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46 条记录 (耗时 0.035 秒)

    Semiconductor package and module printed circuit board for mounting the same
    41.
    发明授权
    Semiconductor package and module printed circuit board for mounting the same 有权
    半导体封装和模块印刷电路板用于安装

    公开(公告)号：US07675176B2

    公开(公告)日：2010-03-09

    申请号：US11968035

    申请日：2007-12-31

    申请人： Chang-Yong Park ,  Kwang-Ho Chun ,  Dong-Chun Lee ,  Yong-Hyun Kim

    发明人： Chang-Yong Park ,  Kwang-Ho Chun ,  Dong-Chun Lee ,  Yong-Hyun Kim

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H05K1/111 ,  H01L2924/0002 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09845 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

    摘要： Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall. In this structure, the semiconductor package and the module PCB can have an excellent resistance to physical and thermal stresses to enhance structural reliability.

    摘要翻译： 提供了用于安装它的半导体封装和模块印刷电路板（PCB）。 半导体封装和模块PCB中的每一个包括衬底，设置在衬底的第一区域中的第一类型衬垫结构以及设置在封装衬底的第二区域中的第二类型衬垫结构。 第一型焊盘包括设置在封装衬底上的第一导电焊盘和涂覆在封装衬底上的第一绝缘层。 第一绝缘层具有第一开口，通过该第一开口，第一导电焊盘的侧壁的一部分被暴露，并且部分覆盖第一导电焊盘。 第二类型衬垫包括涂覆在封装衬底上以具有第二开口的第二绝缘层和设置在第二开口中的封装衬底上的具有暴露侧壁的第二导电焊盘。 在这种结构中，半导体封装和模块PCB可以具有优异的耐物理和热应力，以增强结构可靠性。

    Method and apparatus for inspecting an edge exposure area of a wafer
    42.
    发明授权
    Method and apparatus for inspecting an edge exposure area of a wafer 失效
    用于检查晶片的边缘曝光区域的方法和装置

    公开(公告)号：US07280233B2

    公开(公告)日：2007-10-09

    申请号：US10787765

    申请日：2004-02-27

    申请人： Koung-Su Shin ,  Sun-Yong Choi ,  Chung-Sam Jun ,  Dong-Chun Lee ,  Kwang-Jun Yoon

    发明人： Koung-Su Shin ,  Sun-Yong Choi ,  Chung-Sam Jun ,  Dong-Chun Lee ,  Kwang-Jun Yoon

    IPC分类号： G01B11/02 ,  G01B11/14 ,  G01B11/28 ,  G01N21/00

    CPC分类号： G01N21/9503 ,  G01N21/9501 ,  G01N21/9505

    摘要： For an automatic defect inspection of an edge exposure area of a wafer, an optical unit supplies a light beam onto the edge portion of a wafer and a detection unit detects light reflected from the edge portion. The detection unit converts the detected light into an electrical signal to transmit the electrical signal to a processing unit. The processing unit analyzes the electrical signal to measure the reflectivity of the edge portion, compares the measured reflectivity with a reference reflectivity, and calculates the width of the edge exposure area. The processing unit compares the calculated width with a reference width to detect any defect in the edge exposure area.

    摘要翻译： 为了对晶片的边缘曝光区域进行自动缺陷检查，光学单元将光束提供到晶片的边缘部分，并且检测单元检测从边缘部分反射的光。 检测单元将检测到的光转换为电信号，以将电信号传送到处理单元。 处理单元分析电信号以测量边缘部分的反射率，将测量的反射率与参考反射率进行比较，并计算边缘曝光区域的宽度。 处理单元将计算的宽度与参考宽度进行比较，以检测边缘曝光区域中的任何缺陷。

    OPTICAL INSPECTION TOOL HAVING LENS UNIT WITH MULTIPLE BEAM PATHS FOR DETECTING SURFACE DEFECTS OF A SUBSTRATE AND METHODS OF USING SAME
    43.
    发明申请
    OPTICAL INSPECTION TOOL HAVING LENS UNIT WITH MULTIPLE BEAM PATHS FOR DETECTING SURFACE DEFECTS OF A SUBSTRATE AND METHODS OF USING SAME 有权
    具有用于检测基板的表面缺陷的多个光束的透镜单元的光学检查工具及其使用方法

    公开(公告)号：US20070013901A1

    公开(公告)日：2007-01-18

    申请号：US11423677

    申请日：2006-06-12

    申请人： Jong-An Kim ,  Dong-Chun Lee ,  Chung-Sam Jun ,  Ik-Chul Kim ,  Sang-Hee Kim

    发明人： Jong-An Kim ,  Dong-Chun Lee ,  Chung-Sam Jun ,  Ik-Chul Kim ,  Sang-Hee Kim

    IPC分类号： G01N21/88

    CPC分类号： G01N21/9501 ,  G01N2021/8825

    摘要： An optical inspection tool used to detect surface defects of a substrate include a chuck for holding a substrate and a lens unit disposed over the chuck. The lens unit includes at least a pair of oblique beam paths therein, wherein light penetrating the beam paths travels without angular deflection. The beam paths take the form of spaces formed through the lens unit, or flat portions formed on a lens within the lens unit. A camera is installed on the lens unit, and the camera converts light passing through the lens unit into an image. Methods of detecting surface defects of the substrate using the inspection tool are also provided.

    摘要翻译： 用于检测基板的表面缺陷的光学检查工具包括用于保持基板的卡盘和设置在卡盘上方的透镜单元。 透镜单元在其中包括至少一对倾斜光束路径，其中穿透光束路径的光行进而没有角度偏转。 光束路径采取通过透镜单元形成的空间的形式，或形成在透镜单元内的透镜上的平坦部分。 相机安装在镜头单元上，相机将通过镜头单元的光转换为图像。 还提供了使用检查工具检测基板的表面缺陷的方法。

    Method and arrangement for attaching labels to semiconductor modules
    46.
    发明申请
    Method and arrangement for attaching labels to semiconductor modules 有权
    将标签贴在半导体模块上的方法和装置

    公开(公告)号：US20050000635A1

    公开(公告)日：2005-01-06

    申请号：US10882336

    申请日：2004-07-02

    申请人： Young-Soo Lee ,  Myung-Jong Eom ,  Byung-Man Kim ,  Dong-Chun Lee

    发明人： Young-Soo Lee ,  Myung-Jong Eom ,  Byung-Man Kim ,  Dong-Chun Lee

    IPC分类号： B65C9/06 ,  B65C1/02 ,  B65C1/04 ,  H01L23/544 ,  B32B31/00

    CPC分类号： B65C1/02 ,  B65C1/047 ,  Y10T156/1702 ,  Y10T156/1744 ,  Y10T156/1751 ,  Y10T156/1768

    摘要： A method and arrangement for attaching labels to a plurality of semiconductor modules arranged on a double-sided substrate is described which may shorten a process stream in an effort to reduce equipment costs. An exemplary arrangement may include at least one label attaching unit configured to attach labels to a plurality of semiconductor modules mounted on one of a first surface and a second surface of the double-sided substrate, and may include at least one turner configured to turn over the double-sided substrate to expose one of the first surface and second surface to the label attaching unit.

    摘要翻译： 描述了将标签附接到布置在双面基板上的多个半导体模块的方法和装置，其可以缩短工艺流以努力降低设备成本。 示例性布置可以包括至少一个标签附接单元，其被配置为将标签附接到安装在双面基板的第一表面和第二表面中的一个上的多个半导体模块，并且可以包括至少一个转盘，其被配置为翻转 所述双面基板将所述第一表面和所述第二表面中的一个暴露于所述标签附接单元。