠。 引线框架上的芯片和引线之间的电连接通过将芯片上的有效表面上的焊盘和通过芯片延伸到后表面的通孔来实现。

公开(公告)号：US20080238336A1

公开(公告)日：2008-10-02

申请号：US11693583

申请日：2007-03-29

申请人： Huajun Peng ,  Kwan Wah Ng ,  Chen-Jung Tsai

发明人： Huajun Peng ,  Kwan Wah Ng ,  Chen-Jung Tsai

IPC分类号： H05B37/02

CPC分类号： G09G3/3426 ,  G09G3/3648 ,  G09G2320/0646

摘要： A back-light arrangement for providing back-light to a display panel such as a liquid crystal video display panel, includes a plurality of light emitting devices arranged and distributed for providing back-light to the display panel, and electronic circuitry arranged for driving the plurality of light emitting devices to produce the back-light. The electronic circuitry contains a plurality of drivers, each of which is arranged to individually drive a corresponding one of the plurality of light emitting devices to emit light upon receipt of an actuating signal. A controller is arranged to multiplex an intensity signal to each one of the plurality of drivers for individually driving each one of the plurality of light emitting devices.

摘要翻译： 用于向诸如液晶视频显示面板的显示面板提供背光的背光装置包括布置和分布的用于向显示面板提供背光的多个发光器件，以及布置成用于驱动 多个发光器件产生背光。 电子电路包含多个驱动器，每个驱动器被布置成在接收到致动信号时单独驱动多个发光器件中的相应一个发光器件发光。 控制器被布置为将强度信号复用到多个驱动器中的每个驱动器，以单独驱动多个发光器件中的每一个。

公开(公告)号：US20080164823A1

公开(公告)日：2008-07-10

申请号：US11970865

申请日：2008-01-08

申请人： Danding HUANG ,  Shou Lung Chen ,  Huajun Peng ,  Ying Liu ,  Chen-Jung Tsai

发明人： Danding HUANG ,  Shou Lung Chen ,  Huajun Peng ,  Ying Liu ,  Chen-Jung Tsai

IPC分类号： H05B37/02 ,  H05B41/36

CPC分类号： H05B33/0872 ,  H05B33/086 ,  H05B33/0863 ,  H05B33/0869

摘要： The present invention provides a lighting structure having a light source, wherein the light source configures at least one WLEDs and at least one multicolored LED units to obtain a layout of the lighting structure, wherein the at least one multicolored LED units comprise combinations of red light, green light and blue light LEDs or any multicolored LED combinations that are able to mix up white light; and a driving control system for automatically providing a plurality of driving signals of the light source according to a preset first setting value or providing a plurality of driving signals of the light source according to a second setting value of user input. And according to system preset or user input, provide light source with high color gamut and low power consumption. The light source can be used in liquid crystal display devices.

摘要翻译： 本发明提供了一种具有光源的照明结构，其中光源配置至少一个WLED和至少一个多色LED单元以获得照明结构的布局，其中至少一个多色LED单元包括红光 ，绿光和蓝光LED或能够混合白光的任何多色LED组合; 以及驱动控制系统，用于根据预设的第一设定值自动提供光源的多个驱动信号，或者根据用户输入的第二设定值提供光源的多个驱动信号。 并根据系统预设或用户输入，提供高色域，低功耗的光源。 光源可用于液晶显示装置。

公开(公告)号：US07259042B2

公开(公告)日：2007-08-21

申请号：US11415532

申请日：2006-05-01

申请人： Chen Jung Tsai ,  Chih-Wen Lin

发明人： Chen Jung Tsai ,  Chih-Wen Lin

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/4951 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked image sensor package contains an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

公开(公告)号：US07102159B2

公开(公告)日：2006-09-05

申请号：US10865983

申请日：2004-06-12

申请人： Chen Jung Tsai ,  Chih-Wen Lin

发明人： Chen Jung Tsai ,  Chih-Wen Lin

IPC分类号： H01L29/04

CPC分类号： H01L31/0203 ,  H01L23/49548 ,  H01L31/024 ,  H01L31/18 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49175 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.