公开(公告)号：US20120161630A1

公开(公告)日：2012-06-28

申请号：US13393084

申请日：2011-02-10

申请人： Masahiro Miki ,  Takaari Uemoto ,  Hideo Nagai

发明人： Masahiro Miki ,  Takaari Uemoto ,  Hideo Nagai

IPC分类号： H01J7/44

CPC分类号： F21V23/009 ,  F21K9/232 ,  F21K9/238 ,  F21V3/00 ,  F21V23/006 ,  F21V29/713 ,  F21V29/773 ,  F21V29/83 ,  F21V29/87 ,  F21Y2105/16 ,  F21Y2115/10

摘要： A lamp capable of effectively suppressing increase in the temperature of circuit devices is provided. The lamp includes: an LED module composed of LED chips; a base through which electric power is received; a lighting circuit which includes a circuit device group for generating electric power for causing the LED module to emit light using the electric power received through the base; an inner casing which is a tubular portion made of resin for housing the lighting circuit; and an outer casing which is a tubular portion for housing the inner casing. On the circumferential surface of the inner casing, a protrusion is provided which directly abuts the inner circumferential surface of the outer casing.

摘要翻译： 提供了能够有效地抑制电路装置的温度升高的灯。 该灯包括：由LED芯片组成的LED模块; 接收电力的基座; 照明电路，其包括用于使用通过所述基座接收的电力使所述LED模块发光的发电电路的电路装置组; 内壳，其是用于容纳所述照明电路的由树脂制成的管状部分; 以及作为容纳内壳的筒状部的外壳。 在内壳的圆周面上设置有直接邻接外壳的内周面的突起。

公开(公告)号：USD646811S1

公开(公告)日：2011-10-11

申请号：US29390153

申请日：2011-04-20

申请人： Nobuyoshi Takeuchi ,  Tsugihiro Matsuda ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto

设计人： Nobuyoshi Takeuchi ,  Tsugihiro Matsuda ,  Hideo Nagai ,  Masahiro Miki ,  Takaari Uemoto

公开(公告)号：US08022420B2

公开(公告)日：2011-09-20

申请号：US12695076

申请日：2010-01-27

申请人： Hideo Nagai

发明人： Hideo Nagai

IPC分类号： H01L29/18

CPC分类号： H01L25/0753 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/38 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor light emitting device (10) is provided with a base substrate (12) and three LED chips (14A, 14B, and 14C) disposed on the base substrate (12). Each LED chip (14A, 14B, and 14C) includes a semiconductor multilayer structure (20) and has a rhombus shape with interior angles of approximately 60° and approximately 120° in plan view. Each semiconductor multilayer structure (20) has an HCP single crystal structure and includes a light emission layer (24). The LED chips (14A, 14B, and 14C) are arranged on the base substrate (12) so as to face one another at a vertex forming the larger interior angle in plan view. With this arrangement, the LED chips (14A, 14B, and 14C) as a whole form a substantially regular hexagonal shape.

摘要翻译： 半导体发光器件（10）设置有基底（12）和设置在基底（12）上的三个LED芯片（14A，14B和14C）。 每个LED芯片（14A，14B和14C）包括半导体多层结构（20），并且在平面图中具有约60°和约120°的内角的菱形。 每个半导体多层结构（20）具有HCP单晶结构并且包括发光层（24）。 LED芯片（14A，14B，14C）以平面图形成较大内角的顶点彼此相对配置在基底基板（12）上。 利用这种布置，LED芯片（14A，14B和14C）整体形成基本上规则的六边形形状。

公开(公告)号：US20110090696A1

公开(公告)日：2011-04-21

申请号：US12867216

申请日：2009-03-16

申请人： Hideo Nagai ,  Yasuharu Ueno

发明人： Hideo Nagai ,  Yasuharu Ueno

IPC分类号： F21V9/00

CPC分类号： H01L33/505 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2933/0083 ,  H01L2933/0091 ,  H01L2924/00014

摘要： A blue LED 18 that is a semiconductor light-emitting device and that emits blue light as primary light having a peak wavelength in a visible region and a phosphor plate 30 that is a wavelength converter and that converts a portion of the blue light emitted from the blue LED 18 into yellow light as secondary light having a longer peak wavelength in the visible region than the peak wavelength and emits the yellow light in combination with a remainder of the blue light left unconverted. The phosphor plate 30 includes (a) a main body 39 extending across a light-emission path of the blue LED 18 and (b) a light-emitting part 42 composed of a plurality of columnar protrusions 44 on a part of the main body 39 in a direction in which the light exits.

