公开(公告)号：US07033447B2

公开(公告)日：2006-04-25

申请号：US10137782

申请日：2002-05-03

申请人： Yixing Lin ,  Brian T West ,  Shun Jackson Wu ,  Clifford C Stow ,  Senh Thach ,  Hong Wang ,  Jennifer Y Sun

发明人： Yixing Lin ,  Brian T West ,  Shun Jackson Wu ,  Clifford C Stow ,  Senh Thach ,  Hong Wang ,  Jennifer Y Sun

IPC分类号： C22C21/06

CPC分类号： C25D11/04 ,  C22C21/06 ,  C25D11/045 ,  C25D11/06 ,  C25D11/16

摘要： We have discovered that the formation of particulate inclusions at the surface of an aluminum alloy article, which inclusions interfere with a smooth transition from the alloy surface to an overlying aluminum oxide protective film, can be controlled by maintaining the content of mobile and nonmobile impurities within a specific range and controlling the particulate size and distribution of the mobile and nonmobile impurities and compounds thereof; by heat-treating the aluminum alloy at a temperature less than about 330° C.; and by creating the aluminum oxide protective film by employing a particular electrolytic process. When these factors are taken into consideration, an improved aluminum oxide protective film is obtained.

摘要翻译： 我们已经发现，通过将移动和非移动杂质的含量保持在内，在铝合金制品的表面上形成颗粒夹杂物，其中夹杂物干扰从合金表面到上覆的氧化铝保护膜的平滑过渡 特定范围并控制流动和非流动杂质及其化合物的颗粒尺寸和分布; 通过在低于约330℃的温度下对铝合金进行热处理; 并通过使用特定的电解工艺制备氧化铝保护膜。 当考虑这些因素时，获得改进的氧化铝保护膜。

公开(公告)号：US06722937B1

公开(公告)日：2004-04-20

申请号：US09628584

申请日：2000-07-31

申请人： Paul N. Ludwig ,  Theodore S. Fahlen ,  Shinji Kanagawa ,  Jennifer Y. Sun

发明人： Paul N. Ludwig ,  Theodore S. Fahlen ,  Shinji Kanagawa ,  Jennifer Y. Sun

IPC分类号： H01J926

CPC分类号： H01J9/261 ,  H01J2211/48 ,  H01J2329/867 ,  H01J2329/8675

摘要： A flat-panel display is hermetically sealed by a process in which a first plate structure (30) is positioned generally opposite a second plate structure (32) such that sealing material (34) provided over the second plate structure lies between the plate structures. In a gravitational sealing technique, the first plate structure is positioned vertically below the second plate structure. The sealing material is heated so that it moves vertically downward under gravitational influence to meet the first plate structure and seal the plate structures together. In a global-heating gap-jumping technique, the plate structures and sealing material are globally heated to cause the sealing material to jump a gap between the sealing material and the first plate structure. When the first plate structure is positioned vertically above the second plate structure, the sealing material moves vertically upward to meet the first plate structure and close the gap.

摘要翻译： 平板显示器通过其中第一板结构（30）大致相对于第二板结构（32）定位的过程而气密地密封，使得设置在第二板结构上方的密封材料（34）位于板结构之间。 在重力密封技术中，第一板结构位于第二板结构的垂直下方。 密封材料被加热，使得其在重力作用下垂直向下移动以满足第一板结构并将板结构密封在一起。 在全局加热间隙跳跃技术中，板结构和密封材料被全局加热，使得密封材料在密封材料和第一板结构之间跳跃间隙。 当第一板结构垂直地位于第二板结构上方时，密封材料垂直向上移动以满足第一板结构并闭合间隙。

公开(公告)号：US06571464B2

公开(公告)日：2003-06-03

申请号：US09844738

申请日：2001-04-26

申请人： Theodore S. Fahlen ,  Alfred S. Conte ,  Robert M. Duboc, Jr. ,  George B. Hopple ,  John K. O'Reilly ,  Vasil M. Chakarov ,  Robert L. Marion ,  Steve T. Cho ,  Robert G. Neimeyer ,  Jennifer Y. Sun ,  David L. Morris ,  Christopher J. Spindt ,  Kollengode S. Narayanan

发明人： Theodore S. Fahlen ,  Alfred S. Conte ,  Robert M. Duboc, Jr. ,  George B. Hopple ,  John K. O'Reilly ,  Vasil M. Chakarov ,  Robert L. Marion ,  Steve T. Cho ,  Robert G. Neimeyer ,  Jennifer Y. Sun ,  David L. Morris ,  Christopher J. Spindt ,  Kollengode S. Narayanan

