公开(公告)号：US20020185549A1

公开(公告)日：2002-12-12

申请号：US10205776

申请日：2002-07-26

Applicant: Semitool, Inc.

Inventor： Kert Dolechek

IPC: A01G027/00 ,  B08B003/04

CPC classification number: H01L21/6708 ,  H01L21/67075 ,  H01L21/67253 ,  Y10S134/902

Abstract: A semiconductor processing system has a liquid chemical metering and delivery system including a process tank and a metering vessel. Fluid level detectors detect the fluid level in the process tank and metering vessel. A two stage fill valve fills the metering vessel from bottom to top. A dispense valve dispenses the metered contents of the vessel into a process tank via gravity, to form a chemical solution in the process tank, with high mixing accuracy. The volumes of the metering vessel and process tank and the inflow and outflow rates are set to provide 100% up time to a process chamber which uses the chemical solution to process semiconductor wafers or other flat media.

Abstract translation: 半导体处理系统具有包括处理罐和计量容器的液体化学计量和输送系统。 液位检测器检测工艺罐和计量容器中的液位。 两级填充阀从底部到顶部填充计量容器。 分配阀通过重力将容器的计量内容物分配到处理罐中，以高混合精度在处理罐中形成化学溶液。 计量容器和处理罐的体积以及流入和流出速率被设定为使用化学溶液处理半导体晶片或其它平坦介质的处理室提供100％的上升时间。

公开(公告)号：US20020168863A1

公开(公告)日：2002-11-14

申请号：US10184141

申请日：2002-06-26

Applicant: Semitool, Inc.

Inventor： Brian Aegerter ,  Curt T. Dundas ,  Michael Jolley ,  Tom L. Ritzdorf ,  Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H01L21/67017 ,  C23F1/18 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S438/928 ,  Y10S438/963

Abstract: In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

公开(公告)号：US20020164232A1

公开(公告)日：2002-11-07

申请号：US10180793

申请日：2002-06-25

Applicant: Semitool, Inc.

Inventor： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

IPC: B65G001/10

CPC classification number: H01L21/67754 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67313 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S414/137 ,  Y10S414/139

Abstract: A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism that is adapted to seal with a pod disposed in the interface section. The article insertion mechanism is disposed to allow insertion of the articles into the pod after processing by the at least one processing station. The article insertion mechanism allows the insertion of the articles without exposing the articles to ambient atmospheric conditions in the interface section.

Abstract translation: 阐述了一种用于在基本上清洁的气氛中处理诸如半导体晶片的制品的处理器。 处理器包括限定基本封闭的清洁处理室的外壳和设置在处理室中的至少一个处理站。 接口部分设置在外壳的接口端附近。 接口部分包括至少一个接口端口，通过该至少一个接口端口将包含用于处理的物品的容器装载或者从处理器卸载。 接口部分与处理室卫生地分开，因为界面部分通常不像高度卫生的处理室那么干净。 采用适于与荚密封的物品提取机构。 该机构被设置为允许将容纳在容器内的物品提取到处理室中，而不会使物品暴露于接口部分中的环境大气条件。 物品处理器还优选地包括物品插入机构，其适于与设置在界面部分中的容器密封。 物品插入机构设置成允许在由至少一个处理站处理之后将物品插入容器中。 物品插入机构允许物品的插入，而不会使物品暴露在界面部分中的环境大气条件下。

公开(公告)号：US6440178B2

公开(公告)日：2002-08-27

申请号：US81019201

申请日：2001-03-16

Applicant: SEMITOOL INC

Inventor： BERNER ROBERT W ,  WOODRUFF DANIEL J ,  SCHMIDT WAYNE J ,  COYLE KEVIN W ,  ZILA VLADIMIR ,  LUND WORM

IPC: H01L21/677 ,  B65G49/07 ,  C25D7/12 ,  H01L21/00 ,  H01L21/64

CPC classification number: H01L21/67173 ,  C25D7/12 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  Y10S414/141 ,  Y10T29/40 ,  Y10T29/41

Abstract: The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

公开(公告)号：US20020095816A1

公开(公告)日：2002-07-25

申请号：US10101045

申请日：2002-03-18

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman ,  Ian Sharp ,  Craig P. Meuchel ,  H. Frederick Woods

IPC: F26B021/06 ,  F26B005/04 ,  F26B003/00

CPC classification number: H01L21/67034 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67772 ,  H01L21/67775

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract translation: 用于半导体晶片的高压干燥的系统包括将晶片插入开放容器中，将晶片浸入液体中，对容器进行加压密封，用惰性气体加压容器，然后控制 使用从保持在气 - 液界面正下方的深度提取水的可移动排水来排出液体。 此后，可以在容器中降低压力，并且可以除去干燥和干净的晶片。 高压抑制液体的沸点，从而允许使用较高的温度来优化反应性。 超声波与加压流体一起使用，以提高清洁性能。 超临界物质设置在含有晶片的密封容器中以促进清洗和其它处理。

公开(公告)号：US20020066464A1

公开(公告)日：2002-06-06

申请号：US10051860

申请日：2002-01-16

Applicant: Semitool, Inc.