摘要翻译： 作为半导体发光装置的蓝色LED18，其发出蓝色光，作为在可见光区域具有峰值波长的初级光和作为波长转换器的荧光体板30，并将从该光源发出的蓝色光的一部分 蓝色LED18变成黄色光，作为在可见光区域中比峰值波长具有更长的峰值波长的二次光，并且与剩余的未转换的蓝色光一起发射黄色光。 荧光体板30包括：（a）延伸穿过蓝色LED18的发光路径的主体39，以及（b）由主体39的一部分上的多个柱状突起44构成的发光部42 在光出射的方向上。

公开(公告)号：US07910940B2

公开(公告)日：2011-03-22

申请号：US11995924

申请日：2006-07-27

申请人： Susumu Koike ,  Masaaki Suzuki ,  Tadaaki Ikeda ,  Hideo Nagai

发明人： Susumu Koike ,  Masaaki Suzuki ,  Tadaaki Ikeda ,  Hideo Nagai

IPC分类号： H01L21/00

CPC分类号： H01L33/56 ,  H01L33/501 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor light-emitting device 10 has a semiconductor chip 12 for emitting light having a wavelength in blue to ultraviolet regions, and a sealing portion 16 formed in at least a partial region on a passage path on which the light is passed. The sealing portion 16 includes a sealing material 16d which is a composite material including a matrix material 16a made of a resin, nano-particles 16b made of an inorganic material which are distributed in the matrix material 16a, the nano-particle 16b having an effective particle size which is ¼ or less of the wavelength of the light in the matrix material 16a, and a fluorescent material 16c.

摘要翻译： 半导体发光装置10具有用于发射蓝色至紫外区域的波长的光的半导体芯片12，以及形成在通过光的通路上的至少一部分区域的密封部16。 密封部16包括作为复合材料的密封材料16d，该复合材料包括由树脂制成的基体材料16a，分布在基体材料16a中的由无机材料制成的纳米粒子16b，具有有效的纳米粒子16b 基体材料16a中的光的波长为1/4以下的粒径，以及荧光体16c。

公开(公告)号：US07872280B2

公开(公告)日：2011-01-18

申请号：US12361396

申请日：2009-01-28

申请人： Hideo Nagai

发明人： Hideo Nagai

IPC分类号： H01L33/00

CPC分类号： H01L27/156 ,  H01L23/16 ,  H01L25/0753 ,  H01L33/20 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00

摘要： The present invention aims to provide a semiconductor light emitting device that may be firmly attached to a substrate with maintaining excellent light emitting efficiency, and a manufacturing method of the same, and a lighting apparatus and a display apparatus using the same.In order to achieve the above object, the semiconductor light emitting device according to the present invention includes a luminous layer, a light transmission layer disposed over a main surface of the luminous layer, and having depressions on a surface facing away from the luminous layer, and a transmission membrane disposed on the light transmission layer so as to follow contours of the depressions, and light from the luminous layer is irradiated so as to pass through the light transmission layer and the transmission membrane.

摘要翻译： 本发明的目的在于提供一种能够以保持良好的发光效率牢固地附着到基板的半导体发光器件及其制造方法，以及使用该半导体发光器件的照明装置和显示装置。 为了实现上述目的，根据本发明的半导体发光器件包括发光层，设置在发光层的主表面上的透光层，并且在背离发光层的表面上具有凹陷， 以及设置在光透射层上以便跟随凹陷的轮廓的透射膜，并且照射来自发光层的光以穿过透光层和透射膜。

公开(公告)号：US07745985B2

公开(公告)日：2010-06-29

申请号：US11995290

申请日：2006-10-27

申请人： Noriyasu Tanimoto ,  Hideo Nagai ,  Yoshirou Tooya

发明人： Noriyasu Tanimoto ,  Hideo Nagai ,  Yoshirou Tooya

IPC分类号： H01L33/00 ,  H05B33/00

CPC分类号： H01L33/504 ,  F21S6/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/508 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0041 ,  H04N9/315 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light-emitting module (1) includes a substrate (10), a plurality of light-emitting elements (14) formed on the substrate (10), and phosphor layers (15) covering each of the light-emitting elements (14). Each of the phosphor layers (15) includes a first phosphor region (15a) and a second phosphor region (15b) that are divided in the direction substantially parallel to the surface of the substrate (10). Each of the first phosphor region (15a) and the second phosphor region (15b) includes a phosphor that absorbs light emitted from the light-emitting element (14) and emits fluorescence. The maximum peak wavelength of fluorescence emitted from the first phosphor region (15a) is longer than that of fluorescence emitted from the second phosphor region (15b).