IPC分类号： H21R4300

CPC分类号： H01J9/242 ,  H01J29/864 ,  H01J31/127 ,  H01J2329/8625 ,  H01J2329/864 ,  H01J2329/8645 ,  H01J2329/8665 ,  Y10T29/49004 ,  Y10T29/49117

摘要： Methods and structures are provided which support spacer walls in a position which facilitates installation of the spacer walls between a faceplate structure and a backplate structure of a flat panel display. In one embodiment, spacer feet are formed at opposing ends of the spacer wall. These spacer feet can be formed of materials such as ceramic, glass and/or glass frit. The spacer feet support the corresponding spacer wall on the faceplate (or backplate) structure. Tacking electrodes can be provided on the faceplate (or backplate) structure to assert an electrostatic force on the spacer feet, thereby holding the spacer feet in place during installation of the spacer wall. The spacer wall can be mechanically and/or thermally expanded prior to attaching both ends of the spacer wall to the faceplate (or backplate) structure. The spacer wall is then allowed to contract, thereby introducing tension into the spacer wall which tends to straighten any inherent waviness in the spacer wall. Alternatively, spacer clips can be clamped onto opposing ends of a spacer wall to support the spacer wall during installation. The spacer clips can provide electrical connections to face electrodes located on the spacer wall.

摘要翻译： 制造适于放置在平板显示器的面板结构（301）和背板结构（302）之间的自立间隔物（100或200）的方法必须首先提供具有一对相对表面的晶片（401） （401A和401B）和一对相对端。 分隔垫脚材料的两个杆（411和412）分别在其一个表面上或分别在两个表面上分别放置在晶片的两端附近。 间隔条（161-164）通过横向切割穿过条形并通过晶片基本同时从端到端形成。 每个间隔条然后由晶片的一部分和一对横向分离的间隔脚（111和112）组成，每个由脚的一部分组成。

公开(公告)号：US6129603A

公开(公告)日：2000-10-10

申请号：US881882

申请日：1997-06-24

申请人： Jennifer Y. Sun ,  Yutao Ma

发明人： Jennifer Y. Sun ,  Yutao Ma

IPC分类号： G09F9/00 ,  H01J5/24 ,  H01J9/26 ,  H01J9/40 ,  H01J29/86 ,  H01J31/12

CPC分类号： H01J9/261 ,  H01J2329/00

摘要： A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a sealed interior region formed by heating a low temperature glass frit in a vacuum. The low temperature glass frit is placed between a faceplate and a backplate. The low temperature glass frit is heated such that it melts, forming a sealed interior region between the faceplate and the backplate which is hermetically sealed. The low temperature glass frit allows for melting of the glass frit at a temperature lower than that of prior art processes. The resulting sealed interior region is in a vacuum. Therefore, evacuation tubes are not required and process steps associated with evacuation through an evacuation tube are eliminated.

摘要翻译： 平板显示器和平板显示器的形成方法。 在一个实施例中，平板显示器包括通过在真空中加热低温玻璃料而形成的密封内部区域。 低温玻璃料置于面板和背板之间。 加热低温玻璃料，使其熔化，形成在密封的面板和密封的背板之间的密封的内部区域。 低温玻璃料允许在比现有技术方法低的温度下熔化玻璃料。 所得密封的内部区域处于真空状态。 因此，不需要排气管，并且消除了通过排气管抽真空的工艺步骤。

公开(公告)号：US09281226B2

公开(公告)日：2016-03-08

申请号：US13766208

申请日：2013-02-13

申请人： Konstantin Makhratchev ,  Jennifer Y. Sun

发明人： Konstantin Makhratchev ,  Jennifer Y. Sun

IPC分类号： B23K10/00 ,  H01L21/683 ,  H01R43/16 ,  H01L21/67

CPC分类号： H01L21/6833 ,  B23K10/00 ,  H01L21/67103 ,  H01R43/16 ,  Y10T29/49204

摘要： Embodiments of the invention generally relate to an electrostatic chuck having reduced power loss, and methods and apparatus for reducing power loss in an electrostatic chuck, as well as methods for testing and manufacture thereof. In one embodiment, an electrostatic chuck is provided. The electrostatic chuck includes a conductive base, and a ceramic body disposed on the conductive base, the ceramic body comprising an electrode and one or more heating elements embedded therein, wherein the ceramic body comprises a dissipation factor of about 0.11 to about 0.16 and a capacitance of about 750 picoFarads to about 950 picoFarads between the electrode and the one or more heating elements.