Inventor： Eric Bergman

IPC: B08B003/12

CPC classification number: H01L21/02054 ,  B08B3/02 ,  B08B3/08 ,  B08B7/00 ,  B08B2203/005 ,  B08B2230/01 ,  H01L21/02052 ,  H01L21/6704

Abstract: An apparatus for processing a semi-conductor wafer or similar workpiece has one or more liquid outlets for applying a heated process liquid to the wafer within a process chamber. Ozone gas is provided into the chamber directly, or via the processed liquid. Sonic energy is introduced to the workpiece through a layer of liquid. In an alternative design, the wafers are immersed in heated process liquid, and an ozone atmosphere is provided above the liquid. The wafers are then lifted out of the liquid, or the liquid is alternatively drained off. The ozone gas/liquid interface passes down across the surfaces of the wafers.

Abstract translation: 用于处理半导体晶片或类似工件的设备具有一个或多个液体出口，用于将加热的处理液体施加到处理室内的晶片。 臭氧气体直接或通过处理液体被提供到室内。 声能通过一层液体引入工件。 在替代设计中，将晶片浸入加热的工艺液体中，并且在液体上方设置臭氧气氛。 然后将晶片从液体中提出，或者液体被排出。 臭氧气体/液体界面穿过晶片的表面。

公开(公告)号：US20010048874A1

公开(公告)日：2001-12-06

申请号：US09372366

申请日：1999-08-11

Applicant: Semitool, Inc.

Inventor： JEFFRY A. DAVIS

IPC: B65G065/00

CPC classification number: B24B37/34 ,  B24B37/345 ,  B24B41/005 ,  H01L21/67769 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S294/902

Abstract: A workpiece support and an apparatus including such a workpiece support are set forth. The workpiece support includes a set of grooved members for supporting a series of workpieces. The workpieces may be similarly shaped, e.g. circular or rectangular, and similarly sized, each having a front face and a back face. An outer perimeter of each workpiece may be beveled at both faces, beveled at one face, unbeveled, convex, or concave. Each grooved member has a series of similar grooves. Being adapted to receive such a workpiece, each groove has a bearing wall and a wedging wall shaped and oriented so that a line normal to the wedging wall intersects but is not normal to the bearing wall. For many applications, two grooved members are employed, which are parallel to one another, spaced from one another, and oriented so that the grooves of the grooved members are generally aligned. To this end, a first grooved member is oriented so that the front faces of the received workpieces bear against the bearing walls of the grooves of the first grooved member and so that the received workpieces touch the wedging walls of the grooves of the first grooved member. A second grooved member is oriented so that the back faces of the received workpieces bear against the bearing walls of the grooves of the second grooved member and so that the received workpieces touch the wedging walls of the grooves of the second grooved member. Thus, the workpieces received by the grooves of the grooved members are wedged so as not to tip, shake, or wobble.

Abstract translation: 阐述了工件支撑件和包括这种工件支撑件的装置。 工件支撑件包括一组用于支撑一系列工件的开槽部件。 工件可以类似地成形，例如。 圆形或矩形，并且类似尺寸，每个具有前表面和后表面。 每个工件的外周边可以在两个表面上倾斜，在一个表面上倾斜，未凸出，凸出或凹入。 每个带槽构件具有一系列类似的凹槽。 为了接收这样的工件，每个凹槽具有一个轴承壁和楔形壁的形状和取向，使得垂直于楔形壁的线与轴承壁相交但不垂直。 对于许多应用，采用两个彼此平行的沟槽构件，彼此间隔开并定向成使得凹槽构件的凹槽大致对齐。 为此，第一凹槽构件被定向成使得所接收的工件的前表面抵靠第一凹槽构件的凹槽的轴承壁，并且使得所接收的工件接触第一凹槽构件的凹槽的楔形壁 。 第二槽构件被定向成使得所接收的工件的背面抵靠第二槽构件的槽的支承壁，并且使得所接收的工件接触第二槽构件的槽的楔形壁。 因此，由凹槽构件的凹槽容纳的工件楔入，以便不会尖，摇晃或摆动。

公开(公告)号：US20010032660A1

公开(公告)日：2001-10-25

申请号：US09881246

申请日：2001-06-12

Applicant: SEMITOOL, INC.