摘要翻译： 发光模块（1）包括基板（10），形成在基板（10）上的多个发光元件（14）和覆盖每个发光元件（14）的荧光体层（15） 。 每个荧光体层（15）包括在与基板（10）的表面基本平行的方向上划分的第一荧光体区域（15a）和第二荧光体区域（15b）。 第一荧光体区域（15a）和第二荧光体区域（15b）中的每一个包括吸收从发光元件（14）发射的光并发出荧光的荧光体。 从第一荧光体区域（15a）发射的荧光的最大峰值波长比从第二荧光体区域（15b）发射的荧光的最大峰值波长长。

公开(公告)号：US07621654B2

公开(公告)日：2009-11-24

申请号：US10591081

申请日：2005-03-18

申请人： Keiji Nishimoto ,  Hideo Nagai

发明人： Keiji Nishimoto ,  Hideo Nagai

IPC分类号： F21V1/00

CPC分类号： H01L24/97 ,  F21K9/23 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00

摘要： The following explains an LED module that can achieve favorable light extraction efficiency without increasing a cost. An LED module (100) includes LED devices (110), an LED mounting module (120) on which the LED devices (110) are mounted, and a lens board (130) attached to a front surface of the LED mounting module (120). The LED mounting module (120) includes a printed wiring board (123) and a reflecting board (126). The printed wiring board (123) is an insulation board (122) on which a wiring pattern (124), used to mount the LED devices (110), is formed. The reflecting board (126) is made of a resin material, and has therein reflecting holes (126a) provided in correspondence with locations, on the printed wiring board (123), where the LED devices (110) are mounted. The reflecting board (126) and the printed wiring board (123) are directly adhered to each other at their surfaces that face each other.

摘要翻译： 以下说明能够在不增加成本的情况下实现良好的光提取效率的LED模块。 LED模块（100）包括LED装置（110），安装有LED装置（110）的LED安装模块（120），以及附接到LED安装模块（120）的前表面的透镜板 ）。 LED安装模块（120）包括印刷电路板（123）和反射板（126）。 印刷电路板（123）是形成用于安装LED器件（110）的布线图案（124）的绝缘板（122）。 反射板（126）由树脂材料制成，并且在其上安装有LED器件（110）的印刷电路板（123）上具有与位置对应设置的反射孔（126a）。 反射板（126）和印刷电路板（123）在彼此相对的表面上彼此直接粘接。

公开(公告)号：US20090140633A1

公开(公告)日：2009-06-04

申请号：US11995290

申请日：2006-10-27

申请人： Noriyasu Tanimoto ,  Hideo Nagai ,  Yoshirou Tooya

发明人： Noriyasu Tanimoto ,  Hideo Nagai ,  Yoshirou Tooya

IPC分类号： H01J1/62 ,  H01L33/00

CPC分类号： H01L33/504 ,  F21S6/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/508 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0041 ,  H04N9/315 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light-emitting module (1) includes a substrate (10), a plurality of light-emitting elements (14) formed on the substrate (10), and phosphor layers (15) covering each of the light-emitting elements (14). Each of the phosphor layers (15) includes a first phosphor region (15a) and a second phosphor region (15b) that are divided in the direction substantially parallel to the surface of the substrate (10). Each of the first phosphor region (15a) and the second phosphor region (15b) includes a phosphor that absorbs light emitted from the light-emitting element (14) and emits fluorescence. The maximum peak wavelength of fluorescence emitted from the first phosphor region (15a) is longer than that of fluorescence emitted from the second phosphor region (15b).

摘要翻译： 发光模块（1）包括基板（10），形成在基板（10）上的多个发光元件（14）和覆盖每个发光元件（14）的荧光体层（15） 。 每个荧光体层（15）包括在与基板（10）的表面基本平行的方向上划分的第一荧光体区域（15a）和第二荧光体区域（15b）。 第一荧光体区域（15a）和第二荧光体区域（15b）中的每一个包括吸收从发光元件（14）发射的光并发出荧光的荧光体。 从第一荧光体区域（15a）发射的荧光的最大峰值波长比从第二荧光体区域（15b）发射的荧光的最大峰值波长长。

公开(公告)号：US07420221B2

公开(公告)日：2008-09-02

申请号：US11570114

申请日：2005-09-01

申请人： Hideo Nagai

发明人： Hideo Nagai

IPC分类号： H01L33/00

CPC分类号： H01L33/505 ,  H01L24/24 ,  H01L24/97 ,  H01L33/20 ,  H01L33/22 ,  H01L33/385 ,  H01L33/44 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0091 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor light-emitting device includes: a semiconductor multilayer film, a substrate supporting the semiconductor multilayer film; and a phosphor layer formed on the substrate so as to cover the semiconductor multilayer film. The phosphor layer has an outer edge of a cross section taken in a direction parallel to the principal surface of the substrate having a substantially circular shape or a substantially regular polygonal shape having five or more sides. An outer edge of the principal surface of the substrate is formed in a substantially circular shape or a substantially regular polygonal shape having five or more sides. With this configuration, light obtained therefrom has less non-uniformity in color and a high luminous flux can be realized.

摘要翻译： 半导体发光器件包括：半导体多层膜，支撑半导体多层膜的衬底; 以及形成在所述基板上以覆盖所述半导体多层膜的荧光体层。 荧光体层具有沿着平行于具有大致圆形形状的基板的主表面的方向截取的横截面的外边缘或具有五边或更多边的基本上规则的多边形形状。 基板的主表面的外边缘形成为具有五个或更多个侧面的大致圆形或基本上规则的多边形形状。 利用这种结构，由此获得的光的颜色不均匀性较低，并且可以实现高光通量。