摘要翻译： 本发明的实施例一般涉及具有降低的功率损耗的静电卡盘，以及用于减少静电卡盘中的功率损耗的方法和装置，以及用于其的测试和制造方法。 在一个实施例中，提供静电卡盘。 静电卡盘包括导电基体和布置在导电基底上的陶瓷体，陶瓷体包括电极和嵌入其中的一个或多个加热元件，其中陶瓷体包括约0.11至约0.16的损耗因数和电容 在电极和一个或多个加热元件之间约750皮微米至约950皮克级。

公开(公告)号：US20150143677A1

公开(公告)日：2015-05-28

申请号：US13998723

申请日：2013-11-26

申请人： Jennifer Y. Sun ,  Ren-Guan Duan ,  Jie Yuan ,  Li Xu ,  Kenneth S. Collins

发明人： Jennifer Y. Sun ,  Ren-Guan Duan ,  Jie Yuan ,  Li Xu ,  Kenneth S. Collins

IPC分类号： H01L21/67

CPC分类号： H01L21/67011 ,  C04B35/486 ,  C04B35/505 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/77 ,  C04B2235/785 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2235/9669 ,  Y10T29/41

摘要： A solid solution-comprising ceramic article useful in semiconductor processing, which article may be in the form of a solid, bulk ceramic, or may be in the form of a substrate having a ceramic coating of the same composition as the bulk ceramic material on at least one outer surface. The ceramic article is resistant to erosion by halogen-containing plasmas and provides advantageous mechanical properties. The solid solution-comprising ceramic article is formed from a combination of yttrium oxide and zirconium oxide. The ceramic-comprising article includes ceramic which is formed from zirconium oxide at a molar concentration ranging from about 96 mole % to about 91 mole %, and yttrium oxide at a molar concentration ranging from about 4 mole % to about 9 mole %.

摘要翻译： 一种可用于半导体加工的固体溶液陶瓷制品，该制品可以是固体，本体陶瓷的形式，或者可以是具有与在其上的块状陶瓷材料相同组成的陶瓷涂层的基材形式 至少一个外表面。 陶瓷制品耐受含卤素等离子体侵蚀，并提供有利的机械性能。 含固溶体的陶瓷制品由氧化钇和氧化锆的组合形成。 包含陶瓷的制品包括由摩尔浓度为约96摩尔％至约91摩尔％的氧化锆形成的陶瓷和摩尔浓度为约4摩尔％至约9摩尔％的氧化钇。

公开(公告)号：US08858745B2

公开(公告)日：2014-10-14

申请号：US12291747

申请日：2008-11-12

申请人： Jennifer Y. Sun ,  Ren-Guan Duan ,  Kenneth S. Collins

发明人： Jennifer Y. Sun ,  Ren-Guan Duan ,  Kenneth S. Collins

IPC分类号： C03B29/00 ,  C04B37/00 ,  C03C3/247 ,  C03C3/32 ,  C04B35/119 ,  C03C8/24 ,  B32B17/06 ,  C04B9/02 ,  H01L21/67

CPC分类号： C03C10/16 ,  C03C3/247 ,  C03C3/325 ,  C03C8/24 ,  C03C2204/00 ,  C04B35/119 ,  C04B37/005 ,  C04B2235/3201 ,  C04B2235/3206 ,  C04B2235/3225 ,  C04B2235/445 ,  C04B2235/5445 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/80 ,  C04B2237/06 ,  C04B2237/064 ,  C04B2237/08 ,  C04B2237/10 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/60 ,  C04B2237/708 ,  C04B2237/72 ,  H01L21/6719

摘要： Embodiments of the invention relate to component structures which are useful as apparatus in plasma processing chambers. Portions of the component structures are bonded together using oxyfluoride-comprising glazes, glass ceramics, and combinations thereof. The bonding material is resistant to halogen-containing plasmas and exhibits desirable mechanical properties.