Inventor： Gary L. Curtis ,  Raymon F. Thompson

IPC: B08B003/02

CPC classification number: H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67075 ,  H01L21/6708 ,  Y10S134/902

Abstract: In a method for rinsing and drying a semiconductor workpiece in a micro-environment, the workpiece is placed into a rinser/dryer housing. The rinser/dryer housing is rotated by a rotor motor. The rinser/dryer housing defines a substantially closed rinser/dryer chamber. Rinsing and drying fluids are distributed across at least one face of the semiconductor workpiece by the action of centrifugal force generated during rotation of the housing. A fluid supply system is connected to sequentially supply a rinsing fluid followed by a drying fluid to the chamber as the housing is rotated.

Abstract translation: 在微环境中冲洗和干燥半导体工件的方法中，将工件放置在冲洗机/干燥器壳体中。 洗衣机/烘干机壳体由转子电动机旋转。 洗衣机/干燥器壳体限定了基本封闭的冲洗机/干燥器室。 冲洗和干燥流体通过壳体旋转期间产生的离心力的作用分布在半导体工件的至少一个表面上。 液体供应系统被连接以在壳体旋转时依次供应冲洗流体，然后将干燥流体提供给腔室。

公开(公告)号：US20010017146A1

公开(公告)日：2001-08-30

申请号：US09741615

申请日：2000-12-19

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman

IPC: B08B003/04

CPC classification number: H01L21/67034 ,  Y10S134/902

Abstract: A process and apparatus for drying semiconductor wafers, includes the controlled-rate extraction of a wafer immersed in rinsing liquid, irradiation of the wafer using high intensity lights or filaments along the wafer-liquid interface, and delivery of gas streams against the wafer along the wafer-liquid interface using a gas delivery system. Heating is controlled to create a temperature gradient without evaporating rinsing fluid adhering to surfaces of the wafer. Heating by the radiation sources creates a temperature gradient in the wafer in the irradiated region that simultaneously generates a surface tension gradient in the water adhering to the wafer. The gas delivery system removes the bulk of the water adhering to the wafer surface, and also suppresses the height of the rinsing liquid adhering to the wafer, providing faster extraction of dry and highly clean wafers from the rinsing liquid. A solvent vapor is optionally injected at the wafer-liquid interface, to reduce adhesion of the liquid to the vapor.

Abstract translation: 用于干燥半导体晶片的工艺和设备包括浸入冲洗液中的晶片的受控速率提取，沿着晶片 - 液界面使用高强度光或细丝照射晶片，以及沿着晶片 - 液体界面向晶片输送气流 使用气体输送系统的晶片 - 液体界面。 控制加热以产生温度梯度，而不会蒸发粘附到晶片表面的冲洗流体。 通过辐射源的加热在照射区域中的晶片中产生温度梯度，同时在附着于晶片的水中产生表面张力梯度。 气体输送系统除去附着在晶片表面上的大部分水，并且还抑制了附着在晶片上的冲洗液体的高度，从冲洗液体中更快地提取干燥且高度干净的晶片。 任选地在晶片 - 液体界面处注入溶剂蒸气，以减少液体对蒸气的粘附。

公开(公告)号：US20040221877A1

公开(公告)日：2004-11-11

申请号：US10870173

申请日：2004-06-18

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman

IPC: B08B003/00

CPC classification number: H01L21/02054 ,  B08B3/00 ,  B08B3/02 ,  B08B3/044 ,  B08B3/08 ,  B08B7/00 ,  B08B2203/005 ,  B08B2203/007 ,  B08B2203/0288 ,  B08B2230/01 ,  H01L21/02052 ,  H01L21/67017 ,  H01L21/6704 ,  H01L21/67051 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/3426 ,  Y02P70/613 ,  Y10S134/902 ,  H01L2924/00

Abstract: In a method and apparatus for cleaning or processing a workpiece, a process gas is brought into contact with the workpiece by diffusion through a heated liquid layer on the workpiece, and by bulk transport achieved by entraining the gas in a liquid stream, spray or jet impinging on the workpiece. The process gas, which may be ozone, is entrained in the liquid via entrainment nozzles. Use of entrainment and diffusion together increases the amount of gas available for reaction at the workpiece surface, increases the reaction rate, and decreases required process times.

Abstract translation: 在用于清洁或处理工件的方法和装置中，工艺气体通过扩散通过工件上的加热液体层与工件接触，并且通过将气体夹带在液体流中，喷射或射流 撞击工件。 可能是臭氧的工艺气体通过夹带喷嘴夹带在液体中。 夹带和扩散的使用一起增加了可在工件表面反应的气体的量，增加了反应速率，并减少了所需的处理时间。