摘要翻译： 本发明的实施例涉及可用作等离子体处理室中的装置的部件结构。 使用含氟氟化物的釉料，玻璃陶瓷及其组合将部件结构的部分粘结在一起。 粘合材料对含卤素等离子体具有耐受性，并且具有所需的机械性能。

公开(公告)号：US20130344285A1

公开(公告)日：2013-12-26

申请号：US13988656

申请日：2011-11-07

申请人： Jennifer Y. Sun ,  Sumanth Banda

发明人： Jennifer Y. Sun ,  Sumanth Banda

IPC分类号： B32B7/12 ,  H01L21/02 ,  B32B9/00 ,  B32B3/26 ,  B32B9/04

CPC分类号： B32B7/12 ,  B32B3/266 ,  B32B9/005 ,  B32B9/041 ,  C09J183/00 ,  H01L21/02 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/6831 ,  Y10T428/24322 ,  Y10T428/31663

摘要： Embodiments of the invention provide a robust bonding material suitable for joining semiconductor processing chamber components. Other embodiments provide semiconductor processing chamber components joined using an adhesive material with desired characteristics. In one embodiment, an adhesive material suitable for joining semiconductor chamber components includes an adhesive material having a Young's-modulus lower than 300 psi. In another embodiment, a semiconductor chamber component includes a first surface disposed adjacent a second surface, and an adhesive material coupling the first and second surfaces, wherein the adhesive material has a Young's modulus lower than 300 psi.

摘要翻译： 本发明的实施例提供了适用于接合半导体处理室部件的坚固的接合材料。 其他实施例提供使用具有期望特性的粘合剂材料连接的半导体处理室部件。 在一个实施例中，适于接合半导体室部件的粘合剂材料包括具有低于300psi的杨氏模量的粘合剂材料。 在另一个实施例中，半导体室部件包括邻近第二表面设置的第一表面和连接第一和第二表面的粘合材料，其中粘合材料具有低于300psi的杨氏模量。

公开(公告)号：US20130224498A1

公开(公告)日：2013-08-29

申请号：US13986040

申请日：2013-03-25

申请人： Jennifer Y. Sun ,  Ren-Guan Duan ,  Jie Yuan ,  Li Xu ,  Kenneth S. Collins

发明人： Jennifer Y. Sun ,  Ren-Guan Duan ,  Jie Yuan ,  Li Xu ,  Kenneth S. Collins

IPC分类号： C04B35/505

CPC分类号： C04B35/505 ,  B32B18/00 ,  C04B35/486 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3224 ,  C04B2235/3229 ,  C04B2235/3244 ,  C04B2235/6582 ,  C04B2235/668 ,  C04B2235/762 ,  C04B2235/80 ,  C04B2235/9669 ,  H01J37/32467 ,  H01J37/32504 ,  Y10T428/31678

摘要： A solid solution-comprising ceramic article useful in semiconductor processing, which is resistant to erosion by halogen-containing plasmas. The solid solution-comprising ceramic article is formed from a combination of yttrium oxide, zirconium oxide, and aluminum oxide. In a first embodiment, the solid solution-comprising ceramic article is a solid, sintered body of the solid solution ceramic material. In a second embodiment, the solid solution-comprising article comprises a substrate underlying a solid solution-comprising coating.

公开(公告)号：US20120118510A1

公开(公告)日：2012-05-17

申请号：US13294012

申请日：2011-11-10

申请人： Sumanth Banda ,  Jennifer Y. Sun

发明人： Sumanth Banda ,  Jennifer Y. Sun

IPC分类号： B32B38/10

CPC分类号： B32B38/10 ,  B32B2457/00 ,  H01J37/32082 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/68785 ,  Y10T156/1116 ,  Y10T156/1168

摘要： Embodiments of the invention provide a method for debonding chamber component used in a semiconductor processing chamber. In one embodiment, a method for debonding chamber components used in a semiconductor processing chamber includes providing a first chamber component and a second chamber component bonded by an adhesive material disposed at an interface defined between the first and the second chamber components, soaking the bonded first and the second chamber components into an organic solution for between about 8 hours to about 240 hours, and removing the bonded first and the second chamber from the organic solution; and mechanically separating the soaked first and the second chamber components.

摘要翻译： 本发明的实施例提供一种用于半导体处理室中使用的室分离方法。 在一个实施例中，用于在半导体处理室中使用的用于脱离室组件的方法包括提供第一室部件和第二室部件，第一室部件和第二室部件通过布置在第一和第二室部件之间的界面处的粘合剂材料粘合， 并将第二室分成有机溶液约8小时至约240小时，并从有机溶液中除去粘合的第一和第二室; 并机械地分离浸渍的第一和第二室组分。